The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
上传时间： 2014-01-17
上传用户：Altman
Today in many applications such as network switches, routers, multi-computers,and processor-memory interfaces, the ability to integrate hundreds of multi-gigabit I/Os is desired to make better use of the rapidly advancing IC technology.
上传时间： 2013-10-30
上传用户：ysjing
ARM通讯 H-JTAG 是一款简单易用的的调试代理软件，功能和流行的MULTI-ICE 类似。H-JTAG 包括两个工具软件：H-JTAG SERVER 和H-FLASHER。其中，H-JTAG SERVER 实现调试代理的功能，而H-FLASHER则实现了FLASH 烧写的功能。H-JTAG 的基本结构如下图1-1所示。 H-JTAG支持所有基于ARM7 和ARM9的芯片的调试，并且支持大多数主流的ARM调试软件，如ADS、RVDS、IAR 和KEIL。通过灵活的接口配置，H-JTAG 可以支持WIGGLER，SDT-JTAG 和用户自定义的各种JTAG 调试小板。同时，附带的H-FLASHER 烧写软件还支持常用片内片外FLASH 的烧写。使用H-JTAG，用户能够方便的搭建一个简单易用的ARM 调试开发平台。H-JTAG 的功能和特定总结如下： 1. 支持 RDI 1.5.0 以及 1.5.1； 2. 支持所有ARM7 以及 ARM9 芯片； 3. 支持 THUMB 以及ARM 指令； 4. 支持 LITTLE-ENDIAN 以及 BIG-ENDIAN； 5. 支持 SEMIHOSTING； 6. 支持 WIGGLER， SDT-JTAG和用户自定义JTAG调试板； 7. 支持 WINDOWS 9.X/NT/2000/XP； 8．支持常用FLASH 芯片的编程烧写； 9. 支持LPC2000 和AT91SAM 片内FLASH 的自动下载；
上传时间： 2014-12-01
上传用户：Miyuki
IP核生成文件：（Xilinx/Altera 同） IP核生成器生成 ip 后有两个文件对我们比较有用，假设生成了一个 asyn_fifo 的核，则asyn_fifo.veo 给出了例化该核方式（或者在 Edit－》Language Template-》COREGEN 中找到verilog/VHDL 的例化方式）。asyn_fifo.v 是该核的行为模型，主要调用了 xilinx 行为模型库的模块，仿真时该文件也要加入工程。（在 ISE中点中该核，在对应的 processes 窗口中运行“ View Verilog Functional Model ”即可查看该 .v 文件）。如下图所示。
上传时间： 2013-10-20
上传用户：lingfei
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
AXI Bus Functional Model v1.1 Product Brief.pdf
上传时间： 2015-01-01
上传用户：kbnswdifs
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 图Figure 1. Local Safety System
上传时间： 2013-11-14
上传用户：zoudejile
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
上传时间： 2013-11-10
上传用户：yy_cn
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上传时间： 2013-11-23
上传用户：kangqiaoyibie
