完整性高的FPGA-PCB系统化协同设计工具 Cadence OrCAD and Allegro FPGA System Planner便可满足较复杂的设计及在设计初级产生最佳的I/O引脚规划，并可透过FSP做系统化的设计规划，同时整合logic、schematic、PCB同步规划单个或多个FPGA pin的最佳化及layout placement，借由整合式的界面以减少重复在design及PCB Layout的测试及修正的过程及沟通时间，甚至透过最佳化的pin mapping、placement后可节省更多的走线空间或叠构。 Specifying Design Intent 在FSP整合工具内可直接由零件库选取要摆放的零件，而这些零件可直接使用PCB内的包装，预先让我们同步规划FPGA设计及在PCB的placement。
标签： Allegro Planner System FPGA
上传时间： 2013-10-19
上传用户：shaojie2080
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 图Figure 1. Local Safety System
上传时间： 2013-11-14
上传用户：zoudejile
通过以太网远程配置Nios II 处理器 应用笔记 Firmware in embedded hardware systems is frequently updated over the Ethernet. For embedded systems that comprise a discrete microprocessor and the devices it controls, the firmware is the software image run by the microprocessor. When the embedded system includes an FPGA, firmware updates include updates of the hardware image on the FPGA. If the FPGA includes a Nios® II soft processor, you can upgrade both the Nios II processor—as part of the FPGA image—and the software that the Nios II processor runs, in a single remote configuration session.
上传时间： 2013-11-22
上传用户：chaisz
怎样使用Nios II处理器来构建多处理器系统 Chapter 1. Creating Multiprocessor Nios II Systems Introduction to Nios II Multiprocessor Systems . . . . . . . . . . . . . . 1–1 Benefits of Hierarchical Multiprocessor Systems . . . . . . . . . . . . . . . 1–2 Nios II Multiprocessor Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 Multiprocessor Tutorial Prerequisites . . . . . . . . . . . . . . . . . . . . . . . 1–3 Hardware Designs for Peripheral Sharing . . . . . . . . . . . .. . . . . . . . 1–3 Autonomous Multiprocessors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3 Multiprocessors that Share Peripherals . . . . . . . . . . . . . . . . . . . . . . 1–4 Sharing Peripherals in a Multiprocessor System . . . . . . . . . . . . . . . . . 1–4 Sharing Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6 The Hardware Mutex Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7 Sharing Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . 1–8 Overlapping Address Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8 Software Design Considerations for Multiple Processors . . .. . . . . 1–9 Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9 Boot Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 1–13 Debugging Nios II Multiprocessor Designs . . . . . . . . . . . . . . . . 1–15 Design Example: The Dining Philosophers’ Problem . . . . .. . . 1–15 Hardware and Software Requirements . . . . . . . . . . . . . . . .. . . 1–16 Installation Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–17 Creating the Hardware System . . . . . . . . . . . . . . .. . . . . . 1–17 Getting Started with the multiprocessor_tutorial_start Design Example 1–17 Viewing a Philosopher System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18 Philosopher System Pipeline Bridges . . . . . . . . . . . . . . . . . . . . . 1–19 Adding Philosopher Subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . 1–21 Connecting the Philosopher Subsystems . . . . . . . . . . . . .. . . . . 1–22 Viewing the Complete System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–27 Generating and Compiling the System . . . . . . . . . . . . . . . . . .. 1–28
上传时间： 2013-11-21
上传用户：lo25643
使用Nios II紧耦合存储器教程 Chapter 1. Using Tightly Coupled Memory with the Nios II Processor Reasons for Using Tightly Coupled Memory . . . . . . . . . . . . . . . . . . . . . . . 1–1 Tradeoffs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1 Guidelines for Using Tightly Coupled Memory . . . .. . . . . . . . 1–2 Hardware Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 Software Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . 1–3 Locating Functions in Tightly Coupled Memory . . . . . . . . . . . . . 1–3 Tightly Coupled Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 Dual Port Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . 1–5 Building a Nios II System with Tightly Coupled Memory . . . . . . . . . . . 1–5
上传时间： 2013-10-13
上传用户：黄婷婷思密达
Nios II定制指令用户指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor. The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
上传时间： 2013-10-12
上传用户：kang1923
Nios II 系列处理器配置选项:This chapter describes the Nios® II Processor parameter editor in Qsys and SOPC Builder. The Nios II Processor parameter editor allows you to specify the processor features for a particular Nios II hardware system. This chapter covers the features of the Nios II processor that you can configure with the Nios II Processor parameter editor; it is not a user guide for creating complete Nios II processor systems.
上传时间： 2015-01-01
上传用户：mahone
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上传时间： 2013-11-23
上传用户：kangqiaoyibie
This application note describes how to build a system that can be used for determining theoptimal phase shift for a Double Data Rate (DDR) memory feedback clock. In this system, theDDR memory is controlled by a controller that attaches to either the OPB or PLB and is used inan embedded microprocessor application. This reference system also uses a DCM that isconfigured so that the phase of its output clock can be changed while the system is running anda GPIO core that controls that phase shift. The GPIO output is controlled by a softwareapplication that can be run on a PowerPC® 405 or Microblaze™ microprocessor.
上传时间： 2014-11-26
上传用户：erkuizhang
