使用新电源模块改进表面贴装可制造性
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnec...
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnec...
Nios II软件构建工具入门 The Nios® II Software Build Tools (SBT) allows you to construct a wide variety o...
欢迎使用 PowerPCB 教程。本教程描述了 PADS-PowerPCB 的绝大部分功能和特点,以及使用的各个过程,这些功能包括: · 基本操作 · 建立元件(Component) · ...
PCB设计问题集锦 问:PCB图中各种字符往往容易叠加在一起,或者相距很近,当板子布得很密时,情况更加严重。当我用Verify Design进行检查时,会产生错误,但这种错误可以忽略。往往这种错误很多...
半導體的產品很多,應用的場合非常廣泛,圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別,圖一中不同類別的英文縮寫名稱原文為 PDID:Plastic Dua...
This was the public transportation inquiry system software engineering design documents, including t...
This was the public transportation inquiry system software engineering design documents, including t...
This was the public transportation inquiry system software engineering design documents, including t...
This was the public transportation inquiry system software engineering design documents, including t...
This was the public transportation inquiry system software engineering design documents, including t...