I2C interface, is a very powerful tool for system designers. Theintegrated protocols allow systems to be completely software defined.Software development time of different products can be reduced byassembling a library of reusable software modules. In addition, themultimaster capability allows rapid testing and alignment ofend-products via external connections to an assembly-line computer.The mask programmable 87LPC76X and its EPROM version, the87LPC76X, can operate as a master or a slave device on the I2Csmall area network. In addition to the efficient interface to thededicated function ICs in the I2C family, the on-board interfacefacilities I/O and RAM expansion, access to EEPROM andprocessor-to-processor communications.
标签： microcontro Using 76X LPC
上传时间： 2013-12-30
上传用户：Artemis
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
为满足无线网络技术具有低功耗、节点体积小、网络容量大、网络传输可靠等技术要求，设计了一种以MSP430单片机和CC2420射频收发器组成的无线传感节点。通过分析其节点组成，提出了ZigBee技术中的几种网络拓扑形式，并研究了ZigBee路由算法。针对不同的传输要求形式选用不同的网络拓扑形式可以尽大可能地减少系统成本。同时针对不同网络选用正确的ZigBee路由算法有效地减少了网络能量消耗，提高了系统的可靠性。应用试验表明，采用ZigBee方式通信可以提高传输速率且覆盖范围大，与传统的有线通信方式相比可以节约40%左右的成本。 Abstract: To improve the proposed technical requirements such as low-ower， small nodes， large capacity and reliable network transmission， wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and improved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate， cover more area and reduce 40% cost compared with traditional wired communications mode.
上传时间： 2013-10-09
上传用户：robter
针对UHF读写器设计中，在符合EPC Gen2标准的情况下，对标签返回的高速数据进行正确解码以达到正确读取标签的要求，提出了一种新的在ARM平台下采用边沿捕获统计定时器数判断数据的方法，并对FM0编码进行解码。与传统的使用定时器定时采样高低电平的FM0解码方法相比，该解码方法可以减少定时器定时误差累积的影响；可以将捕获定时器数中断与数据判断解码相对分隔开，使得中断对解码影响很小，实现捕获与解码的同步。通过实验表明，这种方法提高了解码的效率，在160 Kb/s的接收速度下，读取一张标签的时间约为30次/s。 Abstract: Aiming at the requirement of receiving correctly decoded data from the tag under high-speed communication which complied with EPC Gen2 standard in the design of UHF interrogator， the article introduced a new technology for FM0 decoding which counted the timer counter to judge data by using the edge interval of signal capture based on the ARM7 platform. Compared with the traditional FM0 decoding method which used the timer timed to sample the high and low level， the method could reduce the accumulation of timing error and could relatively separate capture timer interrupt and the data judgment for decoding， so that the disruption effect on the decoding was small and realizd synchronization of capture and decoding. Testing result shows that the method improves the efficiency of decoding， at 160 Kb/s receiving speed， the time of the interrogator to read a tag is about 30 times/s.
上传时间： 2013-11-10
上传用户：liufei
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
数字与模拟电路设计技巧IC与LSI的功能大幅提升使得高压电路与电力电路除外，几乎所有的电路都是由半导体组件所构成，虽然半导体组件高速、高频化时会有EMI的困扰，不过为了充分发挥半导体组件应有的性能，电路板设计与封装技术仍具有决定性的影响。 模拟与数字技术的融合由于IC与LSI半导体本身的高速化，同时为了使机器达到正常动作的目的，因此技术上的跨越竞争越来越激烈。虽然构成系统的电路未必有clock设计，但是毫无疑问的是系统的可靠度是建立在电子组件的选用、封装技术、电路设计与成本，以及如何防止噪讯的产生与噪讯外漏等综合考虑。机器小型化、高速化、多功能化使得低频/高频、大功率信号/小功率信号、高输出阻抗/低输出阻抗、大电流/小电流、模拟/数字电路，经常出现在同一个高封装密度电路板，设计者身处如此的环境必需面对前所未有的设计思维挑战，例如高稳定性电路与吵杂(noisy)性电路为邻时，如果未将噪讯入侵高稳定性电路的对策视为设计重点，事后反复的设计变更往往成为无解的梦魇。模拟电路与高速数字电路混合设计也是如此，假设微小模拟信号增幅后再将full scale 5V的模拟信号，利用10bit A/D转换器转换成数字信号，由于分割幅宽祇有4.9mV，因此要正确读取该电压level并非易事，结果造成10bit以上的A/D转换器面临无法顺利运作的窘境。另一典型实例是使用示波器量测某数字电路基板两点相隔10cm的ground电位，理论上ground电位应该是零，然而实际上却可观测到4.9mV数倍甚至数十倍的脉冲噪讯(pulse noise)，如果该电位差是由模拟与数字混合电路的grand所造成的话，要测得4.9 mV的信号根本是不可能的事情，也就是说为了使模拟与数字混合电路顺利动作，必需在封装与电路设计有相对的对策，尤其是数字电路switching时，ground vance noise不会入侵analogue ground的防护对策，同时还需充分检讨各电路产生的电流回路(route)与电流大小，依此结果排除各种可能的干扰因素。以上介绍的实例都是设计模拟与数字混合电路时经常遇到的瓶颈，如果是设计12bit以上A/D转换器时，它的困难度会更加复杂。
上传时间： 2014-02-12
上传用户：wenyuoo
半導體的產品很多，應用的場合非常廣泛，圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline Package SOP：Small Outline Package SOJ：Small Outline J-Lead Package PLCC：Plastic Leaded Chip Carrier QFP：Quad Flat Package PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導體元件真正的的核心，是包覆在膠體或陶瓷內一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內部的晶片，圖三是以顯微鏡將內部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當引發過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發光二極體，其內部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負極的腳上，經由銲線連接正極的腳。當LED通過正向電流時，晶片會發光而使LED發亮，如圖六所示。 半導體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產品，稱為IC封裝製程，又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節中將簡介這兩段的製造程序。
上传时间： 2013-11-04
上传用户：372825274
Abstract: The reality of modern, small form-factor ceramic capacitors is a good reminder to always readthe data sheet. This tutorial explains how ceramic capacitor type designations, such as X7R and Y5V,imply nothing about voltage coefficients. Engineers must check the data to know, really know, how aspecific capacitor will perform under voltage.
上传时间： 2013-11-04
上传用户：梧桐
JILRuntime A general purpose, register based virtual machine (VM) that supports object-oriented features, reference counting (auto destruction of data as soon as it is no longer used, no garbage collection), exceptions (handled in C/C++ or virtual machine code) and other debugging features. Objects and functions can be written in virtual machine code, as well as in C or C++, or any other language that can interface to C object code. The VM is written for maximum performance and thus is probably not suitable for embedded systems where a small memory footprint is required. Possible uses of the VM are in game development, scientific research, or to provide a stand-alone, general purpose programming environment.
标签： object-oriented JILRuntime register supports
上传时间： 2013-12-23
上传用户：cc1015285075
Client/Server版本 DBISAM compiles directly into your application with no external libraries required. Runtime package support is also provided if so desired. It has a very small footprint and does not require any forms support in Delphi 6, C++Builder 6, and Kylix 2 and higher, which helps keep the size of non-UI applications like services or web applications to a minimum.
标签： application libraries compiles directly
上传时间： 2015-04-04
上传用户：sz_hjbf
