讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求，应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点，它的发展趋势如何——这都是我们所要研究的高性能CCL发展趋势和重点的基本依据。而HDI多层板的技术发展，又是由它的应用市场——终端电子产品的发展所驱动（见图1）。 图1 在HDI多层板产业链中各类产品对下游产品的性能需求关系图 1．HDI多层板发展特点对高性能覆铜板技术进步的影响1.1 HDI多层板的问世，对传统PCB技术及其基板材料技术是一个严峻挑战20世纪90年代初，出现新一代高密度互连（High Density Interconnection，简称为 HDI）印制电路板——积层法多层板（Build—Up Multiplayer printed board，简称为 BUM）的最早开发成果。它的问世是全世界几十年的印制电路板技术发展历程中的重大事件。积层法多层板即HDI多层板，至今仍是发展HDI的PCB的最好、最普遍的产品形式。在HDI多层板之上，将最新PCB尖端技术体现得淋漓尽致。HDI多层板产品结构具有三大突出的特征：“微孔、细线、薄层化”。其中“微孔”是它的结构特点中核心与灵魂。因此，现又将这类HDI多层板称作为“微孔板”。HDI多层板已经历了十几年的发展历程，但它在技术上仍充满着朝气蓬勃的活力，在市场上仍有着前程广阔的空间。
上传时间： 2013-11-22
上传用户：gundan
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-12-20
上传用户：康郎
PCB设计问题集锦 问：PCB图中各种字符往往容易叠加在一起，或者相距很近，当板子布得很密时，情况更加严重。当我用Verify Design进行检查时，会产生错误，但这种错误可以忽略。往往这种错误很多，有几百个，将其他更重要的错误淹没了，如何使Verify Design会略掉这种错误，或者在众多的错误中快速找到重要的错误。 答：可以在颜色显示中将文字去掉,不显示后再检查;并记录错误数目。但一定要检查是否真正属于不需要的文字。 问： What’s mean of below warning:(6230,8330 L1) Latium Rule not checked: COMPONENT U26 component rule.答：这是有关制造方面的一个检查，您没有相关设定，所以可以不检查。 问： 怎样导出jop文件？答：应该是JOB文件吧？低版本的powerPCB与PADS使用JOB文件。现在只能输出ASC文件，方法如下STEP：FILE/EXPORT/选择一个asc名称/选择Select ALL/在Format下选择合适的版本/在Unit下选Current比较好/点击OK/完成然后在低版本的powerPCB与PADS产品中Import保存的ASC文件，再保存为JOB文件。 问： 怎样导入reu文件？答：在ECO与Design 工具盒中都可以进行，分别打开ECO与Design 工具盒，点击右边第2个图标就可以。 问： 为什么我在pad stacks中再设一个via:1(如附件）和默认的standardvi(如附件）在布线时V选择1，怎么布线时按add via不能添加进去这是怎么回事，因为有时要使用两种不同的过孔。答：PowerPCB中有多个VIA时需要在Design Rule下根据信号分别设置VIA的使用条件，如电源类只能用Standard VIA等等，这样操作时就比较方便。详细设置方法在PowerPCB软件通中有介绍。 问：为什么我把On-line DRC设置为prevent..移动元时就会弹出(图2),而你们教程中也是这样设置怎么不会呢?答：首先这不是错误,出现的原因是在数据中没有BOARD OUTLINE.您可以设置一个,但是不使用它作为CAM输出数据. 问：我用ctrl+c复制线时怎设置原点进行复制，ctrl+v粘帖时总是以最下面一点和最左边那一点为原点 答： 复制布线时与上面的MOVE MODE设置没有任何关系,需要在右键菜单中选择,这在PowerPCB软件通教程中有专门介绍. 问：用(图4)进行修改线时拉起时怎总是往左边拉起(图5)，不知有什么办法可以轻易想拉起左就左，右就右。答： 具体条件不明,请检查一下您的DESIGN GRID,是否太大了. 问： 好不容易拉起右边但是用(图6)修改线怎么改怎么下面都会有一条不能和在一起，而你教程里都会好好的(图8)答：这可能还是与您的GRID 设置有关,不过没有问题,您可以将不需要的那段线删除.最重要的是需要找到布线的感觉,每个软件都不相同,所以需要多练习。 问： 尊敬的老师:您好！这个图已经画好了，但我只对（如图1）一种的完全间距进行检查，怎么错误就那么多，不知怎么改进。请老师指点。这个图在附件中请老师帮看一下，如果还有什么问题请指出来，本人在改进。谢！！！！！答：请注意您的DRC SETUP窗口下的设置是错误的,现在选中的SAME NET是对相同NET进行检查,应该选择NET TO ALL.而不是SAME NET有关各项参数的含义请仔细阅读第5部教程. 问： U101元件已建好，但元件框的拐角处不知是否正确，请帮忙CHECK 答：元件框等可以通过修改编辑来完成。问： U102和U103元件没建完全，在自动建元件参数中有几个不明白：如：SOIC--》silk screen栏下spacing from pin与outdent from first pin对应U102和U103元件应写什么数值，还有这两个元件SILK怎么自动设置，以及SILK内有个圆圈怎么才能画得与该元件参数一致。 答：Spacing from pin指从PIN到SILK的Y方向的距离,outdent from first pin是第一PIN与SILK端点间的距离.请根据元件资料自己计算。
上传时间： 2013-10-07
上传用户：comer1123
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
上传时间： 2013-11-17
上传用户：squershop
Multiple-voltage electronics systems often requirecomplex supply voltage tracking or sequencing, whichif not met, can result in system faults or even permanentfailures in the fi eld. The design diffi culties in meetingthese requirements are often compounded in distributedpowerarchitectures where point-of-load (POL) DC/DCconverters or linear regulators are scattered across PCboard space, sometimes on different board planes. Theproblem is that power supply circuitry is often the lastcircuitry to be designed into the board, and it must beshoehorned into whatever little board real estate is left.Often, a simple, drop-in, fl exible solution is needed tomeet these requirements.
上传时间： 2013-10-08
上传用户：15071087253
Advancements in board assembly, PCB layout anddigital IC integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (POL) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new POL demands aredifficult to meet with traditional controller or regulatorICs, or power modules.
上传时间： 2014-12-24
上传用户：lbbyxmraon
Handheld designers often grapple with ways to de-bounceand control the on/off pushbutton of portable devices.Traditional de-bounce designs use discrete logic, fl ipflops, resistors and capacitors. Other designs includean onboard microprocessor and discrete comparatorswhich continuously consume battery power. For highvoltage multicell battery applications, a high voltageLDO is needed to drive the low voltage devices. All thisextra circuitry not only increases required board spaceand design complexity, but also drains the battery whenthe handheld device is turned off. Linear Technology addressesthis pushbutton interface challenge with a pairof tiny pushbutton controllers.
上传时间： 2013-11-18
上传用户：ZJX5201314
Piezoelectric motors are used in digital cameras for autofocus,zooming and optical image stabilization. Theyare relatively small, lightweight and effi cient, but theyalso require a complicated driving scheme. Traditionally,this challenge has been met with the use ofseparatecircuits, including a step-up converter and an oversizedgeneric full-bridge drive IC. The resulting high componentcount and large board space are especially problematicin the design of cameras for ever shrinking cell phones.The LT®3572 solves these problems by combining astep-up regulator and a dual full-bridge driver in a 4mm× 4mm QFN package. Figure 1 shows a typical LT3572Piezo motor drive circuit. A step-up converter is usedto generate 30V from a low voltage power source suchas a Li-Ion battery or any input power source within thepart’s wide input voltage range of 2.7V to 10V. The highoutput voltage of the step-up converter, adjustable upto 40V, is available for the drivers at the VOUT pin. Thedrivers operate in a full-bridge fashion, where the OUTAand OUTB pins are the same polarity as the PWMA andPWMB pins, respectively, and the OUTA and OUTB pinsare inverted from PWMA and PWMB, respectively. Thestep-up converter and both Piezo drivers have their ownshutdown control. Figure 2 shows a typical layout
上传时间： 2013-11-18
上传用户：hulee
Avalanche photo diode (APD) receiver modules arewidely used in fi ber optic communication systems. AnAPD module contains the APD and a signal conditioningamplifi er, but is not completely self contained. It stillrequires signifi cant support circuitry including a highvoltage, low noise power supply and a precision currentmonitor to indicate the signal strength. The challenge issqueezing this support circuitry into applications withlimited board space. The LT®3482 addresses this challengeby integrating a monolithic DC/DC step-up converter andan accurate current monitor. The LT3482 can supportup to a 90V APD bias voltage, and the current monitorprovides better than 10% accuracy over four decades ofdynamic range (250nA to 2.5mA).
上传时间： 2014-01-18
上传用户：wenyuoo
