搜索：System-on-a-Chip
找到约 8 项符合「System-on-a-Chip」的查询结果
结果 8
https://www.eeworm.com/dl/692/477662.html
行业发展研究
C8051F340/1/2/3/4/5/6/7 devices are fully integrated mixed-signal System-on-a-Chip MCUs. Highlighted
C8051F340/1/2/3/4/5/6/7 devices are fully integrated mixed-signal System-on-a-Chip MCUs. Highlighted
features are listed below. Refer to Table 1.1 for specific product feature selection
https://www.eeworm.com/dl/944002.html
技术资料
电子设计竞赛培训
基于现场可编程门阵列（Field Programmable Gate
Array, FPGA）的SOPC（System-on-a-chip），包含嵌入
式的软核或硬核处理器、存储器和硬件加速器
https://www.eeworm.com/dl/900669.html
技术资料
基于ADSP-BF537的视频SOC验证方案设计
随着硅片集成技术的高速发展，片上系统SoC(system-on-a-Chip)已经成为现代数字系统设计的必然趋势。SoC和一般数字系统最主要的区别是前者在单一硅片内集成了独立的嵌入式CPU，必要的存储
https://www.eeworm.com/dl/566/35842.html
嵌入式综合
C8051F020数据手册
The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
https://www.eeworm.com/dl/fpga/doc/32374.html
教程资料
《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the dev ...
https://www.eeworm.com/dl/kbcluoji/39540.html
可编程逻辑
《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the dev ...
https://www.eeworm.com/dl/899115.html
技术资料
EFM8BB21F16G-C-QFN20R 芯片手册
With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the EFM8BB2 devices are truly standalonesystem-on-a-chip solutions. The flash memory is reprogrammable in-circuit, providing nonvolatile data storage and allowing field upgrades of the firm ...
https://www.eeworm.com/dl/566/35980.html
嵌入式综合
接口选择指南
LVDS、xECL、CML（低电压差分信号传输、发射级耦合逻辑、电流模式逻辑）………4多点式低电压差分信号传输(M-LVDS) ……………………………………………………8数字隔离器 ………………………………………………………………………………10RS-485/422 ……………………………………………………………… ...