《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
form技术资料
📦 资源总数：307
📄 技术文档：2
💻 源代码：177654
🔌 电路图：2
📚 form全部资料 (307个)
Virtex-6 FPGA PCB设计手册
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Docume...
CPLD库指南
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Docum...
HITECH与电脑的通信协议
1 Communication Protocol (Computer as master) The communication...
PICMG_COM_0_R2_0COMe规范--原文资料
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer...
ZigBee无线传感网络的路由协议研究
为满足无线网络技术具有低功耗、节点体积小、网络容量大、网络传输可靠等技术要求，设计了一种以MSP430单片机和CC2420射频收发器组成的无线传感节点。通过分析其节点组成，提出了ZigBe...
CF卡技术资料
The information in this specification is subject to change without notice.Use of this specification ...
《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
Virtex-6 FPGA PCB设计手册
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Docume...
CPLD库指南
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Docum...