3D Graphics Modelling and Rendering3D计算机图形造型与渲染
标签： Rendering3D Modelling Graphics and
上传时间： 2017-09-03
上传用户：ruan2570406
solution for the Statistical modelling for digital signal processing by hayes
标签： Statistical processing for modelling
上传时间： 2017-09-26
上传用户：dbs012280
'Physics Toy(物理玩具)是zh1110设计的一款2D物理模拟软件,仿制了真实环境物体的各种连接与碰撞效果 应用介绍： 少年智力开发，学校物理课程指导，各种机构运动的研究 基于冲量的刚体铰链与碰撞,销限制铰接计算出链、摆、小车等模型,通过与扭簧配合模拟出玩具木马模型 仿真真实世界物理状态，建立了可用户控制的功能,达成了如同儿童玩具房的环境
标签： Physics Toy 2D物理模拟 VB
上传时间： 2015-05-22
上传用户：ynitqi
Optimization Modelling A Practical Approach Ruhul A. Sarker Charles S. Newton
标签： 数学建模
上传时间： 2016-02-15
上传用户：jh442755_1
·JOHN DANIEL KRAUS: 94 DIED 18 July 2004 MEMBER GRADE Life Fellow EDUCATION Bachelors, masters, and doctorate-all in physics from the University of Michigan, Ann Arbor, USA FIELDS OF INTEREST Electroma
标签： nbsp Applications Antennas Edition
上传时间： 2013-07-29
上传用户：ukuk
用matlab编写的 Hidden Markov Modelling 工具包 应用便捷 在国外网站找到的 还不错
上传时间： 2013-07-26
上传用户：ywqaxiwang
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上传时间： 2014-12-23
上传用户：xinhaoshan2016
模拟集成电路的设计与其说是一门技术，还不如说是一门艺术。它比数字集成电路设计需要更严格的分析和更丰富的直觉。严谨坚实的理论无疑是严格分析能力的基石，而设计者的实践经验无疑是诞生丰富直觉的源泉。这也正足初学者对学习模拟集成电路设计感到困惑并难以驾驭的根本原因。.美国加州大学洛杉机分校(UCLA)Razavi教授凭借着他在美国多所著名大学执教多年的丰富教学经验和在世界知名顶级公司(AT&T，Bell Lab，HP)卓著的研究经历为我们提供了这本优秀的教材。本书自2000午出版以来得到了国内外读者的好评和青睐，被许多国际知名大学选为教科书。同时，由于原著者在世界知名顶级公司的丰富研究经历，使本书也非常适合作为CMOS模拟集成电路设计或相关领域的研究人员和工程技术人员的参考书。... 本书介绍模拟CMOS集成电路的分析与设计。从直观和严密的角度阐述了各种模拟电路的基本原理和概念，同时还阐述了在SOC中模拟电路设计遇到的新问题及电路技术的新发展。本书由浅入深，理论与实际结合，提供了大量现代工业中的设计实例。全书共18章。前10章介绍各种基本模块和运放及其频率响应和噪声。第11章至第13章介绍带隙基准、开关电容电路以及电路的非线性和失配的影响，第14、15章介绍振荡器和锁相环。第16章至18章介绍MOS器件的高阶效应及其模型、CMOS制造工艺和混合信号电路的版图与封装。 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging
上传时间： 2014-12-23
上传用户：杜莹12345
Abstract: Engineers often wish that radio susceptibility (RS) or radio immunity could be cured with an antibiotic, a vaccine, or someform of cure-all. Unfortunately, solving the RS problem is not that easy. Indeed, the laws of physics apply. In this article we discusssources of RS. We also offer tips and hints to protect systems, power supplies, printed circuit boards (PCBs), and electroniccomponents from radio frequency interference.
标签： Susceptibility Radio 无线电干扰
上传时间： 2014-12-30
上传用户：旗鱼旗鱼
It would not be an exaggeration to say that semiconductor devices have transformed humanlife. From computers to communications to internet and video games these devices and the technologies they have enabled have expanded human experience in a way that is unique in history. Semiconductor devices have exploited materials, physics and imaginative applications to spawn new lifestyles. Of course for the device engineer, in spite of the advances, the challenges of reaching higher frequency, lower power consumption, higher power generation etc.
上传时间： 2013-10-28
上传用户：songnanhua
