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System-<b>On</b>-Chip

  • C8051F020数据手册

      The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.

    标签: C8051F020 数据手册

    上传时间: 2013-11-08

    上传用户:lwq11

  • 接口选择指南

    LVDS、xECL、CML(低电压差分信号传输、发射级耦合逻辑、电流模式逻辑)………4多点式低电压差分信号传输(M-LVDS) ……………………………………………………8数字隔离器 ………………………………………………………………………………10RS-485/422 …………………………………………………………………………………11RS-232………………………………………………………………………………………13UART(通用异步收发机)…………………………………………………………………16CAN(控制器局域网)……………………………………………………………………18FlatLinkTM 3G ………………………………………………………………………………19SerDes(串行G 比特收发机及LVDS)……………………………………………………20DVI(数字视频接口)/PanelBusTM ………………………………………………………22TMDS(最小化传输差分信号) …………………………………………………………24USB 集线器控制器及外设器件 …………………………………………………………25USB 接口保护 ……………………………………………………………………………26USB 电源管理 ……………………………………………………………………………27PCI Express® ………………………………………………………………………………29PCI 桥接器 …………………………………………………………………………………33卡总线 (CardBus) 电源开关 ………………………………………………………………341394 (FireWire®, 火线®) ……………………………………………………………………36GTLP (Gunning Transceiver Logic Plus,体效应收发机逻辑+) ………………………………39VME(Versa Module Eurocard)总线 ………………………………………………………41时钟分配电路 ……………………………………………………………………………42交叉参考指南 ……………………………………………………………………………43器件索引 …………………………………………………………………………………47技术支持 …………………………………………………………………………………48 德州仪器(TI)为您提供了完备的接口解决方案,使得您的产品别具一格,并加速了产品面市。凭借着在高速、复合信号电路、系统级芯片 (system-on-a-chip ) 集成以及先进的产品开发工艺方面的技术专长,我们将能为您提供硅芯片、支持工具、软件和技术文档,使您能够按时的完成并将最佳的产品推向市场,同时占据一个具有竞争力的价格。本选择指南为您提供与下列器件系列有关的设计考虑因素、技术概述、产品组合图示、参数表以及资源信息:

    标签: 接口 选择指南

    上传时间: 2013-10-21

    上传用户:Jerry_Chow

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-11-21

    上传用户:不懂夜的黑

  • 数字运算

    数字运算,判断一个数是否接近素数 A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no

    标签: 数字 运算

    上传时间: 2015-05-21

    上传用户:daguda

  • A book describle in detail about the system security and usability technology. It is a system book o

    A book describle in detail about the system security and usability technology. It is a system book on security.

    标签: system book technology describle

    上传时间: 2015-07-22

    上传用户:zmy123

  • The cable compensation system is an experiment system that performs simulations of partial or microg

    The cable compensation system is an experiment system that performs simulations of partial or microgravity environments on earth. It is a highly nonlinear and complex system.In this paper, a network based on the theory of the Fuzzy Cerebellum Model Articulation Controller(FCMAC) is proposed to control this cable compensation system. In FCMAC ,without appropriate learning rate, the control system based on FCMAC will become unstable or its convergence speed will become slow.In order to guarantee the convergence of tracking error, we present a new kind of optimization based on adaptive GA for selecting learning rate.Furthermore, this approach is evaluated and its performance is discussed.The simulation results shows that performance of the FCMAC based the proposed method is stable and more effective.

    标签: system compensation simulations experiment

    上传时间: 2015-08-26

    上传用户:希酱大魔王

  • 20世纪90年代中期

    20世纪90年代中期,因使用ASIC实现芯片组受到启发,萌生应该将完整计算机所有不同的功能块一 次直接集成于一颗硅片上的想法。这种芯片,初始起名叫System on a Chip(SoC),直译的中文名是 系统级芯片

    标签:

    上传时间: 2014-12-20

    上传用户:牛布牛

  • We have a group of N items (represented by integers from 1 to N), and we know that there is some tot

    We have a group of N items (represented by integers from 1 to N), and we know that there is some total order defined for these items. You may assume that no two elements will be equal (for all a, b: a<b or b<a). However, it is expensive to compare two items. Your task is to make a number of comparisons, and then output the sorted order. The cost of determining if a < b is given by the bth integer of element a of costs (space delimited), which is the same as the ath integer of element b. Naturally, you will be judged on the total cost of the comparisons you make before outputting the sorted order. If your order is incorrect, you will receive a 0. Otherwise, your score will be opt/cost, where opt is the best cost anyone has achieved and cost is the total cost of the comparisons you make (so your score for a test case will be between 0 and 1). Your score for the problem will simply be the sum of your scores for the individual test cases.

    标签: represented integers group items

    上传时间: 2016-01-17

    上传用户:jeffery

  • The XML Toolbox converts MATLAB data types (such as double, char, struct, complex, sparse, logical)

    The XML Toolbox converts MATLAB data types (such as double, char, struct, complex, sparse, logical) of any level of nesting to XML format and vice versa. For example, >> project.name = MyProject >> project.id = 1234 >> project.param.a = 3.1415 >> project.param.b = 42 becomes with str=xml_format(project, off ) "<project> <name>MyProject</name> <id>1234</id> <param> <a>3.1415</a> <b>42</b> </param> </project>" On the other hand, if an XML string XStr is given, this can be converted easily to a MATLAB data type or structure V with the command V=xml_parse(XStr).

    标签: converts Toolbox complex logical

    上传时间: 2016-02-12

    上传用户:a673761058

  • 数字存储器和混合信号超大规模集成电路 本书系统地介绍了数字、存储器和混合信号VLSI系统的测试和可测试性设计。该书是根据作者多年的科研成果和教学实践

    数字存储器和混合信号超大规模集成电路 本书系统地介绍了数字、存储器和混合信号VLSI系统的测试和可测试性设计。该书是根据作者多年的科研成果和教学实践,结合国际上关注的最新研究热点并参考大量的文献撰写的。全书共分三个部分。第一部分是测试基础,介绍了测试基本概念、测试设备、测试经济学和故障模型。第二部分是测试方法,详细论述了组合和时序电路的测试生成、存储器测试、基于DSP和基于模块的模拟与混合信号测试、延迟测试和IDDQ测试等。第三部分是可测试性设计,包括扫描设计、BIST、边界扫描测试、模拟测试总线标准和基于IP芯核的SOC(System on a chip)测试。

    标签: VLSI 数字 存储器 混合信号

    上传时间: 2013-11-26

    上传用户:hullow