第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
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This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
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PADS Layout教程简介 欢迎使用PADS Layout教程。本教程由比思电子有限公司(KGS Technology Ltd.)编写，本公司是Mentor (以前的 Innoveda-PADS) PADS（以前的PowerPCB） 产品、APLAC 的射频和微波仿真工具、DPS 的电气图CAD系统在中国的授权代 理商。KGS公司自1989年开始，一直致力于PADS软件产品的销售和支持。 公司提供电子产品在原理样机设计开发阶段全面的解决方案。包括相关的 CAE/CAD/CAM等EDA软件、提供PCB设计服务、PCB样板加工制造、快速PCB 加工设备、PCB元器件装配。所有技术人员都具有十年以上的PCB设计领域从业 经历。
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this document is related to the orcad layout plus. this document is useful in understanding and starting the orcad pcb design tool layout plus.
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PCB电路板参考资料 设计的pcb电路板基本layout不限布局基础
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PADS Layout 的用户接口具有非常易于使用和有效的特点。PADS Layout 在满足专业用户需要的同时，还考虑到一些初次使用PCB 软件的用户需求。教程的这节将将覆盖以下内容：· 使用PADS Layout 进行交互操作· 工作空间的使用· 设置栅格(Grids)· 使用取景(Pan)和缩放(Zoom)· 面向目标(Object Oriented)的选取方式
标签： pads
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开关电源PCB布局布线教材， 开关电源的PCB设计(布局、排版、走线)规范.pdf_电子/电路_工程科技_专业资料。比较详细的讲述了PCB布线的一些小技巧 。Specification for PCB design (layout, layout and routing) of | switch power supply. Pdf_ electronics/circuits _ engineering technology _ professional information. More detailed about the PCB wiring some tips
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VIP专区-PCB源码精选合集系列（5）资源包含以下内容：1. 51单片机开发板原理图+pcb+sch文件.2. protues 7.0器件库名大全.3. 华为的电路板设计规范.4. ARM开发板原理图和PCB.5. AD9.4.0.20159破解补丁.6. protel99鼠标增强工具.7. Altium Designer 10破解工具.8. STC15xx-protel-lib.9. 按键消抖的方法.10. win7系统Protel99库文件添加小软件.exe.11. ALLEGRO封装库.12. mil与mm单位换算器.13. PCB封装库_99SE和DXP.14. 一款小巧PCB绘制软件.15. protel技术大全.16. PCB库及原理图库.17. AD09自制元件库.18. protel99元件库.19. PadsHelper 2726 Setup(cn).20. 封装库尺寸.21. cadence16.3安装与破解.22. 实践电磁兼容设计-PCB布线基本措施.23. si9000.24. CadenceAllegro16.5-破解方法.25. PADS Layout四层板设置学习教材.26. 电路设计与制版Protel99高级应用.27. pcb_layout_的指导思想与基本走线要求.28. PADS Logic_Layout原理图与电路板设计.29. 山寨制作电路板七种方法.30. DC-DC经典PCB布局.31. [Altium.Designer.6（6.6含破解文件）安装、升级总结].AD66Crack.32. 电子电焊机保护器之自恢复保险丝.33. 关于AD中如何添加LOGO的方法.34. protel_dxp规则设置.35. Altium.Designer.v10.0+keygen.36. AD中关于文件的打印（PDF）.37. 一个画板十年工程师总结PCB设计的经验（经典）.38. AD中关于Gerber文件的输出.39. protel_DXP第8章.40. PCB走线宽度标准（军用）.
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VIP专区-PCB源码精选合集系列（10）资源包含以下内容：1. Cadence_SPB16.2入门教程——PCB布线（三）.2. Allegro中遇到的问题.3. Cadence_SPB16.2入门教程——PCB布线（一）.4. Proteus的基本操作.5. Cadence_SPB16.2入门教程——PCB布线（二）.6. PCB设计制造常见问题.7. Cadence_SPB16.2入门教程——输出底片文件（一）.8. Altium_Designer电子工程师培训.9. pcb设计资料毕看.10. 热转印制PCB板中的打印设置.11. 10项protel常用设置.12. altium designer 10 正式版下载及安装PDF.13. PADS Layout把非中心对称封装的元件坐标导出所修改的Basic Scr.14. CH375评估板的原理图和PCB及USB的PCB布线示例.15. cadence讲义(清华大学微电子所).16. AD快捷键汇总.17. 240*128液晶的驱动电路（PCB）.18. pcb经验(耗费多年整理于论坛).19. PCB设计要求简介.20. PADS学习资料.21. 印刷电路板的设计过程.22. ipc7351标准介绍.23. Mark点（基准点）设计规范.24. Altium Designer 6 三维元件库建模教程.25. 印制电路板图设计指南.26. 中兴通讯硬件巨作:信号完整性基础知识.27. 华为pcb培训.28. ORCAD使用中常见问题汇集及答案.29. 简述PCB线宽和电流关系.30. AltiumDesignerSummer9Build9破解.31. ORCAD基本问题集成.32. 射频电路板设计技巧.33. PCB设计基础知识（全 ）.34. ORCAD原理图中替换器件属性.35. PCB设计时铜箔厚度,走线宽度和电流的关系.36. PADS9.0Demo.37. PCB元件封装设计规范.38. DDR走线要点.39. 2007 Release Highlight CN.40. Genesis2000线路的处理步骤.
标签： 压电器件
上传时间： 2013-06-23
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VIP专区-PCB源码精选合集系列（11）资源包含以下内容：1. PADS导出Gerber文件.2. 2005 SP2 Release Highlight CN.3. 如何在Altium_Designer软件的PCB编辑器插入自己的LOGO.4. PRO/cabling 三维布线.5. PADS_教程－高级封装设计.6. Altium Designer Winter 09原理图及PCB设计简明教程.7. PCB接地设计.8. PCB元件封装的设计规范.9. Altium.Designer.6.0.中文手册.10. PCB封装库命名的细规则.11. PCB入门大全很棒的.12. PCB图设计技巧.13. 超强布线经验教程大全.14. PCB设计技巧问答.15. PADS LAYOUT入门教程.16. 多层板PCB设计教程完整版.17. 自制电路板制作PCB的过程.18. 改善EMC的PCB设计.19. PADS原理图与PCB设计学习计划.20. PCB制作步骤全过程.21. ORCAD PSPICE 16.5crack文件.22. PCB资料.23. Altium+Designer+winter+09电路设计案例教程.24. PADS经验分享.25. 印刷电路板相关问题解答.26. 手工制作PCB流程.27. Altium.Designer 9.0破解文件.28. PROTUS中元件英文缩写.29. 德州仪器的库文件.30. 浅谈原理图和PCB图的常见错误.31. 功放放大器原理图pcb自制符号和封装.32. PCB多层板设计建议及实例.33. PADS2007_ROUTER中文教程.34. PADS_LOGIC从零开始学习.35. LQFP封装制作.36. 芯片封装方式大全.37. 原创看图快速学PADS_LAYOUT_PCB拼板教程.38. pads提高高速设计流程.39. Altium designer summer 09 精典教材---绝佳.40. 元器件封装的含义.
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