本章详细介绍了基于ISE的FPGA设计流程以及多个辅助工具（XST、XPower、pace、ModelSim、Synplify以及MATLAB）的使用方法。首先介绍了ISE软件主要特性及其安装流程，然后介绍了如何通过ISE完成FPGA设计，
标签： ISE ModelSim Synplify XPower
上传时间： 2016-11-06
上传用户：mpquest
介绍一种多功能音乐播放器，它是以AT89S52单片机为核心，并辅有一些外围器件，采用汇编语言编写程序，实现多功能音乐播放，歌曲自动循环播放和使用琴键自编曲目功能。此外，彩灯显示歌曲节奏，按键跳转到喜爱曲目，液晶显示当前播英文曲目。并给出了系统软硬件设计。 Abstract: It introduces a multifunctional music player,taking AT89S52 single-chip microcomputer as hardware control core and using some peripheral elements.Programmes are compiled in assembly language to act as expected.There are two functional modes in this system.One is to make the music play automatically and consecutively,the other is to compose new songs through keys.In addition,lights show the pace of music and the English names can be displayed in the liquid crystal screen.With perfect combination of hardware and software,the music player can meet many music lovers’needs for multifunctional music player.And the hardware and software of the system are given.
上传时间： 2013-11-18
上传用户：xiaodu1124
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Web technology is not evolving in comfortable and incremental steps, but i s turbulent, erratic, and often rather uncomfortable. It is estimated that the Internet, arguably the most important part of the new technological environment, has expanded by about 2000 ％ and that is doubling in size every six to ten months. In recent years, the advance in computer and web technologies and the decrease in their cost have expanded the means available to collect and store data. As an intermediate consequence, the amount of information (Meaningful data) stored has been increasing at a very fast pace.
标签： comfortable incremental technology and
上传时间： 2015-11-05
上传用户：Shaikh
编写一个Java程序，设计一个运输工具类Transport，包含的成员属性有：速度pace、载重量load；汽车类Vehicle是Transport的子类，其中包含的属性有：车轮的个数wheels和车重weight；飞机Airplane类是Transport的子类其中包含的属性有：机型enginertype和发动机数量enginers。每个类都有相关所有数据的输出方法。
上传时间： 2016-11-16
上传用户：miaochun888
Use this resource to teach yourself Visual C# .NET version 2003, start developing Microsoft .NET–connected applications—one step at a time, master language fundamentals at your own pace and use the learn-by-doing exercises to dig in and code!
标签： developing NET Microsoft resource
上传时间： 2014-08-09
上传用户：jcljkh
The continued reduction of integrated circuit feature sizes and commensurate improvements in device performance are fueling the progress to higher functionality and new application areas. For example, over the last 15 years, the performance of microprocessors has increased 1000 times. Analog circuit performance has also improved, albeit at a slower pace. For example, over the same period the speed/resolution figure-of-merit of analog-to-digital converters improved by only a factor 10.
标签： Digitally Assisted Pipeline ADCs
上传时间： 2020-05-27
上传用户：shancjb
Without doubt, the age of information communications is upon 11s. The rapid pace of technological advancement in digital data communications can be wit- nessed in a multitude of applications in our day-to-day existence. In recent years, the widespread proliferation of wireless digital cornmunications hass been readily accepted by the general population worldwide; this is nearly unpa~rallcled in few other human scientific achievements in terms of scope and speed of devel- opment.
标签： Practical Wireless Design Modem Data
上传时间： 2020-05-31
上传用户：shancjb
Wireless communications and networking technology are advancing at a very rapid pace. Newer technologies and standards are evolving to serve the ever-increasing num- ber of users demanding different types of mobile applications and services. Research and development activities on wireless technology constitute one of the most impor- tant segments of research and development in the telecommunications area today.
标签： Management Resource Radio
上传时间： 2020-06-01
上传用户：shancjb
