The first edition of this book was published in 1992. Nine years later it had become clear that a second edition was required because of the rapidly changing nature of telecommunication. In 1992, the Internet was in existence but it was not the household word that it is in the year 2001. Cellular telephones were also in use but they had not yet achieved the popularity that they enjoy today. In the current edition, Chapter 1 has been revised to include a section on the Internet. Chapter 10 is new and it covers the facsimile machine; I had overlooked this important tele- communication device in the first edition. Chapter 11 is also new and it describes the pager, the cordless telephone and the cellular telephone system. These are examples of a growing trend in telecommunications to go ‘‘wireless’’.
标签： Telecommunication Circuit Design 2nd
上传时间： 2020-06-01
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Long-TermEvolution(LTE)isarguablyoneofthemostimportantstepsinthecurrentphaseof the development of modern mobile communications. It provides a suitable base for enhanced services due to increased data throughput and lower latency figures, and also gives extra impetus to the modernization of telecom architectures. The decision to leave the circuit- switched domainoutofthescope ofLTE/SAEsystem standardization might soundradical but itindicatesthatthetelecomworldisgoingstronglyfortheall-IPconcept----andthedeployment of LTE/SAE is concrete evidence of this global trend.
标签： Deployment Handbook LTE-SAE The
上传时间： 2020-06-01
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n the first part of this book, we give an introduction to the basic applications of wireless com- munications, as well as the technical problems inherent in this communication paradigm. After a brief history of wireless, Chapter 1 describes the different types of wireless services, and works out their fundamental differences. The subsequent Section 1.3 looks at the same problem from a different angle: what data rates, ranges, etc., occur in practical systems, and especially, what combination of performance measures are demanded (e.g., what data rates need to be transmitted over short distances; what data rates are required over long distances?) Chapter 2 then describes the technical challenges of communicating without wires, putting special emphasis on fading and co-channel interference. Chapter 3 describes the most elementary problem of designing a wireless system, namely to set up a link budget in either a noise-limited or an interference-limited system. After studying this part of the book, the reader should have an overview of different types of wireless services, and understand the technical challenges involved in each of them. The solutions to those challenges are described in the later parts of this book.
标签： Communications Wireless Edition 2nd
上传时间： 2020-06-01
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Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
标签： Electrostatic Protection Discharge
上传时间： 2020-06-05
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Dear Reader, this book project brings to you a unique study tool for ESD protection solutions used in analog-integrated circuit (IC) design. Quick-start learning is combined with in-depth understanding for the whole spectrum of cross- disciplinary knowledge required to excel in the ESD field. The chapters cover technical material from elementary semiconductor structure and device levels up to complex analog circuit design examples and case studies.
标签： Circuits Design Analog ESD for
上传时间： 2020-06-05
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The challenges associated with the design and implementation of Electro- static Discharge (ESD) protection circuits become increasingly complex as technology is scaled well into nano-metric regime. One must understand the behavior of semiconductor devices under very high current densities, high temperature transients in order to surmount the nano-meter ESD challenge. As a consequence, the quest for suitable ESD solution in a given technology must start from the device level. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions.
标签： Protection Circuit Device Design ESD and
上传时间： 2020-06-05
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In the field of electricity, electrostatics, and circuit theory, there are many discoveries and accomplishments that have lead to the foundation of the field of electrostatic discharge (ESD) phenomenon. Below is a chronological list of key events that moved the field of electrostatics forward:
上传时间： 2020-06-05
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Microengineering and Microelectromechanical systems (MEMS) have very few watertight definitions regarding their subjects and technologies. Microengineering can be described as the techniques, technologies, and practices involved in the realization of structures and devices with dimensions on the order of micrometers. MEMS often refer to mechanical devices with dimensions on the order of micrometers fabricated using techniques originating in the integrated circuit (IC) industry, with emphasis on silicon-based structures and integrated microelectronic circuitry. However, the term is now used to refer to a much wider range of microengineered devices and technologies.
标签： Microengineering Interfacing MEMS and
上传时间： 2020-06-06
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There have been many developments in the field of power electronics since the publication of the second edition, almost five years ago. Devices have become bigger and better - bigger silicon die, and current and voltage ratings. However, semiconductor devices have also become smaller and better, integrated circuit devices, that is. And the marriage of low power integrated circuit tecnology and high power semiconductors has resulted in benefit to both fields.
标签： Electronics Handbook Edition Power
上传时间： 2020-06-07
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A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organics and inorganics. Since these materials all behave differently under various environmental, electrical, and thermal stresses, proper selec- tion of these materials and the assembly processes are critical. In-depth knowledge of the material properties and the processing techniques is there- fore required to build a high-performance and highly reliable power module.
标签： Manufacture Electronic Modules Design Power
上传时间： 2020-06-07
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