Applying power to a standard logic chip, SRAM, or EPROM, usually results in output pinstracking the applied voltage as it rises. Programmable logic attempts to emulate that behavior,but physics forbids perfect emulation, due to the device programmability. It requires care tospecify the pin behavior, because programmable parts encounter unknown variables – yourdesign and your power environment.
上传时间： 2013-11-24
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Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
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Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
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Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the developmentof designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit theDocumentation in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise,without the prior written consent of Xilinx. Xilinx expressly disclaims any liability arising out of your use of the Documentation. Xilinx reservesthe right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errorscontained in the Documentation, or to advise you of any corrections or updates. Xilinx expressly disclaims any liability in connection withtechnical support or assistance that may be provided to you in connection with the Information.
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The CoolRunner-II CPLD is a highly uniform family of fast, low-power devices. Theunderlying architecture is a traditional CPLD architecture, combining macrocells intofunction blocks interconnected with a global routing matrix, the Xilinx AdvancedInterconnect Matrix (AIM). The function blocks use a PLA configuration that allowsall product terms to be routed and shared among any of the macrocells of the functionblock.
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The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplifythe bridging of a high-speed, PCI-X core to large amounts of DDR-SDRAM memory. Onechallenge is meeting the PCI-X target initial latency specification. PCI-X Protocol Addendum tothe PCI Local Bus Specification Revision 2.0a ([Ref 6]) dictates that when a target signals adata transfer, "the target must do so within 16 clocks of the assertion of FRAME#." PCItermination transactions, such as Split Response/Complete, are commonly used to meet thelatency specifications. This method adds complexity to the design, as well as additional systemlatency. Another solution is to increase the ratio of the memory frequency to the PCI-X busfrequency. However, this solution increases the required power and clock resource usage.
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Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.
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Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
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WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
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This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
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