Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
上传时间： 2014-12-23
上传用户：han_zh
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
半導體的產品很多，應用的場合非常廣泛，圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline Package SOP：Small Outline Package SOJ：Small Outline J-Lead Package PLCC：Plastic Leaded Chip Carrier QFP：Quad Flat Package PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導體元件真正的的核心，是包覆在膠體或陶瓷內一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內部的晶片，圖三是以顯微鏡將內部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當引發過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發光二極體，其內部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負極的腳上，經由銲線連接正極的腳。當LED通過正向電流時，晶片會發光而使LED發亮，如圖六所示。 半導體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產品，稱為IC封裝製程，又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節中將簡介這兩段的製造程序。
上传时间： 2014-01-20
上传用户：苍山观海
RT7273是一颗完全跟TPS65251 PIN TO PIN 替换料号,一路进三路出,输出电流可以做到3A/2A/2A;如有需求请联系我：021-54262182 EXT 114(Eric) QQ：1187337351
上传时间： 2013-11-24
上传用户：fairy0212
R7732_7733_7735是Richpower公司推出的高效AC TO DC 电源PWM控制芯片,最大功率可以做到75W;如有需求请联系我电话：021-54262182EXT 114 (Eric) QQ ：1187337351
上传时间： 2013-11-20
上传用户：xz85592677
The CN3052A is a complete constant-current /constant voltage linear charger for single cell Li-ion and Li Polymer rechargeable batteries. The device contains an on-chip power MOSFET and eliminates the need for the external sense resistor and blocking diode.
上传时间： 2013-11-10
上传用户：子虚乌有
In this paper, two types of MMIC voltage controlled oscillators have been successfully demonstrated. The first chip with single tuning diode shows the excellent tuning linearity. The second chip with two tuning diodes can improve the tuning bandwidth.
上传时间： 2013-10-17
上传用户：xjz632
Typical industrial and automotive applications requiremultiple high current, low voltage power supply solutionsto drive everything from disc drives to microprocessors.For many of these applications, particularly thosethat have size constraints, the LT3501® dual step-downconverter is an attractive solution because it’s compactand inexpensive compared to a 2-chip solution. The dualconverter accommodates a 3V to 25V input voltage rangeand is capable of supplying up to 3A per channel. Thecircuit in Figure 1 produces 3.3V and 1.8V.
上传时间： 2014-12-24
上传用户：372825274
Providing power for the Pentium® microprocessor family isnot a trivial task by any means. In an effort to simplify thistask we have developed a new switching regulator controlcircuit and a new linear regulator to address the needs ofthese processors. Considerable time has been spent developingan optimized decoupling network. Here are severalcircuits using the new LTC®1266 synchronous buck regulatorcontrol chip and the LT®1584 linear regulator toprovide power for Pentium processors and Pentium VREprocessors. The Pentium processor has a supply requirementof 3.3V ±5%. The Pentium VRE processor requires3.500V ±100mV.
上传时间： 2013-11-01
上传用户：名爵少年
The P89LPC912/913/914 are single-chip microcontrollers in low-cost 14-pin packages, based on a high performance processor architecture that executes instructions in two to four clocks, six times the rate of standard 80C51 devices. Many system level functions have been incorporated into the P89LPC912/913/914 in order to reduce component count, board space, and system cost.
上传时间： 2013-10-12
上传用户：司令部正军级
