《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
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WP312-Xilinx新一代28nm FPGA技术简介
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal ...
Virtex-5 GTP Transceiver Wizar
The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-spe...
XAPP1042-利用GPIO实现以太网PHY寄存器访问
The XPS Ethernetlite peripheral does not provide any mechanism to access the Ethernet PHYregisters...
基于以太网分布式的数据采集控制系统
针对飞行模拟器座舱数据采集的复杂性，设计了一种基于以太网分布式的数据采集控制系统，该系统是RCM5700微处理器模块上的以太网应用。在系统的基础上具体讨论了PoE技术的应用，在传输数据的网线上同时提供...
微机电系统(MEMS)控制驱动讨论
Abstract: The number of uses for microelectromechanical systems (MEMS) is growing—they allow...
PICMG_COM_0_R2_0COMe规范--原文资料
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer...
CodeWarrior开发工具套件简要说明
CodeWarrior Development Tool Suites are comprehensive integrated developmentenvironments (IDE) tha...
NCV7356单线CANBUS收发器数据手册
The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various ...
射频基础知识
Radio frequency (RF) can be a complex subject to navigate, but it does not have to be. If you are ju...