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RFID-Chip-Manipulation

  • Newvision NV3029S LCD SPI驱动

    a-Si TFT LCD Single Chip Driver with 240RGBx320 resolution and 262K color, SPI驱动接口

    标签: Newvision 3029S 3029 LCD SPI NV 驱动

    上传时间: 2018-05-09

    上传用户:sohu

  • BTS50_datasheet

    The BTS5016SDA is a one channel high-side power switch in PG-TO252-5-11 package providing embedded protective functions. The power transistor is built by a N-channel vertical power MOSFET with charge pump. The design is based on Smart SIPMOS chip on chip technology. The BTS5016SDA has a current controlled input and offers a diagnostic feedback with load current sense and a defined fault signal in case of overload operation, overtemperature shutdown and/or short circuit shutdown.

    标签: datasheet BTS 50

    上传时间: 2019-03-27

    上传用户:guaixiaolong

  • AZ1117H

    The AZ1117 is a series of low dropout three-terminal regulators with a dropout of 1.15V at 1A output current. The AZ1117 series provides current limiting and thermal shutdown. Its circuit includes a trimmed bandgap reference to assure output voltage accuracy to be within 1% for 1.5V, 1.8V, 2.5V, 2.85V, 3.3V, 5.0V and adjustable versions or 2% for 1.2V version. Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal shutdown provides protection against any combination of overload and ambient temperature that would create excessive junction temperature.  The AZ1117 has an adjustable version, that can provide the output voltage from 1.25V to 12V with only 2 external resistors.

    标签: 1117H 1117 AZ

    上传时间: 2019-04-11

    上传用户:heaven0o0o0

  • ST25RU3993的串口通信指令集

    超高频UHF RFID模组 ST25RU3993 的串口通信指令集

    标签: ST25RU3993 串口通信 指令集 RFID

    上传时间: 2019-07-13

    上传用户:vaico

  • f28xxflash烧写插件

    第一步: 正确安装CCS和F2812的烧写插件。 第二步: 运行CCS,则进入CCS 开发环境。 第三步: 将GPIO目录COPY到CCS开发环境中的myproject 目录下; 在CCS中用projectOpen命令,加载SPI 目录下的GPIO.pjt编译,生成.out 文件。 第四步: 点击CCS 中的Tools —>F28XX On-Chip Flash Programer。

    标签: xxflash f28 28 烧写 插件

    上传时间: 2019-10-17

    上传用户:zz794447995

  • C2000CodeGenerationTools5_0_2

    第一步: 正确安装CCS和F2812的烧写插件。 第二步: 运行CCS,则进入CCS 开发环境。 第三步: 将GPIO目录COPY到CCS开发环境中的myproject 目录下; 在CCS中用projectOpen命令,加载SPI 目录下的GPIO.pjt编译,生成.out 文件。 第四步: 点击CCS 中的Tools —>F28XX On-Chip Flash Programer。

    标签: CodeGenerationTools5 2000

    上传时间: 2019-10-17

    上传用户:zz794447995

  • Interference+Mitigation+Techniques

    This research work aims at eliminating the off-chip RF SAW filters from fre- quency division duplexed (FDD) receivers. In the first approach, a monolithic passive RF filter was constructed using on-chip capacitors and bondwire inductors. The bond- wire characteristics were studied in details and the effect of mutual inductive coupling between the bondwires on the filter performance was analyzed. Based on that, a bond- wire configuration was proposed to improve the frequency response of the filter. The filter was implemented in 0.18 µm CMOS process for WCDMA applications.

    标签: Interference Mitigation Techniques

    上传时间: 2020-05-27

    上传用户:shancjb

  • Introduction to RF Power Amplifier Design

    Radio frequency (RF) power amplifiers are used in everyday life for many applica- tions including cellular phones, magnetic resonance imaging, semiconductor wafer processing for chip manufacturing, etc. Therefore, the design and performance of RF amplifiers carry great importance for the proper functionality of these devices. Furthermore, several industrial and military applications require low-profile yet high-powered and efficient power amplifiers. 

    标签: Introduction Amplifier Design Power to RF

    上传时间: 2020-05-27

    上传用户:shancjb

  • Thermal+Management+of+Telecommunications+Equipment

    The need to develop reliable microelectronic devices capable of operating at high speeds with complex functionality requires a better understanding of the factors that govern the thermal performance of electronics. With an increased demand on system reliability and performance combined with miniaturization of the devices, thermal consideration has become a crucial factor in the design of elec- tronic packages, from chip to system levels.

    标签: Telecommunications Management Equipment Thermal of

    上传时间: 2020-06-01

    上传用户:shancjb

  • Wireless+Communication+Circuits+and+Systems

    This book is concerned with integrated circuits and systems for wireless and mobile communications. Circuit techniques and implementation of reconfigurable low-voltage and low-power single-chip CMOS transceivers for multiband and multi- mode universal wireless communications are the focus of the book. Applications encompass both long-range mobile cellular communications (GSM and UMTS) and short-range wireless LANs (IEEE802.11 and Bluetooth). Recent advances in research into transceiver architecture, RF frontend, analogue baseband, RF CAD and automatic testing are reported. 

    标签: Communication Wireless Circuits Systems and

    上传时间: 2020-06-01

    上传用户:shancjb