PCI2.2规范,PCI Local Bus Specification Revision 2.2 December 18, 1998
标签: PCI2.2规范
上传时间: 2019-11-05
上传用户:songpenghai
High-Speed, Low-Power Dual Operational Amplifier The AD826 features high output current drive capability of 50 mA min per amp, and is able to drive unlimited capacitive loads. With a low power supply current of 15 mA max for both amplifiers, the AD826 is a true general purpose operational amplifier. The AD826 is ideal for power sensitive applications such as video cameras and portable instrumentation. The AD826 can operate from a single +5 V supply, while still achieving 25 MHz of band width. Furthermore the AD826 is fully specified from a single +5 V to ±15 V power supplies. The AD826 excels as an ADC/DAC buffer or active filter in data acquisition systems and achieves a settling time of 70 ns to 0.01%, with a low input offset voltage of 2 mV max. The AD826 is available in small 8-lead plastic mini-DIP and SO packages.
上传时间: 2020-04-19
上传用户:su1254
Mini SAS HD是高速传输可以达10GB速度
标签: MiniSAS
上传时间: 2020-06-11
上传用户:fyin01
-file /win8.vdf 镜像文件名,无此参数将搜索当前目录的iso镜像 -dev PciRoot(0x0)/Pci(0x1,0x1)/Ata(Primary,Master,0x0)/HD(3,MBR,0x9553A441,0xEFFF800,0x13FF800) 设备路径,无此参数默认为当前设备 -wait 50 启动前等待 -mem 将镜像载入内存, -type HD 可选CD HD FD,无此参数默认HD镜像类型,类型错了不能启动 -dev auto 搜索所有设备
上传时间: 2020-12-20
上传用户:
MPU6050六轴传感器模块技术资料包括模块原理图+-STM32F1程序源码+技术文档资料:MPU-6000 & MPU-6050 寄存器表及其描述(中文版).pdfMPU-6000 & MPU-6050产品说明书(中文版).pdfMPU-6000 and MPU-6050 Product Specification.pdfMPU-6000 and MPU-6050 Register Map and Descriptions.pdfMPU6050六轴传感器模块程序PZ-MPU6050六轴传感器模块原理图.pdfPZ-MPU6050六轴传感器模块开发手册--普中STM32F1开发板.pdf叉积法融合陀螺和加速度核心程序详解(圆点博士四轴).pdf姿态解算说明(Mini AHRS).pdf调试工具
上传时间: 2021-10-15
上传用户:qdxqdxqdxqdx
全志A20核心板配套开发底板Cadence原理图+ Pads2005格式PCB文件+转换后的AD格式原理图PCB文件:A20_DVK1_BASE_V16_Altium_Designer15.PcbDocA20_DVK1_BASE_V16_BOM_20151015.xlsxA20_DVK1_BASE_V16_Gerber制板文件.rarA20_DVK1_BASE_V16_PADS2005_PCB30.pcbA20_DVK1_BASE_V16_PADS2005_PCB_ASCII.PcbDocA20_DVK1_BASE_V16_PADS9.5.pcba20_dvk1_base_v16_SCH_20151015.pdfA20_DVK1_BASE_V16_元件位置查找图_20151102.pdfA20_DVK1_BASE_V16_原理图_OrCAD16.5.DSNA20_DVK1_BASE_V16_导出到AD格式的原理图和PCBA20_DVK1_BASE_V16_导出到AD格式的原理图和PCB.rarA20_DVK1_BASE_V16_顶层元件编号丝印图_20151102.pdfA20_DVK1_BASE_V16_顶层元件规格丝印图_20151102.pdf主要器件如下:Library Component Count : 58Name Description----------------------------------------------------------------------------------------------------ANTBATTERY_1BEAD CAPCAP NP 贴片电容,Y5V,6.3V,2.2uF,+80%-20%,0603CAP NP_2_Dup1 X5RCAP NP_Dup2 0402 1uF X5R 6.3V +/-10%CAP NP_Dup3 0402 1uF X5R 6.3V +/-10%CAPACITOR CAPACITOR POLCON1 CON12 CON3 CON4 CON50 CON6CON6A CONNECTOR45X4 C_Generic DB15-VGA_0 DIODE DIODE DUAL SERIESFM25CL64 FR9886SPGTR FUSEHOLDER_0 HDMI19_PLUG HEADER 2 INDUCTOR/SMINDUCTOR_4 C4K-2.5HINDUCTOR_Dup2 INDUCTOR_Dup3 IRM-2638LED_0M93C46_0 MINI USB-B_6 MODULE_CAM_PA0505 PH163539 PLAUSB-AF5P-WSMT_0 PUSHBUTTON_TSKB-2L_0PowerJACK R1 0805 R1_0805 RES2X4RESISTOR RESISTOR_Dup1 RESISTOR_Dup2 RESISTOR_V RJ45_8PGR_Generic S9013SMD_Dup2 SD_MMC_CARD2_0 TP_5 TestPoint_3TitleBlock_Gongjun USBPORT2 USB_WIFI_0 XC6204VZ_3 LDO 3.3V 300mA( SOT-25 )rRClamp0524P
上传时间: 2021-11-08
上传用户:
mini 5500MHz低通滤波器技术资料,带外抑制,插损指标。温度特性。封装尺寸
上传时间: 2021-11-12
上传用户:qdxqdxqdxqdx
常用接插件USB座 SD卡 TF卡 RJ45 AD集成库ALITUM库49个合集(原理图库+PCB封装库),集成封装库型号列表:Library Component Count : 49Name Description----------------------------------------------------------------------------------------------------3F07 立体声耳机插座6.3mm插簧 6.3mm插簧Battery 备份电池CON 2X16 DIN41612 DIN 41612CON 2X32 DIN41612 DIN 41612CON50A D Connector 15 VGAD Connector 9 串口DB25 并口DG141 DIMM-100 接插件EMIF 接插件FIN 散热片FPC-30P FPC排线连接器FPC-40P FPC排线连接器HR5803 以太网接口HR911103A 网络接口HR911105A 以太网接口Header 10 接插件Header 10X2 接插件Header 14X2A 接插件Header 15X2 接插件Header 16 接插件Header 16X2 接插件Header 17X2 接插件Header 2 接插件Header 2X2 接插件Header 3 接插件Header 30 接插件Header 32X2 接插件Header 4 接插件Header 40 接插件Header 5X2 接插件Header 6 接插件Header 7X2 接插件Header 8 接插件Header 8X2 接插件Header_AMP50 控制器接插件LCD_CON37 LCD接口Light_Pipe 灯柱PJ-306 立体声耳机插座PWRCON 直流电源端子RCA RCA Phono JackSDCARD SD卡自弹SDCARD-M TF卡槽SU-25-3 接线叉USB USB接口USB_M Micro/Mini USBZIF20 接插件
上传时间: 2021-11-21
上传用户:slq1234567890
PCI Express M.2 Specification Revision 1.1,PCIE规范标准,详细说明PCIE各信号所要遵守的协议标准。
标签: pcie
上传时间: 2021-11-27
上传用户:
STM32F429_F746_F767核心板+开发底板AD+PADS格式(原理图库+PCB封装库):核心板原理图库:Library Component Count : 28Name Description----------------------------------------------------------------------------------------------------2X28PIN_DIP3.0MM 40P-FPC-0.5BAT54CCJA1117B-3.3CRYSTAL_25MHZ_3225 C_0.1UF_0402 C_0.1UF_0603 C_10P_0402 C_10UF_0603 C_2.2UF_0402C_22P_0402 GZ1005D601TF IS42S16400J KEY_3X6 LED_BLUE_0603 LED_RED_0603 NC R_0R_0402 R_10K_0402R_1K_0402 R_2.2K_0402R_33R_0402STM32F767IGT6 USB_MICRO_DIP W25Q128FVSGXH2.54-5P XTAL_32.768KHZ核心板PCB库:Component Count : 18Component Name-----------------------------------------------2X28X2.54MM3.0MM_4.540P-FPC-0.532153225C_0603C_1206LED_0603LQFP176MICRO_USB_5SSC0402SOT-23SOT-89-3LSR0402SW3$2F$6-SMDTSOP-54W25Q128XH2.54-5P_NS开发板封装库:Component Count : 52Component Name-----------------------------------------------1_DIP1X2PIN_SMD2X6P_SMD2X19X2.54MM2X28X2.54MM3.0MM20PIN_2.54_DIP_BOT20PIN-JTAG06031206C3225AVX_B_3528-21BATERYBEEP-9.5X5.5C_0603C_1206CON_2PINDB9DC-005DIODE_SOPDO-214EC_47UF_6.5X6.5EC_220UF_6.5X6.5EMW1062GDCD4532HDR1X3HDR1X4LED_0603LED_RGB_5MMMAX485MAX3232MIC_6X2.2PJ-3001SQFN24QFN24AQFN32R_0603R-3X3R5MMRJ45RT7272SOP8SOP16SOT-23SOT-353SW6.2$2F$6.2-DIPASW13_6TF_CARDTO-252-2LUSB-AF90USB-MINIXTAL_SMD
上传时间: 2021-12-08
上传用户: