STM32 F0系列 MCU 集成库 原理图库 PCB封装库文件CSV text has been written to file : STM32 F0.csvLibrary Component Count : 17Name DESCRIPTION----------------------------------------------------------------------------------------------------STM32F050C4T6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F050C6T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F050C6T6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F050K4U6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F050K6U6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051C4T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F051C6T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F051C8T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F051K4U6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051K6U6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051K8U6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051R4T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, TraySTM32F051R4T6TR ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, Tape and ReelSTM32F051R6T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, TraySTM32F051R8T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, TraySTM32F051R8T7 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 55 High Current I/Os, -40 to +105癈, 64-Pin LQFP, TraySTM32F051R8TR ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 55 High Current I/Os, -40 to +105癈, 64-Pin LQFP, Tape and Reel
上传时间： 2022-04-30
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STC系列单片机89C51系列 MCU Altium AD 原理图库 器件库文件,CSV text has been written to file : 2.8 - STC系列单片机.csvLibrary Component Count : 56Name DESCRIPTION----------------------------------------------------------------------------------------------------IAP15F2K61S STC单片机IAP15L2K61S STC单片机IAP15W1K29S STC单片机IAP15W413AS-20pin STC单片机IAP15W413AS-28pin STC单片机IAP15W413S STC单片机IAP15W413S-32pin STC单片机IAP15W413S-44pin STC单片机STC11F02E STC单片机STC12C520xAD-16pin STC带AD单片机STC12C520xAD-18pin STC带AD单片机STC12C520xAD-20pin STC带AD单片机STC12C520xAD-28pin STC带AD单片机STC12C520xAD-32pin STC带AD单片机STC12C5AxxS2-44pin STC单片机STC12Cx052 STC单片机STC12Cx052AD STC带AD单片机STC12LEx052 STC单片机STC12LEx052AD STC带AD单片机STC15F100W STC单片机STC15F101W STC单片机STC15F102W STC单片机STC15F103W STC单片机STC15F104W STC单片机STC15F105W STC单片机STC15F204EA 20pin STC单片机STC15F2K60S2-40pin STC单片机STC15F2K60S2-44pin STC单片机STC15W10x STC单片机STC15W1K08PWM-28pin STC单片机STC15W1K16S STC单片机STC15W20xS-16pin STC单片机STC15W20xS-8pin STC单片机STC15W404S STC单片机STC15W408S STC单片机STC15W40xAS-16pin STC单片机STC15W40xAS-20pin STC单片机STC15W40xAS-28pin STC单片机STC15W40xS-28pin STC单片机STC15W40xS-32pin STC单片机STC15W40xS-44pin STC单片机STC89C516RD+ STC单片机STC89C51RC STC单片机STC89C52RC STC单片机STC89C53RC STC单片机STC89C54RD+ STC单片机STC89C58RD+ STC单片机STC89C5xx STC单片机STC90C51 STC单片机STC90C516RD+ STC单片机STC90C51RC STC单片机STC90C52 STC单片机STC90C52RC STC单片机STC90C53RC STC单片机STC90C54RD+ STC单片机STC90C58RD+ STC单片机
上传时间： 2022-04-30
上传用户：jason_vip1
STM8L全系列MCU AD ALTIUM 集成库 原理图库 PCB封装库文件-79个芯片器件型号列表：Library Component Count : 79Name DESCRIPTION----------------------------------------------------------------------------------------------------STM8L101F2P3 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F2P6 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F2P6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, Tape and ReelSTM8L101F2U6A STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tube, COMP_REF availableSTM8L101F2U6ATR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and Reel, COMP_REF availableSTM8L101F2U6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and ReelSTM8L101F3P3 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +125癈 Temperature, 20-pin TSSOP, TubeSTM8L101F3P6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F3U6ATR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and Reel, COMP_REF availableSTM8L101F3U6TR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and ReelSTM8L101G2U6 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, TraySTM8L101G2U6A STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tray, COMP_REF availableSTM8L101G2U6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tape and ReelSTM8L101G3U6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, TraySTM8L101G3U6A STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tray, COMP_REF availableSTM8L101K3T3 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +125癈 Temperature, 32-pin LQFP, TraySTM8L101K3T6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin LQFP, TraySTM8L101K3U6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin UFQFPN, TraySTM8L101K3U6TR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin UFQFPN, Tape and ReelSTM8L151C4T3 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6BGT STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6TR STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, Tape and ReelSTM8L151C4U6 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM8L151C6T3 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C6T6 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C6U6 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM8L151C8 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, 48-pin LQFPSTM8L151C8T3 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C8T3TR STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, Tape and ReelSTM8L151C8T6 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C8T7 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +105癈 Temperature, 48-pin LQFP, TraySTM8L151C8U6 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +85癈
上传时间： 2022-05-02
上传用户：bluedrops
美国呼吸机资料Medtronic PB560
上传时间： 2022-05-25
上传用户：kingwide
Medtronic PB560 Ventilator System – Release 3.0 (.zip)Includes:Source code filesPermissive license
标签： 呼吸机
上传时间： 2022-05-25
上传用户：ttalli
DESCRIPTIONThe IMX385LQR-C is a diagonal 8.35 mm (Type 1/2) CMOS active pixel type solid-state image sensor with a squarepixel array and 2.13 M effective pixels. This chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V triplepower supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved throughthe adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variablecharge-integration time.(Applications: Surveillance cameras)
标签： CMOS传感器 IMX385LQR-C
上传时间： 2022-06-18
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sony CMOS传感器datasheet，IMX178LQJ-C_Data_SheetDESCRIPTIONThe IMX178LQJ-C is a diagonal 8.92 mm (Type 1/1.8) CMOS active pixel type image sensor with a square pixelarray and 6.44 M effective pixels. This chip operates with analog 2.9 V, digital 1.2 V and interface 1.8 V triple powersupply, and has low power consumption.High sensitivity, low dark current and no smear are achieved through the adoption of R, G and B primary colormosaic filters.This chip features an electronic shutter with variable charge-integration time.(Applications: Surveillance cameras, FA cameras, Industrial cameras)
标签： CMOS传感器 IMX178LQJ-C
上传时间： 2022-06-18
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1. General DESCRIPTION BL-M3362NS1 product is designed base on Broadcom BCM43362 chipset. It operates at 2.4GHz band and supports IEEE802.11b/g/n 1T1Rwith wireless data rate up to 72.2Mbps. It supports IEEE802.11isafety protocol, along with IEEE802.11e standard service quality. It supports standard interfaces SDIOV2.0(50 MHz,4-bit and1-bit) and generic SPI(up to 50 MHz), Integrated ARM Cortex?-M3 CPUwith on-chip memory enables running IEEE802.11 firmware that can be field-upgraded with future features.2. The range of applying Imaging platforms(printers, digital still cameras, digital picture frames)Consumer electronic devices(DTV, DVDplayers, Blu-ray players. etc.)Gaming platforms Carinformation MiFi/Mobile Routes Smart PAD Set-TopBoxes
标签： wifi
上传时间： 2022-07-04
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IEEE1149.1的产生1985年由IBM、AT&T、Texas Instruments、Philips Electronics NV、Siemens、Alcatel和Ericsson等公司成立的JETAG（Joint European Test Action Group）提出了边界扫描技术。1986年由于其它地区的一些公司的加入，JETAG改名为JTAG。1988年JTAG提出了标准的边界扫描体系结构，名称叫Boundary-Scan Architecture Standard Proposal，Version2.0，1990年IEEE正式承认了JTAG标准，经过补充和修订以后命名命名为IEEE1149.1-90。同年又提出了BSDL（Boundary Scan DESCRIPTION Lauguage，边界扫描描述语言）。后来成为IEEE1149.1-93标准的一部分。
标签： jtag
上传时间： 2022-07-06
上传用户：canderile
PrefaceDuring the past years, there has been a quickly rising interest in radio access technologies for providingmobile as well as nomadic and fixed services for voice, video, and data. The difference indesign, implementation, and use between telecom and datacom technologies is also becoming moreblurred. One example is cellular technologies from the telecom world being used for broadband dataand wireless LAN from the datacom world being used for voice-over IP.Today, the most widespread radio access technology for mobile communication is digital cellular,with the number of users passing 5 billion by 2010, which is more than half of the world’s population.It has emerged from early deployments of an expensive voice service for a few car-borne users,to today’s widespread use of mobile-communication devices that provide a range of mobile servicesand often include camera, MP3 player, and PDA functions. With this widespread use and increasinginterest in mobile communication, a continuing evolution ahead is foreseen.This book describes LTE, developed in 3GPP (Third Generation Partnership Project) and providingtrue 4G broadband mobile access, starting from the first version in release 8 and through the continuingevolution to release 10, the latest version of LTE. Release 10, also known as LTE-Advanced,is of particular interest as it is the major technology approved by the ITU as fulfilling the IMTAdvancedrequirements. The DESCRIPTION in this book is based on LTE release 10 and thus provides acomplete DESCRIPTION of the LTE-Advanced radio access from the bottom up.Chapter 1 gives the background to LTE and its evolution, looking also at the different standardsbodies and organizations involved in the process of defining 4G. It also gives a discussion of the reasonsand driving forces behind the evolution.Chapters 2–6 provide a deeper insight into some of the technologies that are part of LTE and itsevolution. Because of its generic nature, these chapters can be used as a background not only for LTEas described in this book, but also for readers who want to understand the technology behind othersystems, such as WCDMA/HSPA, WiMAX, and CDMA2000.Chapters 7–17 constitute the main part of the book. As a start, an introductory technical overviewof LTE is given, where the most important technology components are introduced based onthe generic technologies described in previous chapters. The following chapters provide a detailedDESCRIPTION of the protocol structure, the downlink and uplink transmission schemes, and the associatedmechanisms for scheduling, retransmission and interference handling. Broadcast operation andrelaying are also described. This is followed by a discussion of the spectrum flexibility and the associated
上传时间： 2022-07-08
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