This application note demonstrates how to write an Inter Integrated Circuit bus driver (I2C) for the XA-S3 16-bitMicrocontroller from Philips Semiconductors.Not only the driver software is given. This note also contains a set of (example) interface routines and a smalldemo application program. All together it offers the user a quick start in writing a complete I2C system applicationwith the PXAS3x.The driver routines support interrupt driven single master transfers. Furthermore, the routines are suitable foruse in conjunction with real time operating systems.
上传时间： 2013-11-02
上传用户：zw380105939
I2C interface, is a very powerful tool for system designers. Theintegrated protocols allow systems to be completely software defined.Software development time of different products can be reduced byassembling a library of reusable software modules. In addition, themultimaster capability allows rapid testing and alignment ofend-products via external connections to an assembly-line computer.The mask programmable 87LPC76X and its EPROM version, the87LPC76X, can operate as a master or a slave device on the I2Csmall area network. In addition to the efficient interface to thededicated function ICs in the I2C family, the on-board interfacefacilities I/O and RAM expansion, access to EEPROM andprocessor-to-processor communications.
标签： microcontro Using 76X LPC
上传时间： 2013-12-30
上传用户：Artemis
用单片机配置FPGA—PLD设计技巧 Configuration/Program Method for Altera Device Configure the FLEX Device You can use any Micro-Controller to configure the FLEX device–the main idea is clocking in ONE BITof configuration data per CLOCK–start from the BIT 0The total Configuration time–e.g. 10K10 need 15K byte configuration file•calculation equation–10K10* 1.5= 15Kbyte–configuration time for the file itself•15*1024*8*clock = 122,880Clock•assume the CLOCK is 4MHz•122,880*1/4Mhz=30.72msec
上传时间： 2013-10-09
上传用户：a67818601
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 图Figure 1. Local Safety System
上传时间： 2013-11-05
上传用户：维子哥哥
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
标签： Base-Station Applications Single-Chip Transceiver
上传时间： 2013-11-07
上传用户：songrui
In the past decade, the size and complexity of manyFPGA designs exceeds the time and resourcesavailable to most design teams, making the use andreuse of Intellectual Property (IP) imperative.However, integrating numerous IP blocks acquiredfrom both internal and external sources can be adaunting challenge that often extends, rather thanshortens, design time. As today's designs integrateincreasing amounts of functionality, it is vital thatdesigners have access to proven, up-to-date IP fromreliable sources.
上传时间： 2013-11-15
上传用户：lyy1234
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上传时间： 2014-12-28
上传用户：康郎
This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in terms of bits per second will remain the same.
上传时间： 2013-11-08
上传用户：lou45566
This application note shows how to achieve low-cost, efficient serial configuration for Spartan FPGA designs. The approachrecommended here takes advantage of unused resources in a design, thereby reducing the cost, part count, memory size,and board space associated with the serial configuration circuitry. As a result, neither processor nor PROM needs to be fullydedicated to performing Spartan configuration.In particular, information is provided on how the idle processing time of an on-board controller can be used to loadconfiguration data from an off-board source. As a result, it is possible to upgrade a Spartan design in the field by sending thebitstream over a network.
上传时间： 2014-08-16
上传用户：adada
