ESD Protection in CMOS ICs
在互補式金氧半(CMOS)積體電路中,隨著量產製程的演進,元件的尺寸已縮減到深次微 米(deep-submicron)階段,以增進積體電路(IC)的性能及運算速度,以及降低每顆晶片的製造 成本。但隨著...
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在互補式金氧半(CMOS)積體電路中,隨著量產製程的演進,元件的尺寸已縮減到深次微 米(deep-submicron)階段,以增進積體電路(IC)的性能及運算速度,以及降低每顆晶片的製造 成本。但隨著...
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