Abstract: Build a composite amplifier featuring high gain, wide bandwidth, good DC accuracy and low distortion
上传时间： 2014-12-23
上传用户：JasonC
Photodiodes can be broken into two categories: largearea photodiodes with their attendant high capacitance(30pF to 3000pF) and smaller area photodiodes withrelatively low capacitance (10pF or less). For optimalsignal-to-noise performance, a transimpedance amplifi erconsisting of an inverting op amp and a feedback resistoris most commonly used to convert the photodiode currentinto voltage. In low noise amplifi er design, large areaphotodiode amplifi ers require more attention to reducingop amp input voltage noise, while small area photodiodeamplifi ers require more attention to reducing op amp inputcurrent noise and parasitic capacitances.
上传时间： 2013-10-28
上传用户：hanbeidang
The 14-bit LTC2351-14 is a 1.5Msps, low power SARADC with six simultaneously sampled differential inputchannels. It operates from a single 3V supply and featuressix independent sample-and-hold amplifi ers and a singleADC. The single ADC with multiple S/HAs enables excellentrange match (1mV) between channels and channel-tochannelskew (200ps).
上传时间： 2014-12-23
上传用户：天诚24
Recent advances in low voltage silicon germaniumand BiCMOS processes have allowed the design andproduction of very high speed amplifi ers. Because theprocesses are low voltage, most of the amplifi er designshave incorporated differential inputs and outputs to regainand maximize total output signal swing. Since many lowvoltageapplications are single-ended, the questions arise,“How can I use a differential I/O amplifi er in a single-endedapplication?” and “What are the implications of suchuse?” This Design Note addresses some of the practicalimplications and demonstrates specifi c single-endedapplications using the 3GHz gain-bandwidth LTC6406differential I/O amplifi er.
上传时间： 2013-11-23
上传用户：rocketrevenge
This application note describes a Linear Technology "Half-Flash" A/D converter, the LTC1099, being connected to a 256 element line scan photodiode array. This technology adapts itself to handheld (i.e., low power) bar code readers, as well as high resolution automated machine inspection applications..
上传时间： 2013-11-21
上传用户：lchjng
Low power operation of electronic apparatus has becomeincreasingly desirable. Medical, remote data acquisition,power monitoring and other applications are good candidatesfor battery driven, low power operation. Micropoweranalog circuits for transducer-based signal conditioningpresent a special class of problems. Although micropowerICs are available, the interconnection of these devices toform a functioning micropower circuit requires care. (SeeBox Sections, “Some Guidelines for Micropower Designand an Example” and “Parasitic Effects of Test Equipmenton Micropower Circuits.”) In particular, trade-offs betweensignal levels and power dissipation become painful whenperformance in the 10-bit to 12-bit area is desirable.
上传时间： 2013-10-22
上传用户：rocketrevenge
ANALOG INPUT BANDWIDTH is a measure of the frequencyat which the reconstructed output fundamental drops3 dB below its low frequency value for a full scale input. Thetest is performed with fIN equal to 100 kHz plus integer multiplesof fCLK. The input frequency at which the output is −3dB relative to the low frequency input signal is the full powerbandwidth.APERTURE JITTER is the variation in aperture delay fromsample to sample. Aperture jitter shows up as input noise.APERTURE DELAY See Sampling Delay.BOTTOM OFFSET is the difference between the input voltagethat just causes the output code to transition to the firstcode and the negative reference voltage. Bottom Offset isdefined as EOB = VZT–VRB, where VZT is the first code transitioninput voltage and VRB is the lower reference voltage.Note that this is different from the normal Zero Scale Error.CONVERSION LATENCY See PIPELINE DELAY.CONVERSION TIME is the time required for a completemeasurement by an analog-to-digital converter. Since theConversion Time does not include acquisition time, multiplexerset up time, or other elements of a complete conversioncycle, the conversion time may be less than theThroughput Time.DC COMMON-MODE ERROR is a specification which appliesto ADCs with differential inputs. It is the change in theoutput code that occurs when the analog voltages on the twoinputs are changed by an equal amount. It is usually expressed in LSBs.
上传时间： 2013-11-12
上传用户：pans0ul
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-10-22
上传用户：pei5
Abstract: There are differences between the operation of low-frequency AC transformers and electronic transformersthat supply current to MR16 lamps, and there are also differences in the current draw for MR16 halogen lamps andMR16 LED lamps. These contrasts typically prevent an MR16 LED lamp from operating with most electronictransformers. This article explains how a high-brightness (HB) LED driver optimized for MR16 lamps will allow LEDlamps to be compatible with most electronic transformers.A similar version of this article appeared on Display Plus, July 7, 2012 and in German in Elektronikpraxis, October 1,2012.
上传时间： 2013-10-14
上传用户：playboys0
A light-emitting diode (LED) is a semiconductor device that emits narrow-spectrum incoherent light when forward-biased.The color of the emitted light depends on the chemical composition of the semiconductor material used, and can benear-ultraviolet, visible or infrared. LEDs are more prevalent today than ever before, replacing traditional incandescent andfluorescent bulbs in many lighting applications. Incandescents use a heated filament, are subject to breakage and burnoutand operate at a luminous efficiency of 2% to 4%. Fluorescents are more efficient, at 7% to 12%, but require highdrive voltage and contain mercury, a toxic substance that may be eventually banned in certain countries. LEDs, however,produce light directly through electroluminescence, operate at low voltage and can deliver over 20% luminous efficiency.
上传时间： 2013-11-07
上传用户：xiaoyuer
