本文依据集成电路设计方法学，探讨了一种基于标准Intel 8086 微处理器的单芯片计算机平台的架构。研究了其与SDRAM，8255 并行接口等外围IP 的集成，并在对AMBA协议和8086 CPU分析的基础上，采用遵从AMBA传输协议的系统总线代替传统的8086 CPU三总线结构，搭建了基于8086 IP 软核的单芯片计算机系统，并实现了FPGA 功能演示。关键词：微处理器； SoC；单芯片计算机；AMBA 协议 Design of 8086 CPU Based Computer-on-a-chip System（School of Electrical Engineering and Automation, Heifei University of Technology, Hefei, 230009,China）Abstract: According to the IC design methodology, this paper discusses the design of one kind of Computer-on-a-chip system architecture, which is based on the standard Intel8086 microprocessor,investigates how to integrate the 8086 CPU and peripheral IP such as, SDRAM controller, 8255 PPI etc. Based on the analysis of the standard Intel8086 microprocessor and AMBA Specification,the Computer-on-a-chip system based on 8086 CPU which uses AMBA bus instead of traditional three-bus structure of 8086 CPU is constructed, and the FPGA hardware emulation is fulfilled.Key words: Microprocessor; SoC; Computer-on-a-chip; AMBA Specification
上传时间： 2013-12-27
上传用户：kernor
一种实用的微机自动配料秤系统:介绍一种由单片机构成的配料秤。叙述了秤的传感器、变送器、信号的变换、硬件原理、软件流程以及和DCS 系统构成的单回路调节系统,此系统可广泛地应用于各行业的配料控制中。关键词:配料秤 单片机 单回路调节系统 DCS 系统 Abstract :A proportioning weigher based on single chip computer is introduced. Sensors , transmitters , signal converting , principle of hardware ,software flowchart of proportioning weigher and single loop control system composed with DCS system are emphasized ,this system can be used in proportioning control of various trades extensively.Key Words :Proportioning Weigher ,Single Chip Computer ,Single Loop Control System ,Distributed Control System
上传时间： 2013-10-12
上传用户：zwei41
The μPSD32xx family, from ST, consists of Flash programmable system devices with a 8032 MicrocontrollerCore. Of these, the μPSD3234A and μPSD3254A are notable for having a complete implementationof the USB hardware directly on the chip, complying with the Universal Serial Bus Specification, Revision1.1.This application note describes a demonstration program that has been written for the DK3200 hardwaredemonstration kit (incorporating a μPSD3234A device). It gives the user an idea of how simple it is to workwith the device, using the HID class as a ready-made device driver for the USB connection.IN-APPLICATION-PROGRAMMING (IAP) AND IN-SYSTEM-PROGRAMMING (ISP)Since the μPSD contains two independent Flash memory arrays, the Micro Controller Unit (MCU) can executecode from one memory while erasing and programming the other. Product firmware updates in thefield can be reliably performed over any communication channel (such as CAN, Ethernet, UART, J1850)using this unique architecture. For In-Application-Programming (IAP), all code is updated through theMCU. The main advantage for the user is that the firmware can be updated remotely. The target applicationruns and takes care on its own program code and data memory.IAP is not the only method to program the firmware in μPSD devices. They can also be programmed usingIn-System-Programming (ISP). A IEEE1149.1-compliant JTAG interface is included on the μPSD. Withthis, the entire device can be rapidly programmed while soldered to the circuit board (Main Flash memory,Secondary Boot Flash memory, the PLD, and all configuration areas). This requires no MCU participation.The MCU is completely bypassed. So, the μPSD can be programmed or reprogrammed any time, anywhere, even when completely uncommitted.Both methods take place with the device in its normal hardware environment, soldered to a printed circuitboard. The IAP method cannot be used without previous use of ISP, because IAP utilizes a small amountof resident code to receive the service commands, and to perform the desired operations.
标签： Demonstration 3200 USB for
上传时间： 2014-02-27
上传用户：zhangzhenyu
The μPSD32xx family, from ST, consists of Flash programmable system devices with a 8032 Microcontroller Core. Of these, the μPSD3234A and μPSD3254A are notable for having a complete implementation of the USB hardware directly on the chip, complying with the Universal Serial Bus Specification, Revision 1.1.This application note describes a demonstration program that has been written for the DK3200 hardware demonstration kit (incorporating a μPSD3234A device). It gives the user an idea of how simple it is to work with the device, using the HID class as a ready-made device driver for the USB connection.
上传时间： 2014-04-03
上传用户：lizhizheng88
The XA-S3 is a member of Philips Semiconductors’ XA (eXtended Architecture) family of high performance 16-bit single-chip Microcontrollers. The XA-S3 combines many powerful peripherals on one chip. Therefore, it is suited for general multipurpose high performance embedded control functions.One of the on-chip peripherals is the I2C bus interface. This report describes worked-out driver software (written in C) to program / use the I2C interface of the XA-S3. The driver software, together with a demo program and interface software routines offer the user a quick start in writing a complete I2C - XAS3 system application.
上传时间： 2013-11-10
上传用户：liaofamous
基于单片机的汽车多功能报警系统设计The Design of Automobile Multi-function AlarmingBased on Single Chip Computer刘法治赵明富宁睡达(河 南 科 技 学 院 ，新 乡 453 00 3)摘要介绍了一种基于单片机控制的汽车多功能报警系统，它能对汽车的润滑系统油压、制动系统气压、冷却系统温度、轮胎欠压及防盗进行自动检测，并在发现异常情况时，发出声光报警。阐述了该报警系统的硬件组成及软件设计方法。关键词单片机传感器数模转换报警Abstract Am ulti-fimctiona utomobilea larnungs ystemb asedo ns inglec hipc omputerco ntorlis in torducedin th isp aper.Th eo ilpr essuero flu bricatesystem, air pressure of braking system, temperature of cooling system, under pressure of tyre and guard against theft， detected automaticaly场thesystem. Audio and visual alarms wil be provided under abnormal conditions厂The hardware composition and software design of the system， described.Keywords Singlec hipc omputer Sensor Digital-t-oanaloguec onversion Alarmin 汽车多功能报苦器硬件系统设计根据 系 统 实际需要和产品性价比，选用ATMEL公司新生产的采用CMOs工艺的低功耗、高性能8位单片机AT89S52作为系统的控制器。AT89S52的片内有8k Bytes LSP Flash闪烁存储器，可进行100(〕次写、擦除操作;256Bytes内部数据存储器(RAM);3 2 根可编程输N输出线;2个可编程全双工串行通道;看门狗(WTD)电路等。系统由传感器、单片机、模数转换器、无线信号发射电路、指示灯驱动电路、声光报警驱动电KD一9563，发出三声二闪光。并触发一个高电平，驱动无线信号发射电路。
上传时间： 2013-11-09
上传用户：gxmm
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
上传时间： 2013-11-08
上传用户：lwq11
LVDS、xECL、CML（低电压差分信号传输、发射级耦合逻辑、电流模式逻辑）………4多点式低电压差分信号传输(M-LVDS) ……………………………………………………8数字隔离器 ………………………………………………………………………………10RS-485/422 …………………………………………………………………………………11RS-232………………………………………………………………………………………13UART（通用异步收发机）…………………………………………………………………16CAN（控制器局域网）……………………………………………………………………18FlatLinkTM 3G ………………………………………………………………………………19SerDes（串行G 比特收发机及LVDS）……………………………………………………20DVI（数字视频接口）/PanelBusTM ………………………………………………………22TMDS（最小化传输差分信号） …………………………………………………………24USB 集线器控制器及外设器件 …………………………………………………………25USB 接口保护 ……………………………………………………………………………26USB 电源管理 ……………………………………………………………………………27PCI Express® ………………………………………………………………………………29PCI 桥接器 …………………………………………………………………………………33卡总线 (CardBus) 电源开关 ………………………………………………………………341394 (FireWire®, 火线®) ……………………………………………………………………36GTLP (Gunning Transceiver Logic Plus，体效应收发机逻辑+) ………………………………39VME（Versa Module Eurocard）总线 ………………………………………………………41时钟分配电路 ……………………………………………………………………………42交叉参考指南 ……………………………………………………………………………43器件索引 …………………………………………………………………………………47技术支持 …………………………………………………………………………………48 德州仪器（TI）为您提供了完备的接口解决方案，使得您的产品别具一格，并加速了产品面市。凭借着在高速、复合信号电路、系统级芯片 (system-on-a-chip ) 集成以及先进的产品开发工艺方面的技术专长，我们将能为您提供硅芯片、支持工具、软件和技术文档，使您能够按时的完成并将最佳的产品推向市场，同时占据一个具有竞争力的价格。本选择指南为您提供与下列器件系列有关的设计考虑因素、技术概述、产品组合图示、参数表以及资源信息：
上传时间： 2013-10-21
上传用户：Jerry_Chow
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
