Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf
Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf...
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查看全部834个资源 »AN2586_stm32硬件开发入门
This application note is intended for system designers who require a hardware implementation overview of the development board features such as the p...
多层印制板设计基本要领
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。【关键词】印制电路板；表面贴装器件；高密度互连；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High ...
高性能覆铜板的发展趋势及对环氧树脂性能的新需求
讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求，应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点，它的发展趋势如何——这都是我们所要研究的高性能CCL发展趋势和重点的基本依据。而HDI多层板的技术发展，又是由它的...
LLCR Pin Socket Testing with t
LLCR Pin Socket Testing with the Model 3732 High Density Matrix Card Computer processors (CPUs) today have come a long way from the computer processor...
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