Fluid Flow in Micron and Submicron Size Channels
Fluid Flow in Micron and Submicron Size Channels...
Fluid Flow in Micron and Submicron Size Channels...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
The emphasis of this book is on real-time application of Synopsys tools, used to combat various pro...
Electrostatic discharge (ESD) events can have serious detrimental effects&nb...
在互補式金氧半(CMOS)積體電路中,隨著量產製程的演進,元件的尺寸已縮減到深次微 米(deep-submicron)階段,以增進積體電路(IC)的性能及運算速度,以及降低每顆晶片的製造 成本。但隨著...
在互補式金氧半(CMOS)積體電路中,隨著量產製程 的演進,元件的尺寸已縮減到深次微米(deep-submicron)階 段,以增進積體電路(IC)的性能及運算速度,以及降低每 顆晶片的製造成本。但隨...