ARVIEW2.OCX use to report on vb6
标签: ARVIEW2.OCX
上传时间: 2016-01-08
上传用户:1838585805
This report presents a tutorial of fundamental array processing and beamforming theory relevant to microphone array speech processing. A microphone array consists of multiple microphones placed at different spatial locations. Built upon a knowledge of sound propagation principles, the multiple inputs can be manipulated to enhance or attenuate signals emanating from particular directions. In this way, microphone arrays provide a means of enhancing a desired signal in the presence of corrupting noise sources. Moreover, this enhancement is based purely on knowledge of the source location, and so microphone array techniques are applicable to a wide variety of noise types. Microphone arrays have great potential in practical applications of speech processing, due to their ability to provide both noise robustness and hands-free signal acquisition.
标签: Microphone array Tutorial Array Signal Processing
上传时间: 2016-06-12
上传用户:halias
利用ADS设计LNA,包括匹配和电路设计
标签: usingADS design report LNA
上传时间: 2017-02-15
上传用户:theflood
是否要先打开ALLEGRO? 不需要(当然你的机器须有CADENCE系统)。生成完封装后在你的输出目录下就会有几千个器件(全部生成的话),默认输出目录为c:\MySym\. Level里面的Minimum, Nominal, Maximum 是什么意思? 对应ipc7351A的ABC封装吗? 是的 能否将MOST, NOMINAL, LEAST三种有差别的封装在命名上也体现出差别? NOMINAL 的名称最后没有后缀,MOST的后缀自动添加“M”,LEAST的后缀自动添加“L”,你看看生成的库名称就知道了。(直插件以及特别的器件,如BGA等是没有MOST和LEAST级别的,对这类器件只有NOMINAL) IC焊盘用长方形好像比用椭圆形的好,能不能生成长方形的? 嗯。。。。基本上应该是非直角的焊盘比矩形的焊盘好,我记不得是AMD还是NS还是AD公司专门有篇文档讨论了这个问题,如果没有记错的话至少有以下好处:信号质量好、更省空间(特别是紧密设计中)、更省锡量。我过去有一篇帖子有一个倒角焊盘的SKILL,用于晶振电路和高速器件(如DDR的滤波电容),原因是对宽度比较大的矩形用椭圆焊盘也不合适,这种情况下用自定义的矩形倒角焊盘就比较好了---你可以从网上另外一个DDR设计的例子中看到。 当然,我已经在程序中添加了一选择项,对一些矩形焊盘可以选择倒角方式. 刚才试了一下,感觉器件的命名的规范性不是太好,另好像不能生成器件的DEVICE文件,我没RUN完。。。 这个程序的命名方法基本参照IPC-7351,每个人都有自己的命名嗜好,仍是不好统一的;我是比较懒的啦,所以就尽量靠近IPC-7351了。 至于DEVICE,的选项已经添加 (这就是批量程序的好处,代码中加一行,重新生产的上千上万个封装就都有新东西了)。 你的库都是"-"的,请问用过ALLEGRO的兄弟,你们的FOOTPRINT认"-"吗?反正我的ALLEGRO只认"_"(下划线) 用“-”应该没有问题的,焊盘的命名我用的是"_"(这个一直没改动过)。 部分丝印画在焊盘上了。 丝印的问题我早已知道,只是尽量避免开(我有个可配置的SilkGap变量),不过工作量比较大,有些已经改过,有些还没有;另外我没有特别费功夫在丝印上的另一个原因是,我通常最后用AUTO-SILK的来合并相关的层,这样既方便快捷也统一各个器件的丝印间距,用AUTO-SILK的话丝印线会自动避开SOLDER-MASK的。 点击allegro后命令行出现E- Can't change to directory: Files\FPM,什么原因? 我想你一定是将FPM安装在一个含空格的目录里面了,比如C:\Program Files\等等之类,在自定义安装目录的时候该目录名不能含有空格,且存放生成的封装的目录名也不能含有空格。你如果用默认安装的话应该是不会有问题的, 默认FPM安装在C:\FPM,默认存放封装的目录为C:\MYSYM 0.04版用spb15.51生成时.allegro会死机.以前版本的Allegro封装生成器用spb15.51生成时没有死机现象 我在生成MELF类封装的时候有过一次死机现象,估计是文件操作错误导致ALLEGRO死机,原因是我没有找到在skill里面直接生成SHAPE焊盘的方法(FLASH和常规焊盘没问题), 查了下资料也没有找到解决方法,所以只得在外部调用SCRIPT来将就一下了。(下次我再查查看),用SCRIPT的话文件访问比较频繁(幸好目前MELF类的器件不多). 解决办法: 1、对MELF类器件单独选择生成,其它的应该可以一次生成。 2、试试最新的版本(当前0.05) 请说明运行在哪类器件的时候ALLEGRO出错,如果不是在MELF附近的话,请告知,谢谢。 用FPM0.04生成的封装好像文件都比较大,比如CAPC、RES等器件,都是300多K,而自己建的或采用PCB Libraries Eval生成的封装一般才几十K到100K左右,不知封装是不是包含了更多的信息? 我的每个封装文件包含了几个文字层(REF,VAL,TOL,DEV,PARTNUMBER等),SILK和ASSEM也是分开的,BOND层和高度信息,还有些定位线(在DISP层),可能这些越来越丰富的信息加大了生成文件的尺寸.你如果想看有什么内容的话,打开所有层就看见了(或REPORT) 非常感谢 LiWenHui 发现的BUG, 已经找到原因,是下面这行: axlDBChangeDesignExtents( '((-1000 -1000) (1000 1000))) 有尺寸空间开得太大,后又没有压缩的原因,现在生成的封装也只有几十K了,0.05版已经修复这个BUG了。 Allegro封装生成器0.04生成do-27封装不正确,生成封装的焊盘的位号为a,c.应该是A,B或者1,2才对. 呵呵,DIODE通常管脚名为AC(A = anode, C = cathode) 也有用AK 或 12的, 极少见AB。 除了DIODE和极个别插件以及BGA外,焊盘名字以数字为主, 下次我给DIODE一个选择项,可以选择AC 或 12 或 AK, 至于TRANSISTER我就不去区分BCE/CBE/ECB/EBC/GDS/GSD/DSG/DGS/SGD/SDG等了,这样会没完没了的,我将对TRANSISTER强制统一以数字编号了,如果用家非要改变,只得在生成库后手工修改。
标签: Footprint Maker 0.08 FPM skill
上传时间: 2018-01-10
上传用户:digitzing
TM Forum Technical Report CSP Use Cases Utilizing 1Blockchain TR279 Release 17.5.0 December 2017
标签: 英文
上传时间: 2019-09-25
上传用户:kongqm
The digital dilemma: Telecoms fi rms prepare for the future is an Economist Intelligence Unit (EIU) report commissioned by WIPRO. The report strives to identify the key issues that companies within the telecoms sector are facing as they attempt to reshape their businesses to compete in a more digitised world.
上传时间: 2020-06-01
上传用户:shancjb
In 2001, Orange, a UK mobile network operator, announced the “Orange at Home” project, a smart house incorporating the latest technology wizardry built some 20 miles north of London. It was intended to be more than a mere showcase, with plans for real families to move in and live with the smart home. My then research establishment, the Digital World Research Centre at the University of Surrey, was commissioned to study how these families reacted to their new home, and to report lessons for the future development of smart homes and smart home technologies.
上传时间: 2020-06-06
上传用户:shancjb
Since the original publication of Manual 74 in 1991, and the preceding “Guidelines for Transmission Line Structural Loading” in 1984, the understanding of structural loadings on transmission line structures has broadened signifi cantly. However, improvements in computational capa- bility have enabled the transmission line engineer to more easily deter- mine structural loadings without properly understanding the parameters that affect these loads. Many seasoned professionals have expressed concern for the apparent lack of recent information on the topic of struc- tural loadings as new engineers enter this industry. The Committee on Electrical Transmission Structures is charged with the responsibility to report, evaluate, and provide loading requirements of transmission struc- tures. This task committee was therefore formed to update and revise the 1991 manual.
标签: Transmission Guidelines Electrical Line for
上传时间: 2020-06-07
上传用户:shancjb
With more than two billion terminals in commercial operation world-wide, wire- less and mobile technologies have enabled a first wave of pervasive communication systems and applications. Still, this is only the beginning as wireless technologies such as RFID are currently contemplated with a deployment potential of tens of billions of tags and a virtually unlimited application potential. A recent ITU report depicts a scenario of “Internet of things” — a world in which billions of objects will report their location, identity, and history over wireless connections.
标签: Internet Things From The RFI of
上传时间: 2020-06-08
上传用户:shancjb
MAX30102芯片心率血氧传感器模块传感器模块软硬件设计资料包括STM32测试源码AD设计原理图及心率及血氧参考设计资料:参考代码及实验数据工程文件及库心率及血氧参考设计资料芯片数据手册1771.pdf2ES Teck PEMS White Paper.pdf31930_accessories.pdf5273c08fe2b6b_1_4264142A_EN_p.pdfAvant 2120 Brochure.pdfcelyon-1057-daeg.pdfDr. Bob case study for dental.pdfenvitec.pdfgclarke-2015-MASc-thesis.pdfiadt02i4p261.pdfIHE_PCD_Suppl_POI.pdfijcsit2014050679.pdfIMECS2009_pp1537-1540.pdfLuksSwensonPulseOximetryatHighAltitude.pdfMI_CCHD_Screener_Tips_Flier_3-21-13_422078_7.pdfMoon.pdfnotes6.pdfpansw_spo2_sensor.pdfPK_EN_MAsimo2008Product Catalog.pdfpm-60a-spo2-report-4.pdfpulse-oximetry-at-home.pdfpulse-oximetry.pdfpulse.pdfPulseOxFinal_low.pdfpulse_ox.pdfpxc3976461.pdfReusable SpO2 Sensors.pdfSP02-cross-reference-sensor.pdfsprt533.pdfsszb140.pdfview.pdf
上传时间: 2021-11-24
上传用户:fliang