第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
上传用户：aa7821634
题目：利用条件运算符的嵌套来完成此题：学习成绩>=90分的同学用A表示，60-89分之间的用B表示，60分以下的用C表示。 1.程序分析：(a>b)?a:b这是条件运算符的基本例子。
上传时间： 2015-01-08
上传用户：lifangyuan12
我的java课程设计，90分 标准化考试系6.4.2. 客户端主类Client 6.4.3. 客户端选择试题界面ChoiceFile 6.4.4. 客户端考试界面ClientTestArea 6.4.5. 服务器端主类Server 6.4.6. 服务器端读取试题 ReadTestquestion统 (C/S网络版) 不错啊！！
标签： java
上传时间： 2014-12-01
上传用户：yy541071797
源代码\用动态规划算法计算序列关系个数 用关系"<"和"="将3个数a，b，c依次序排列时，有13种不同的序列关系： a=b=c,a=b<c,a<b=v,a<b<c,a<c<b a=c<b,b<a=c,b<a<c,b<c<a,b=c<a c<a=b,c<a<b,c<b<a 若要将n个数依序列，设计一个动态规划算法，计算出有多少种不同的序列关系， 要求算法只占用O(n),只耗时O(n*n).
上传时间： 2013-12-26
上传用户：siguazgb
The government of a small but important country has decided that the alphabet needs to be streamlined and reordered. Uppercase letters will be eliminated. They will issue a royal decree in the form of a String of B and A characters. The first character in the decree specifies whether a must come ( B )Before b in the new alphabet or ( A )After b . The second character determines the relative placement of b and c , etc. So, for example, "BAA" means that a must come Before b , b must come After c , and c must come After d . Any letters beyond these requirements are to be excluded, so if the decree specifies k comparisons then the new alphabet will contain the first k+1 lowercase letters of the current alphabet. Create a class Alphabet that contains the method choices that takes the decree as input and returns the number of possible new alphabets that conform to the decree. If more than 1,000,000,000 are possible, return -1. Definition
标签： government streamline important alphabet
上传时间： 2015-06-09
上传用户：weixiao99
Hard-decision decoding scheme Codeword length (n) : 31 symbols. Message length (k) : 19 symbols. Error correction capability (t) : 6 symbols One symbol represents 5 bit. Uses GF(2^5) with primitive polynomial p(x) = X^5 X^2 + 1 Generator polynomial, g(x) = a^15 a^21*X + a^6*X^2 + a^15*X^3 + a^25*X^4 + a^17*X^5 + a^18*X^6 + a^30*X^7 + a^20*X^8 + a^23*X^9 + a^27*X^10 + a^24*X^11 + X^12. Note: a = alpha, primitive element in GF(2^5) and a^i is root of g(x) for i = 19, 20, ..., 30. Uses Verilog description with synthesizable RTL modelling. Consists of 5 main blocks: SC (Syndrome Computation), KES (Key Equation Solver), CSEE (Chien Search and Error Evaluator), Controller and FIFO Register.
标签： symbols length Hard-decision Codeword
上传时间： 2014-07-08
上传用户：曹云鹏
上下文无关文法（Context-Free Grammar, CFG）是一个4元组G=(V, T, S, P)，其中，V和T是不相交的有限集，S∈V，P是一组有限的产生式规则集，形如A→α，其中A∈V，且α∈(V∪T)*。V的元素称为非终结符，T的元素称为终结符，S是一个特殊的非终结符，称为文法开始符。 设G=(V, T, S, P)是一个CFG，则G产生的语言是所有可由G产生的字符串组成的集合，即L(G)={x∈T* | Sx}。一个语言L是上下文无关语言（Context-Free Language, CFL），当且仅当存在一个CFG G，使得L=L(G)。 *⇒ 例如，设文法G：S→AB A→aA|a B→bB|b 则L(G)={a^nb^m | n,m>=1} 其中非终结符都是大写字母，开始符都是S，终结符都是小写字母。
标签： Context-Free Grammar CFG
上传时间： 2013-12-10
上传用户：gaojiao1999
接受用户输入的的整数范围，输出这个范围之内的所有完全数。 [完全数是指等于其所有因子之和但不包括该数本身，如6=1X2X3， 6=1+2+3，6是一个完全数]
上传时间： 2013-12-25
上传用户：1109003457
We have a group of N items (represented by integers from 1 to N), and we know that there is some total order defined for these items. You may assume that no two elements will be equal (for all a, b: a<b or b<a). However, it is expensive to compare two items. Your task is to make a number of comparisons, and then output the sorted order. The cost of determining if a < b is given by the bth integer of element a of costs (space delimited), which is the same as the ath integer of element b. Naturally, you will be judged on the total cost of the comparisons you make before outputting the sorted order. If your order is incorrect, you will receive a 0. Otherwise, your score will be opt/cost, where opt is the best cost anyone has achieved and cost is the total cost of the comparisons you make (so your score for a test case will be between 0 and 1). Your score for the problem will simply be the sum of your scores for the individual test cases.
标签： represented integers group items
上传时间： 2016-01-17
上传用户：jeffery
The XML Toolbox converts MATLAB data types (such as double, char, struct, complex, sparse, logical) of any level of nesting to XML format and vice versa. For example, >> project.name = MyProject >> project.id = 1234 >> project.param.a = 3.1415 >> project.param.b = 42 becomes with str=xml_format(project, off ) "<project> <name>MyProject</name> <id>1234</id> <param> <a>3.1415</a> <b>42</b> </param> </project>" On the other hand, if an XML string XStr is given, this can be converted easily to a MATLAB data type or structure V with the command V=xml_parse(XStr).
标签： converts Toolbox complex logical
上传时间： 2016-02-12
上传用户：a673761058
