多层印制板设计基本要领
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。【关键词】印制电路板；表面贴装器件；高密度互连；通孔【Key words】P...
High-Density技术资料
📦 资源总数：834
💻 源代码：16403
📚 High-Density全部资料 (834个)
高性能覆铜板的发展趋势及对环氧树脂性能的新需求
讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求，应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点，它的发展趋势如...
16 relay output channels and 16 isolated digital input channels LED indicators to show activated
16 relay output channels and 16 isolated digital input channels LED indicators to show activated ...
The Cyclone® III PCI development board provides a hardware platform for developing and prototypi
The Cyclone® III PCI development board provides a hardware platform for developing and prototypi...
Behavioral models are used in games and computer graphics for realistic simulation of massive crowd
Behavioral models are used in games and computer graphics for realistic simulation of massive crowd...
MPO与MTP接插件的定义与区别
The CommScope InstaPATCH® 360 and ReadyPATCH® solutions utilize a standards-compliant multi-fiber co...
贴片铝电解电容封装库
贴片铝电解电容封装库 SMD Aluminum Electrolytic Capacitors VE Features ‧ 3 ~ 16φ, 85℃, 2,000 hours assured...
WBA_FullIndustryReport
With billions of ‘people and things’ becoming increasingly connected, the need to combine the potent...
Chemical mechanical polishing
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of m...
Achieving High Power Density Designs
Achieving High Power Density Designs...