The PCA9670 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9670 is a drop-in upgrade for the PCF8574 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(200 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time andmore device addresses (64 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-15
上传用户：stella2015
The PCA9671 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plus(Fm+) family.The PCA9671 is a drop in upgrade for the PCF8575 providing higher I2C-bus speeds(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higherI2C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus withoutthe need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) thatsupports having all 25 mA LEDs on at the same time and more device addresses (64versus 8) to allow many more devices on the bus without address conflicts.
上传时间： 2013-10-12
上传用户：laomv123
The PCA9672 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9672 is a drop-in upgrade for the PCF8574 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(200 mA versus 100 mA) that supports having all LEDs on at the same time and moredevice addresses (16 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-23
上传用户：jasonheung
The PCA9673 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9673 is a drop in upgrade for the PCF8575 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(400 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time andmore device addresses (16 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-29
上传用户：wkchong
The PCA9674/74A is a drop-in upgrade for the PCF8574/74A providing higher Fast-modePlus I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(200 mA versus 100 mA) that supports having all LEDs on at the same time and moredevice addresses (64 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-22
上传用户：wwwwwen5
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
在车载自组网中，路由协议很大程度上决定了整个网络的性能。如何有效的利用车流信息提高传输质量是改善路由性能的一个关键问题。本文基于速度-密度线性模型，提出了一种实时车流密度的路由协议RVDR（Real-time Vehicle Density Routing）。该协议通过与邻居节点交换的速度信息，对相关道路车流密度进行预测，并给出基于车流密度信息的路径选择方法。仿真结果表明，与现有协议相比，RVDR协议在实时性和高效性等性能方面得到改进。
上传时间： 2014-07-10
上传用户：ZJX5201314
When I started writing the first edition of RF Power Amplifiers for Wireless Communications,some time back in 1997, it seemed that I was roaming a largely uninhabitedlandscape. For reasons still not clear to me there were few, if any, otherbooks dedicated to the subject of RF power amplifiers. Right at the same time, however,hundreds of engineers were being assigned projects to design PAs for wirelesscommunications products. It was not, therefore, especially difficult to be successfulwith a book that was fortuitously at the right place and the right time.
标签： Communications Amplifiers Wireless Edition
上传时间： 2013-11-12
上传用户：YYRR
多维多选择背包问题(MMKP)是0-1背包问题的延伸，背包核已经被用来设计解决背包问题的高效算法。目的是研究如何获得一种背包核，并以此高效处理多维多选择背包问题。首先给出了一种方法确定MMKP的核，然后阐述了利用核精确解决MMKP问题的B&B算法，列出了具体的算法步骤。在分析了算法的存储复杂度后，将算法在各种实例上的运行效果与目前解决MMKP问题的常用算法的运行效果进行了比较，发现本文的算法性能优于以往任何算法。
上传时间： 2013-11-20
上传用户：wangw7689
ExpressPCB 是一款免费的PCB设计软件，简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit boards is simple for the beginner and efficient for the professional. Our board manufacturing service makes top quality two and four layer PCBs. Use our MiniBoard service and pay only $51 for three boards (plus $8 shipping).
标签： ExpressPCB PCB 设计软件
上传时间： 2013-11-15
上传用户：lchjng
