STM32 F1系列 MCU ATIUM AD集成库 原理图库 PCB 3D封装库文件,STM32F1XXXXX全系列原理图+PCB封装库文件,共209个器件型号,CSV text has been written to file : STM32 F1.csvLibrary Component Count : 209Name Description----------------------------------------------------------------------------------------------------STM32F100C4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C4T7B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100C6T7B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100CBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100CBT7B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100R4H6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R4T6BTR STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100R6H6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R6T6 STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100R8H6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RBH6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100RBH6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100RBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RBT6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RCT6B STM32 ARM-based 32-bit MCU Value Line with 256 kB Flash, 24 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6 STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6B STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6 STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6B STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-
上传时间: 2022-04-30
上传用户:jiabin
STM32函数库的中文说明,希望对大家学习ARM有所帮助。
上传时间: 2013-06-23
上传用户:chuckbassboy
里面有相应的hpunix(HP-UX hpl1000 B.11.00 U 9000/800 (tb)),linux(Red Hat Linux release 9 Kernel 2.4.20-8),windows的头文件、库文件,还有相应的demo程序
标签: release hpunix Kernel HP-UX
上传时间: 2015-01-06
上传用户:cursor
B样条插值,基于散乱数据的B样条插值基本算发。做的动态链接库。
标签: 插值
上传时间: 2015-05-07
上传用户:skhlm
学生信息查询系统C语言实现 包含的功能有: 1、 系统功能选择菜单:提供了5个功能 A、 按“班级+平均成绩”显示原始数据 B、 输入学号,显示学生档案,并可选择用顺序查找或者折半查找去实现 C、 输入不完全的学生姓名即可模糊查找学生档案。 D、 输入班级及课程即可统计平均分,优秀率及及格率。 2、 数据显示函数 3、 学号查找函数 4、 模糊查找函数 5、 成绩统计函数
上传时间: 2014-08-20
上传用户:fanboynet
Romberg求定积分 输入:积分区间[a,b],被积函数f(x,y,z) 输出:积分结果
上传时间: 2015-10-14
上传用户:妄想演绎师
一、 一元三次回归方程 CubicMultinomialRegress.cs 方程模型为Y=a*X(3)+b*X(2)+c*X(1)+d public override double[] buildFormula() 得到系数数组,存放顺序与模型系数相反,即该数组中系数的值依次是d,c,b,a。 以后所述所有模型的系数存放均与此相同(多元线性回归方程除外)。 public override double forecast(double x) 预测函数,根据模型得到预测结果 public override double computeR2() 计算相关系数(决定系数),系数越接近1,数据越满足该模型。
标签: CubicMultinomialRegress override public double
上传时间: 2015-11-25
上传用户:13215175592
双曲线回归方程 HyperbolaRegress.cs 注意!该模型要求a与b的值要大于0!使用该模型时应注意验证这个限制条件。我在实现模型时未加入任何出错流程控制。X不能为0。 方程模型为 public override double[] buildFormula() 得到系数数组,存放顺序与模型系数相反,即该数组中系数的值依次是b,a。 public override double forecast(double x) 预测函数,根据模型得到预测结果。 public override double computeR2()
标签: HyperbolaRegress 模型 方程 cs
上传时间: 2014-11-30
上传用户:youke111
对数回归方程 LogarithmRegress.cs 方程模型为 Y=a*LnX+b public override double[] buildFormula() 得到系数数组,存放顺序与模型系数相反,即该数组中系数的值依次是b,a。 public override double forecast(double x) 预测函数,根据模型得到预测结果。 public override double computeR2() 计算相关系数(决定系数),系数越接近1,数据越满足该模型。
标签: LogarithmRegress buildFormula override public
上传时间: 2014-01-23
上传用户:330402686
本书提供用J B u i l d e r开发数据库应用程序、创建分布式应用程序以及编写J a v a B e a n 组件的高级资料。它包括下列几个部分: • 第一部分是“开发数据库应用程序”,它提供关于使用J b u i l d e r的D a t a E x p r e s s数据 库体系结构的信息,并解释原始数据组件和类之间的相互关系,以及怎样使用它 们来创建你的数据库应用程序。它还解释怎样使用Data Modeler(数据模型器)和 Application Generator(应用程序生成器)创建数据驱动的客户机/服务器应用程 序。 • 第二部分是“开发分布式应用程序”,它提供关于使用ORB Explorer、用J B u i l d e r 创建多级的分布应用程序、调试分布式应用程序、用J a v a定义C O R B A接口以及 使用s e r v l e t等的信息。 • 第三部分是“创建J a v a B e a n”,它解释怎样开发新的J a v a B e a n组件,描述在组件 开发中涉及的任务, 怎样使用B e a n s E x p r e s s创建新的J a v a B e a n,以及关于属性、 事件、B e a nIn f o类和其他方面的详细情况。
上传时间: 2014-01-03
上传用户:wpt