2.7V to 5.5V input voltage Range Efficiency up to 96% 24V Boost converter with 12A switch current Limit 600KHz fixed Switching Frequency Integrated soft-start Thermal Shutdown Under voltage Lockout Support external LDO auxiliary power supply 8-Pin SOP-PP PackageAPPLICATIONSPortable Audio Amplifier Power SupplyPower BankQC 2.0/Type CWireless ChargerPOS Printer Power SupplySmall Motor Power Supply
标签： XR2981
上传时间： 2021-11-05
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ABSTRACTThe flyback power stage is a popular choice for single and multiple output dc-to-dc converters at powerlevels of 150 Watts or less. Without the output inductor required in buck derived topologies, such as theforward or push-pull converter, the component count and cost are reduced. This application note will reviewthe design procedure for the power stage and control electronics of a flyback converter. In these isolatedconverters, the error signal from the secondary still needs to cross the isolation boundary to achieveregulation. By using the UC3965 Precision Reference with Low Offset Error Amplifier on the secondaryside to drive an optocoupler and the UCC3809 Economy Primary Side Controller on the primary side, asimple and low cost 50 Watt isolated power supply is realized.
标签： 隔离
上传时间： 2021-11-24
上传用户：kingwide
基于FPGA设计的字符VGA LCD显示实验Verilog逻辑源码Quartus工程文件+文档说明,通过字符转换工具将字符转换为 8 进制 mif 文件存放到单端口的 ROM IP 核中，再从ROM 中把转换后的数据读取出来显示到 VGA 上，FPGA型号Cyclone4E系列中的EP4CE6F17C8，Quartus版本17.1。module top( input clk, input rst_n, //vga output output vga_out_hs, //vga horizontal synchronization output vga_out_vs, //vga vertical synchronization output[4:0] vga_out_r, //vga red output[5:0] vga_out_g, //vga green output[4:0] vga_out_b //vga blue );wire video_clk;wire video_hs;wire video_vs;wire video_de;wire[7:0] video_r;wire[7:0] video_g;wire[7:0] video_b;wire osd_hs;wire osd_vs;wire osd_de;wire[7:0] osd_r;wire[7:0] osd_g;wire[7:0] osd_b;assign vga_out_hs = osd_hs;assign vga_out_vs = osd_vs;assign vga_out_r = osd_r[7:3]; //discard low bit dataassign vga_out_g = osd_g[7:2]; //discard low bit dataassign vga_out_b = osd_b[7:3]; //discard low bit data//generate video pixel clockvideo_pll video_pll_m0( .inclk0 (clk ), .c0 (video_clk ));color_bar color_bar_m0( .clk (video_clk ), .rst (~rst_n ), .hs (video_hs ), .vs (video_vs ), .de (video_de ), .rgb_r (video_r ), .rgb_g (video_g ), .rgb_b (video_b ));osd_display osd_display_m0( .rst_n (rst_n ), .pclk (video_clk ), .i_hs (video_hs ), .i_vs (video_vs ), .i_de (video_de ), .i_data ({video_r,video_g,video_b} ), .o_hs (osd_hs ), .o_vs (osd_vs ), .o_de (osd_de ), .o_data ({osd_r,osd_g,osd_b} ));endmodule
上传时间： 2021-12-18
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基于FPGA设计的vga显示测试实验Verilog逻辑源码Quartus工程文件+文档说明，FPGA型号Cyclone4E系列中的EP4CE6F17C8，Quartus版本17.1。module top( input clk, input rst_n, //vga output output vga_out_hs, //vga horizontal synchronization output vga_out_vs, //vga vertical synchronization output[4:0] vga_out_r, //vga red output[5:0] vga_out_g, //vga green output[4:0] vga_out_b //vga blue );wire video_clk;wire video_hs;wire video_vs;wire video_de;wire[7:0] video_r;wire[7:0] video_g;wire[7:0] video_b;assign vga_out_hs = video_hs;assign vga_out_vs = video_vs;assign vga_out_r = video_r[7:3]; //discard low bit dataassign vga_out_g = video_g[7:2]; //discard low bit dataassign vga_out_b = video_b[7:3]; //discard low bit data//generate video pixel clockvideo_pll video_pll_m0( .inclk0(clk), .c0(video_clk));color_bar color_bar_m0( .clk(video_clk), .rst(~rst_n), .hs(video_hs), .vs(video_vs), .de(video_de), .rgb_r(video_r), .rgb_g(video_g), .rgb_b(video_b));endmodule
标签： fpga vga显示 verilog quartus
上传时间： 2021-12-19
上传用户：kingwide
1. Scope ......................................................................................................................................................................... 12. DDR4 SDRAM Package Pinout and Addressing ....................................................................................................... 22.1 DDR4 SDRAM Row for X4,X8 and X16 ................................................................................................................22.2 DDR4 SDRAM Ball Pitch........................................................................................................................................22.3 DDR4 SDRAM Columns for X4,X8 and X16 ..........................................................................................................22.4 DDR4 SDRAM X4/8 Ballout using MO-207......................................................................................................... 22.5 DDR4 SDRAM X16 Ballout using MO-207.............................................................................................................32.6 Pinout Description ..................................................................................................................................................52.7 DDR4 SDRAM Addressing.....................................................................................................................................73. Functional Description ...............................................................................................................................................83.1 Simplified State Diagram ....................................................................................................................................83.2 Basic Functionality..................................................................................................................................................93.3 RESET and Initialization Procedure .....................................................................................................................103.3.1 Power-up Initialization Sequence .............................................................................................................103.3.2 Reset Initialization with Stable Power ......................................................................................................113.4 Register Definition ................................................................................................................................................123.4.1 Programming the mode registers .............................................................................................................123.5 Mode Register ......................................................................................................................................................134. DDR4 SDRAM Command Description and Operation ............................................................................................. 244.1 Command Truth Table ..........................................................................................................................................244.2 CKE Truth Table ...................................................................................................................................................254.3 Burst Length, Type and Order ..............................................................................................................................264.3.1 BL8 Burst order with CRC Enabled .........................................................................................................264.4 DLL-off Mode & DLL on/off Switching procedure ................................................................................................274.4.1 DLL on/off switching procedure ...............................................................................................................274.4.2 DLL “on” to DLL “off” Procedure ..............................................................................................................274.4.3 DLL “off” to DLL “on” Procedure ..............................................................................................................284.5 DLL-off Mode........................................................................................................................................................294.6 Input Clock Frequency Change ............................................................................................................................304.7 Write Leveling.......................................................................................................................................................314.7.1 DRAM setting for write leveling & DRAM termination function in that mode ............................................324.7.2 Procedure Description .............................................................................................................................334.7.3 Write Leveling Mode Exit .........................................................................................................................34
标签： DDR4
上传时间： 2022-01-09
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高通蓝牙芯片QCC5051详细规格书共有117页，开发人员必备手册 支持蓝牙标准 5.2 ->Quad-core processor architecture ->High-performance programmable Bluetooth stereo audio Soc ->Low power modes to extend battery life. ->Flexible flash programmable platform. ->For wired/wirelss stereo heradsets/headphones application. ->For Qualcomm TrueWirless stereo earbuds application.主要特点如下
上传时间： 2022-01-24
上传用户：shjgzh
高通qualcommon蓝牙芯片QCC3056详细规格书共有112页，开发人员必备手册 支持蓝牙标准5.2 ->Quad-core processor architecture ->High-performance programmable Bluetooth mono audio Soc ->Low power modes to extend battery life. ->For Qualcomm TrueWirless stereo earbuds application.主要特点如下。
上传时间： 2022-01-24
上传用户：zhanglei193
Precision, Low Noise, CMOS, Rail-to-Rail, Input/Output Operational Amplifiers Data Sheet AD8605/AD8606/AD8608The AD8605, AD8606, and AD86081 are single, dual, and quad rail-to-rail input and output, single-supply amplifiers. They feature very low offset voltage, low input voltage and current noise, and wide signal bandwidth. They use the Analog Devices, Inc. patented DigiTrim® trimming technique, which achieves
标签： 运算放大器
上传时间： 2022-02-02
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STM32L053C8T6数据手册Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40 to 125 °C temperature range – 0.27 µA Standby mode (2 wakeup pins) – 0.4 µA Stop mode (16 wakeup lines) – 0.8 µA Stop mode + RTC + 8 KB RAM retention – 139 µA/MHz Run mode at 32 MHz – 3.5 µs wakeup time (from RAM) – 5 µs wakeup time (from Flash) • Core: ARM® 32-bit Cortex®-M0+ with MPU – From 32 kHz up to 32 MHz max. – 0.95 DMIPS/MHz • Reset and supply management – Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds – Ultralow power POR/PDR – Programmable voltage detector (PVD) • Clock sources – 1 to 25 MHz crystal oscillator – 32 kHz oscillator for RTC with calibration – High speed internal 16 MHz factory-trimmed RC (+/- 1%) – Internal low-power 37 kHz RC – Internal multispeed low-power 65 kHz to 4.2 MHz RC – PLL for CPU clock • Pre-programmed bootloader – USART, SPI supported • Development support – Serial wire debug supported • Up to 51 fast I/Os (45 I/Os 5V tolerant) • Memories – Up to 64 KB Flash with ECC – 8KB RAM – 2 KB of data EEPROM with ECC – 20-byte backup register
标签： stm32l053c8t6
上传时间： 2022-02-06
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The SI2302 uses advanced trench technology to provide excellent RDS(ON), low gate charge andoperation with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection orin other Switching application
标签： si2302
上传时间： 2022-02-11
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