Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf
Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf...
Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf...
This application note is intended for system designers who require a hardware implementation overvi...
【摘要】本文结合作者多年的印制板设计经验,着重印制板的电气性能,从印制板稳定性、可靠性方面,来讨论多层印制板设计的基本要求。【关键词】印制电路板;表面贴装器件;高密度互连;通孔【Key words】P...
讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求,应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点,它的发展趋势如...
LLCR Pin Socket Testing with the Model 3732 High Density Matrix Card Computer processors (CPUs) toda...
The AT89C52 is a low-power, high-performance CMOS 8-bit microcomputer with 8Kbytes of Flash programm...
HDB3(High Density Bipolar三阶高密度双极性)码是在AMI码的基础上改进的一种双极性归零码,它除具有AMI码功率谱中无直流分量,可进行差错自检等优点外,还克服了AMI码当信息中出...
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital...
HDB3(High Density Bipolar三阶高密度双极性)码是在AMI码的基础上改进的一种双极性归零码,它除具有AMI码功率谱中无直流分量,可进行差错自检等优点外,还克服了AMI码当信息中出...
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital...