ADS-B接收机PCB电路板Mode-S Beast快速ADSB指南
标签： Mode-S ADS-B Beast PCB 接收机 电路板
上传时间： 2016-05-24
上传用户：gzzy2013
某新手在论坛上发了一篇帖子，把自己的处女PCB布线图贴出来。 另外还提出了自己的小见解：问一下，我觉得自动布线挺好用的啊，只要布局好了，规则设置好了，很快就能生成图。为什么都说自动布线不好。
上传时间： 2021-11-12
上传用户：trh505
AC220V转DC(12V15W )电源板AD设计硬件原理图+PCB文件，2层板设计，大小为100*55mm, ALTIUM设计的原理图+PCB文件，可以做为你的学习设计参考。主要器件型号如下：Library Component Count : 24Name Description----------------------------------------------------------------------------------------------------2N3904 NPN General Purpose Amplifier2N3906 PNP General Purpose AmplifierBRIDGE1 Diode BridgeCON2 ConnectorCap CapacitorCap Pol1 Polarized Capacitor (Radial)D Zener Zener DiodeDIODE Diode 1N914 High Conductance Fast DiodeECELECTRO2 Electrolytic CapacitorFP103 FUSE-HHeader 2 Header, 2-PinINDUCTOR2 NMOS-2 N-Channel Power MOSFETPC837 OptoisolatorRES2-B Res Varistor Varistor (Voltage-Sensitive Resistor)T TR-2B TRANS1UCC28051 Volt Reg Voltage Regulator
上传时间： 2021-11-21
上传用户：kent
Altium Designer 19全套入门技巧：相同模块的快速布局布线复用
上传时间： 2022-04-17
上传用户：
制作基于PIC Mcu 的ADS-B接收机的全套资料，包括SCH、PCB、源码和PC端软件。
上传时间： 2013-04-24
上传用户：cx111111
产品设计越来越趋向小型化，功能多样化，并对 SI，EMC 设计要求更为苛刻（如产品需认证SISPR16 CALSS B），根据单板的电源、地的种类、信号密度、板级工作频率、有特殊布线要求的信号数量，适当增加地平面是PCB 的EMC 设计的杀手锏之一。单面板，双面板已不能够满足复杂PCB 的设计要求，本文以四层板举例，讲述四层板的设置和相关的一些设计技巧，文中的有些观点，建议因为水平有限，错误之处在所难免，还望大家不断批评、指正。
上传时间： 2013-10-17
上传用户：龙飞艇
《PCB设计技巧百问》
上传时间： 2013-11-14
上传用户：dudu1210004
在进行PCB布线时需要注意的各种问题，如何走线，如何布局
上传时间： 2013-11-25
上传用户：hebanlian
PCB设计技巧
上传时间： 2013-12-11
上传用户：181992417
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
