The XL6003 regulator is fixed frequency PWM Boost (step-up) DC/DC converter, capable ofdriving 1050mA load current with excellent line and load regulation. The regulator is simple to use because it includes internal frequency compensation and a fixed-frequency oscillator so that it requires a minimum number of external components to work. The XL6003 could directly drive 5~10 3W LED units at VIN=12V.
上传时间： 2013-11-07
上传用户：xy@1314
The PCA82C250 and PCA82C251 are advanced transceiver products for use in automotive and general industrialapplications with transfer rates up to 1 Mbit/s. They support the differential bus signal representation beingdescribed in the international standard for in-vehicle CAN high-speed applications (ISO 11898). Controller AreaNetwork (CAN) is a serial bus protocol being primarily intended for transmission of control related data between anumber of bus nodes.
上传时间： 2013-11-24
上传用户：Alick
The PCA9516 is a BiCMOS integrated circuit intended forapplication in I2C and SMBus systems.While retaining all the operating modes and features of the I2Csystem, it permits extension of the I2C-bus by buffering both the data(SDA) and the clock (SCL) lines, thus enabling five buses of 400 pF.The I2C-bus capacitance limit of 400 pF restricts the number ofdevices and bus length. Using the PCA9516 enables the systemdesigner to divide the bus into five segments off of a hub where anysegment to segment transition sees only one repeater delay.
上传时间： 2013-11-21
上传用户：q123321
Luminary Micro provides an analog-to-digital converter (ADC) module on some members of theStellaris microcontroller family. The hardware resolution of the ADC is 10 bits; however, due to noiseand other accuracy-diminishing factors, the true accuracy is less than 10 bits. This application noteprovides a software-based oversampling technique, resulting in an improved Effective number OfBits (ENOB) in the conversion result. This document describes methods of oversampling an inputsignal, and the impact on precision and overall system performance.
标签： Oversampling Techniques ADC fo
上传时间： 2013-12-17
上传用户：zhyiroy
This document describes part number speciÞc changes to recommended operating conditions and revised electrical speciÞcations,as applicable, from those described in the generalMPC7400 Hardware SpeciÞcations.SpeciÞcations provided in this Part number SpeciÞcation supersede those in theMPC7400 Hardware SpeciÞcationsdated 9/99(order #: MPC7400EC/D) for these part numbers only; speciÞcations not addressed herein are unchanged. This document isfrequently updated, refer to the website at http://www.mot.com/SPS/PowerPC/ for the latest version.Note that headings and table numbers in this data sheet are not consecutively numbered. They are intended to correspond to theheading or table affected in the general hardware speciÞcation.Part numbers addressed in this document are listed in Table A. For more detailed ordering information see Table B.
上传时间： 2013-11-19
上传用户：qiaoyue
The 87C576 includes two separate methods of programming theEPROM array, the traditional modified Quick-Pulse method, and anew On-Board Programming technique (OBP).Quick Pulse programming is a method using a number of devicepins in parallel (see Figure 1) and is the traditional way in which87C51 family members have been programmed. The Quick-Pulsemethod supports the following programming functions:– program USER EPROM– verify USER EPROM– program KEY EPROM– program security bits– verify security bits– read signature bytesThe Quick-Pulse method is quite easily suited to standardprogramming equipment as evidenced by the numerous vendors of87C51 compatible programmers on the market today. Onedisadvantage is that this method is not well suited to programming inthe embedded application because of the large number of signallines that must be isolated from the application. In addition, parallelsignals from a programmer would need to be cabled to theapplication’s circuit board, or the application circuit board wouldneed to have logic built-in to perform the programming functions.These requirements have generally made in-circuit programmingusing the modified Quick Pulse method impractical in almost all87C51 family applications.
上传时间： 2013-10-21
上传用户：xiaozhiqban
This overview guide describes all the peripherals available for TMS320x28xx and TMS320x28xxx devices.Section 2 shows the peripherals used by each device. Section 3 provides descriptions of the peripherals.You can download the peripheral guide by clicking on the literature number, which is linked to the portable document format (pdf) file.
上传时间： 2013-11-21
上传用户：HGH77P99
CCStudio Platinum Edition is available in a number of ways. Existingcustomers who are up-to-date with their subscription service withTexas Instruments will receive their update automatically on a CD inthe mail. New customers who wish to purchase a copy of CCStudioPlatinum Edition can order TMDSCCSALL-1 starting May 23, 2005. A120-day Trial version will be also be available on CDROM startingJuly 11, 2005. Users may order the CDROM of the 120-day free copy
上传时间： 2014-12-28
上传用户：gououo
Abstract: There are many things to consider when designing a power supply for a field-programmablegate array (FPGA). These include (but are not limited to) the high number of voltage rails, and thediffering requirements for both sequencing/tracking and the voltage ripple limits. This application noteexplains these and other power-supply considerations that an engineer must think through whendesigning a power supply for an FPGA.
上传时间： 2013-11-10
上传用户：iswlkje
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
