使用新电源模块改进表面贴装可制造性
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnec...
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnec...
摘要:采用表面组装技术(surface mountt echnology,SMT)进行印制板级电子电路组装是当代组装技术发展的主流。典型的SMT生产线是由高速机和多功能机串联而成,印制电路板(prin...
表面贴片胶(SMA,surface mount adhesives)用于波峰焊接和回流焊接,以保持组件在印刷电路板(PCB)上的位置,确保在装配线上传送过程中组件不会丢失。PCB装配中使用的大多数表面...
【摘要】本文结合作者多年的印制板设计经验,着重印制板的电气性能,从印制板稳定性、可靠性方面,来讨论多层印制板设计的基本要求。【关键词】印制电路板;表面贴装器件;高密度互连;通孔【Key words】P...
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between...
国外游戏开发者杂志2000年第八期配套代码,包括Brian Sharp的implicit-surface fluid的例子代码,例子中使用了Lander的动画库...
东滕网站源码,漂亮的界面,基本网页功能设计,聊天室- East clears out the website source code, attractive contact surface, basi...
This was the public transportation inquiry system software engineering design documents, including t...
This was the public transportation inquiry system software engineering design documents, including t...
This was the public transportation inquiry system software engineering design documents, including t...