The PW3130 series product is a high integration solution for lithium-lion/polymer batteryprotection.PW3130 contains advanced power MOSFET, high-accuracy voltage detection circuits anddelay circuits. PW3130 is put into an ultra-small SOT23-5 package and only one external componentmakes it an ideal solution in limited space of battery pack. PW3130 has all the protection functionsrequired in the battery application including overcharging, overdischarging, overcurrent and loadshort circuiting protection etc. The accurate overcharging detection voltage ensures safe and fullutilization charging.The low standby current drains little current from the cell while in storage. Thedevice is not only targeted for digital cellular phones, but also for any other Li-Ion and Li-Polybattery-powered information appliances requiring long-term battery life
标签： pw3130
上传时间： 2022-02-11
上传用户：fliang
某客户在其产品的设计中，使用了STM32F411。由于产品外观的要求，无法在外部对BOOT 脚进行控制，而且外观上只有USB 接口是留在外边的，需要使用USB DFU 进行升级。而且USB接口只用于代码升级，没有其他功能，所以客户不想去碰USB 代码，希望能够直接使用System Memory 中的Bootloader 进行代码升级。
标签： 存储器 bootloader
上传时间： 2022-02-22
上传用户：aben
部分STM32 是具有空片检测功能的，以便直接进入System Memory 中执行Bootloader，方便通过某些个外设来直接进行编程。比如STM32L011xx、STM32L021xx、STM32F04x和STM32F09x。有看过《STM32F091 空片使用System Bootloader下载代码》和《STM32L011x 和STM32L021x启动模式注意事项》的都知道这个功能。
上传时间： 2022-02-22
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Single chip TFT-LCD Controller/Driver with On-chip Frame Memory (FM) Display Resolution: 240*RGB (H) *320(V) Frame Memory Size: 240 x 320 x 18-bit = 1,382,400 bits LCD Driver Output Circuits- Source Outputs: 240 RGB Channels- Gate Outputs: 320 Channels- Common Electrode Output Display Colors (Color Mode)- Full Color: 262K, RGB=(666) max., Idle Mode Off- Color Reduce: 8-color, RGB=(111), Idle Mode On Programmable Pixel Color Format (Color Depth) for Various Display Data input Format- 12-bit/pixel: RGB=(444)- 16-bit/pixel: RGB=(565)- 18-bit/pixel: RGB=(666) MCU Interface- Parallel 8080-series MCU Interface (8-bit, 9-bit, 16-bit & 18-bit)- 6/16/18 RGB Interface(VSYNC, HSYNC, DOTCLK, ENABLE, DB[17:0])- Serial Peripheral Interface(SPI Interface)- VSYNC Interface
上传时间： 2022-03-04
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驱动芯片资料ST7735S规格书132RGB x 162dot 262K Color with Frame Memory Single-Chip TFT Controller/Driver
标签： 驱动芯片
上传时间： 2022-03-24
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研究一种智能扫地机器人。从硬件系统控制模块设计到主要技术调试进行了较详细的阐述。以STM32单片机为控制核心与电机驱动、红外线路径识别模块等相互协调应用。进行电路搭建和程序编写。实现了智能扫地机器人红外线避障和自动扫地功能,其清扫面积能达到约70%,清扫率约60%,很大程度受到自身机械机构的限制,后期将对小车的机械结构进行完善。This paper studies an intelligent sweeping robot.From the hardware system control module design to the main technical debugging are described in detail.STM32 MCU is used as the control core to coordinate with motor drive and infrared path recognition module.Conduct circuit building and programming.The functions of infrared obstacle avoidance and automatic sweeping of intelligent sweeping robot are realized.Its cleaning area can reach about 70%and the cleaning rate is about 60%.Because it is limited by its own mechanical mechanism to a great extent,the mechanical structure of the car will be improved in the later stage.
标签： 扫地机器人
上传时间： 2022-03-26
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目前cPU+ Memory等系统集成的多芯片系统级封装已经成为3DSiP（3 Dimension System in Package，三维系统级封装）的主流，非常具有代表性和市场前景，SiP作为将不同种类的元件，通过不同技术，混载于同一封装内的一种系统集成封装形式，不仅可搭载不同类型的芯片，还可以实现系统的功能。然而，其封装具有更高密度和更大的发热密度和热阻，对封装技术具有更大的挑战。因此，对SiP封装的工艺流程和SiP封装中的湿热分布及它们对可靠性影响的研究有着十分重要的意义本课题是在数字电视（DTV）接收端子系统模块设计的基础上对CPU和DDR芯片进行芯片堆叠的SiP封装。封装形式选择了适用于小型化的BGA封装，结构上采用CPU和DDR两芯片堆叠的3D结构，以引线键合的方式为互连，实现小型化系统级封装。本文研究该SP封装中芯片粘贴工艺及其可靠性，利用不导电胶将CPU和DDR芯片进行了堆叠贴片，分析总结了SiP封装堆叠贴片工艺最为关键的是涂布材料不导电胶的体积和施加在芯片上作用力大小，对制成的样品进行了高温高湿试验，分析湿气对SiP封装的可靠性的影响。论文利用有限元软件 Abaqus对SiP封装进行了建模，模型包括热应力和湿气扩散模型。模拟分析了封装体在温度循环条件下，受到的应力、应变、以及可能出现的失效形式：比较了相同的热载荷条件下，改变塑封料、粘结层的材料属性，如杨氏模量、热膨胀系数以及芯片、粘结层的厚度等对封装体应力应变的影响。并对封装进行了湿气吸附分析，研究了SiP封装在85℃RH85%环境下吸湿5h、17h、55和168h后的相对湿度分布情况，还对SiP封装在湿热环境下可能产生的可靠性问题进行了实验研究。在经过168小时湿气预处理后，封装外部的基板和模塑料基本上达到饱和。模拟结果表明湿应力同样对封装的可靠性会产生重要影响。实验结果也证实了，SiP封装在湿气环境下引入的湿应力对可靠性有着重要影响。论文还利用有限元分析方法对超薄多芯片SiP封装进行了建模，对其在温度循环条件下的应力、应变以及可能的失效形式进行了分析。采用二水平正交试验设计的方法研究四层芯片、四层粘结薄膜、塑封料等9个封装组件的厚度变化对芯片上最大应力的影响，从而找到最主要的影响因子进行优化设计，最终得到更优化的四层芯片叠层SiP封装结构。
标签： sip封装
上传时间： 2022-04-08
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S32K1xx Series Reference Manual 用户手册--2029页 Supports S32K116, S32K118, S32K142, S32K144, S32K146, and S32K148S32K是一款符合AEC-Q100规范、基于32位ARM Cortex-M4F和Cortex-M0+内核的MCU，适用于通用汽车和高可靠性工业应用。The S32K1xx product series further extends the highly scalable portfolio of Arm® Cortex®-M0+/M4F MCUs in the automotive industry. It builds on the legacy of the KEA series, while introducing higher memory options alongside a richer peripheral set extending capability into a variety of automotive applications. With a 2.70–5.5 V supply and focus on automotive environment robustness, the S32K product series devices are well suited to a wide range of applications in electrically harsh environments, and are optimized for cost-sensitive applications offering low pin-count options. The S32K product series offers a broad range of memory, peripherals, and package options. It shares common peripherals and pin counts, allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to use the S32K product series as the standard for their end product platforms, maximizing hardware and software reuse and reducing time to market
标签： S32K116 S32K118 S32K142 S32K144
上传时间： 2022-04-16
上传用户：jason_vip1
意法半导体STM8系列参考手册Program memory: 8 Kbyte Flash memory; dataretention 20 years at 55 °C after 100 cycles• RAM: 1 Kbyte• Data memory: 128 bytes true data EEPROM;endurance up to 100 k write/erase cycles
标签： stm8
上传时间： 2022-04-27
上传用户：zhaiyawei
This manual documents the Microcontroller profile of version 7 of the ARM® Architecture, the ARMv7-M architecture profile. For short definitions of all the ARMv7 profiles see About the ARMv7 architecture, and architecture profiles on page A1-20.ARMv7 is documented as a set of architecture profiles. The profiles are defined as follows: ARMv7-A The application profile for systems supporting the ARM and Thumb instruction sets, and requiring virtual address support in the memory management model. ARMv7-R The realtime profile for systems supporting the ARM and Thumb instruction sets, and requiring physical address only support in the memory management model ARMv7-M The microcontroller profile for systems supporting only the Thumb instruction set, and where overall size and deterministic operation for an implementation are more important than absolute performance. While profiles were formally introduced with the ARMv7 development, the A-profile and R-profile have implicitly existed in earlier versions, associated with the Virtual Memory System Architecture (VMSA) and Protected Memory System Architecture (PMSA) respectively.
标签： arm
上传时间： 2022-06-02
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