The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty. With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available fast GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary.
上传时间： 2014-12-30
上传用户：aysyzxzm
Abstract: This application note helps system designers choose the correct external components for use with the MAX16948 dualremote antenna LDO/switch, thus ensuring that automobile-regulated phantom antenna supply and output-current-monitoring circuitrymeet performance objectives. An electronic calculator is provided that helps specify the critical external components for theMAX16948, thus reducing design time. The calculator also determines the device's analog output voltage, output current-limitthreshold, and output current-sensing accuracies. The calculator includes new automatic Step By Step feature that assists designerswith component choice. To use the new automatic feature, click on the Step By Step button relative to the desired section.
上传时间： 2013-11-04
上传用户：lhll918
Single-Ended and Differential S-Parameters Differential circuits have been important incommunication systems for many years. In the past,differential communication circuits operated at lowfrequencies, where they could be designed andanalyzed using lumped-element models andtechniques. With the frequency of operationincreasing beyond 1GHz, and above 1Gbps fordigital communications, this lumped-elementapproach is no longer valid, because the physicalsize of the circuit approaches the size of awavelength.Distributed models and analysis techniques are nowused instead of lumped-element techniques.Scattering parameters, or S-parameters, have beendeveloped for this purpose [1]. These S-parametersare defined for single-ended networks. S-parameterscan be used to describe differential networks, but astrict definition was not developed until Bockelmanand others addressed this issue [2]. Bockelman’swork also included a study on how to adapt single-ended S-parameters for use with differential circuits[2]. This adaptation, called “mixed-mode S-parameters,” addresses differential and common-mode operation, as well as the conversion betweenthe two modes of operation.This application note will explain the use of single-ended and mixed-mode S-parameters, and the basicconcepts of microwave measurement calibration.
上传时间： 2014-03-25
上传用户：yyyyyyyyyy
XRP7714是一款四输出脉宽调制（PWM）分级降压（step down）DC-DC控制器，并具有内置LDO提供待机电源。该器件在单个IC上为电池供电的产品提供了整套的电源管理方案，并且通过内含的I2C串行接口进行整体的编程配置
上传时间： 2013-11-01
上传用户：xiaohuanhuan
《西门子系列PLC原理及应用》共有8章，第1章介绍了PLC的基本组成与工作原理；第2章介绍了西门子S7-200系列PLC的构成、性能及其工作方式；第3章详细地介绍了S7-200系列PLC专用编程软件STEP 7-Micro/WIN的主要功能与使用方法；第4～5章，结合实例介绍S7-200系列PLC的基本命令与功能命令；第6章讲述了S7-200系列PLC的网络通信知识与命令；第7章讲述了PLC控制系统的总体设计方法，并由浅入深地介绍了8个控制系统设计实例；第8章介绍了西门子S7-200系列PLC的安装与维护。
上传时间： 2013-12-31
上传用户：stampede
MAXQUSBJTAGOW评估板软件:关键特性 Easily Load and Debug Code Interface Provides In-Application Debugging Features Step-by-Step Execution Tracing Breakpointing by Code Address, Data Memory Address, or Register Access Data Memory View and Edit Supports Logic Levels from 1.1V to 3.6V Supports JTAG and 1-Wire Protocols Each Adapter Has Its Own Unique Serial ID, Allowing Multiple Adapters to be Connected Without COM Port Conflicts Has In-Field Upgradable Capability if Firmware Needs to be Upgraded Enclosure Protects from Shorts and ESD
标签： MAXQUSBJTAGOW 评估板 软件
上传时间： 2013-10-24
上传用户：teddysha
MAXQUSBJTAGOW评估板软件:关键特性 Easily Load and Debug Code Interface Provides In-Application Debugging Features Step-by-Step Execution Tracing Breakpointing by Code Address, Data Memory Address, or Register Access Data Memory View and Edit Supports Logic Levels from 1.1V to 3.6V Supports JTAG and 1-Wire Protocols Each Adapter Has Its Own Unique Serial ID, Allowing Multiple Adapters to be Connected Without COM Port Conflicts Has In-Field Upgradable Capability if Firmware Needs to be Upgraded Enclosure Protects from Shorts and ESD
标签： MAXQUSBJTAGOW 评估板 软件
上传时间： 2013-11-23
上传用户：truth12
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
标签： Considerations Guidelines and Design
上传时间： 2013-11-09
上传用户：ls530720646
附件为：pdf转cad软件最新版 PDF Fly V7.1安装文件。还附有自制的Crack，把我的文件 贴到装好的目录下就行了!没有30天限制。 附pdf转cad软件使用教程： 1、pdf转cad软件的界面比较简单的，如下图，点击ADD添加你要转换的PDF文件，然后下一步 2、选择DXF格式，然后在右边的option里面还可以进行相关的设置 3、然后再下一步。step 3页面只要点最下面的 convert 就可以了 转完以后同样线条没有什么大问题的，只是文字肯定是被打碎的，你自己需要删除后重新输入要重新输入。
上传时间： 2013-10-22
上传用户：ardager
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
