Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Field Programmable Gate Arrays (FPGAs) are becoming a critical part of every system design. Many vendors offer many different architectures and processes. Which one is right for your design? How do you design one of these so that it works correctly and functions as you expect in your entire system? These are the questions that this paper sets out to answer.
上传时间： 2013-10-29
上传用户：lixqiang
针对传统集成电路（ASIC）功能固定、升级困难等缺点，利用FPGA实现了扩频通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核实现NCO模块，在下变频模块调用了硬核乘法器并引入CIC滤波器进行低通滤波，给出了DQPSK解调的原理和实现方法，推导出一种简便的引入?仔/4固定相移的实现方法。采用模块化的设计方法使用VHDL语言编写出源程序，在Virtex-II Pro 开发板上成功实现了整个系统。测试结果表明该系统正确实现了STEL-2000A的核心功能。 Abstract: To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.
上传时间： 2013-11-06
上传用户：liu123
This book is for students and Linux System Administrators. It provides the skills to read, write, and debug Linux shell scripts using bash shell. The book begins by describing Linux and simple scripts to automate frequently executed commands and continues by describing conditional logic, user interaction, loops, menus, traps, and functions.
上传时间： 2014-12-30
上传用户：黄蛋的蛋黄
第一课 labview概述..................4 第一节 虚拟仪器（VI）的概念..4 第二节 labview的操作模板........6 工具模板（Tools Palette）.........6 控制模板(Controls Palette).........7 功能模板(functions Palette).......8 第三节 创建一个VI程序..........10 1. 前面板...10 框图程序..............11 从框图程序窗口创建前面板对象................12 4. 数据流编程...............12 第四节 程序调试技术................13 1. 找出语法错误...........13 2. 设置执行程序高亮...13 3. 断点与单步执行.......13 4. 探针.......14 第五节 练习1-1.....14 第六节 把一个VI程序作为子VI程序调用17 第七节 练习1-2.....18 第八节 练习1-3.....20 第九节 练习1-4.....22 第十节 练习1-5.....24 第二课 数据采集.......27 第一节 概述..........27 第二节 数据采集VI程序的调用方法..........29 第三节 模拟输入与输出............30 练习2-1...............31 第四节 波形的采集与产生........34 练习2-2...............35 第五节 扫描多个模拟输入通道.36 练习2-3...............36 第六节 连续数据采集................37 练习2-4...............38 第三课 仪器控制.......40 第一节 概述..........40 第二节 串行通讯....40 第三节 IEEE 488（GPIB）概述41 练习3-1...............43 第四节 VISA编程...44
上传时间： 2013-11-05
上传用户：nem567397
一篇长90页的PPT和10个左右的示例源程序，对于自学能力强且有一定计算机编程基础的人来说上手还是很快的。 •Understand the components of a Virtual Instrument •Introduce labview and common labview functions •Build a simple data acquisition application •Create a subroutine in labview
上传时间： 2013-11-21
上传用户：yeling1919
Abstract: High-speed and low-speed data converters serve critical functions in modern broadband mobile radios. This application note outlines how todetermine high-speed data converter performance requirements in baseband sampling radio architectures. Also, system partition strategies andadvantages are outlined when considering a high-speed analog front-end (AFE) solution.
上传时间： 2013-11-02
上传用户：jjj0202
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
上传时间： 2014-01-17
上传用户：Altman
使用Nios II紧耦合存储器教程 Chapter 1. Using Tightly Coupled Memory with the Nios II Processor Reasons for Using Tightly Coupled Memory . . . . . . . . . . . . . . . . . . . . . . . 1–1 Tradeoffs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1 Guidelines for Using Tightly Coupled Memory . . . .. . . . . . . . 1–2 Hardware Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 Software Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . 1–3 Locating functions in Tightly Coupled Memory . . . . . . . . . . . . . 1–3 Tightly Coupled Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 Dual Port Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . 1–5 Building a Nios II System with Tightly Coupled Memory . . . . . . . . . . . 1–5
上传时间： 2013-10-13
上传用户：黄婷婷思密达
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
