第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
磁芯电感器的谐波失真分析 摘 要：简述了改进铁氧体软磁材料比损耗系数和磁滞常数ηB，从而降低总谐波失真THD的历史过程，分析了诸多因数对谐波测量的影响，提出了磁心性能的调控方向。 关键词：比损耗系数， 磁滞常数ηB ，直流偏置特性DC-Bias，总谐波失真THD Analysis on THD of the fer rite co res u se d i n i nductancShi Yan Nanjing Finemag Technology Co. Ltd., Nanjing 210033 Abstract: Histrory of decreasing THD by improving the ratio loss coefficient and hysteresis constant of soft magnetic ferrite is briefly narrated. The effect of many factors which affect the harmonic wave testing is analysed. The way of improving the performance of ferrite cores is put forward. Key words: ratio loss coefficient，hysteresis constant，DC-Bias，THD 近年来，变压器生产厂家和软磁铁氧体生产厂家，在电感器和变压器产品的总谐波失真指标控制上，进行了深入的探讨和广泛的合作，逐步弄清了一些似是而非的问题。从工艺技术上采取了不少有效措施，促进了质量问题的迅速解决。本文将就此热门话题作一些粗浅探讨。 一、 历史回顾 总谐波失真（Total harmonic distortion） ，简称THD，并不是什么新的概念，早在几十年前的载波通信技术中就已有严格要求<1>。1978年邮电部公布的标准YD/Z17－78“载波用铁氧体罐形磁心”中，规定了高μQ材料制作的无中心柱配对罐形磁心详细的测试电路和方法。如图一电路所示，利用LC组成的150KHz低通滤波器在高电平输入的情况下测量磁心产生的非线性失真。这种相对比较的实用方法，专用于无中心柱配对罐形磁心的谐波衰耗测试。 这种磁心主要用于载波电报、电话设备的遥测振荡器和线路放大器系统，其非线性失真有很严格的要求。 图中 ZD —— QF867 型阻容式载频振荡器，输出阻抗 150Ω， Ld47 —— 47KHz 低通滤波器，阻抗 150Ω，阻带衰耗大于61dB， Lg88 ——并联高低通滤波器，阻抗 150Ω，三次谐波衰耗大于61dB Ld88 ——并联高低通滤波器，阻抗 150Ω，三次谐波衰耗大于61dB FD —— 30～50KHz 放大器， 阻抗 150Ω， 增益不小于 43 dB，三次谐波衰耗b3(0)≥91 dB, DP —— Qp373 选频电平表，输入高阻抗， L ——被测无心罐形磁心及线圈， C ——聚苯乙烯薄膜电容器CMO-100V-707APF±0.5%,二只。 测量时，所配用线圈应用丝包铜电磁线SQJ9×0.12(JB661-75)在直径为16.1mm的线架上绕制 120 匝， （线架为一格） ， 其空心电感值为 318μH（误差1％） 被测磁心配对安装好后，先调节振荡器频率为 36.6～40KHz， 使输出电平值为+17.4 dB， 即选频表在 22′端子测得的主波电平 （P2）为+17.4 dB，然后在33′端子处测得输出的三次谐波电平（P3）， 则三次谐波衰耗值为：b3(+2)= P2+S+ P3 式中：S 为放大器增益dB 从以往的资料引证， 就可以发现谐波失真的测量是一项很精细的工作，其中测量系统的高、低通滤波器，信号源和放大器本身的三次谐波衰耗控制很严，阻抗必须匹配，薄膜电容器的非线性也有相应要求。滤波器的电感全由不带任何磁介质的大空心线圈绕成，以保证本身的“洁净” ，不至于造成对磁心分选的误判。 为了满足多路通信整机的小型化和稳定性要求， 必须生产低损耗高稳定磁心。上世纪 70 年代初，1409 所和四机部、邮电部各厂，从工艺上改变了推板空气窑烧结，出窑后经真空罐冷却的落后方式，改用真空炉，并控制烧结、冷却气氛。技术上采用共沉淀法攻关试制出了μQ乘积 60 万和 100 万的低损耗高稳定材料，在此基础上，还实现了高μ7000～10000材料的突破，从而大大缩短了与国外企业的技术差异。当时正处于通信技术由FDM（频率划分调制）向PCM（脉冲编码调制） 转换时期， 日本人明石雅夫发表了μQ乘积125 万为 0.8×10 ，100KHz）的超优铁氧体材料<3>，其磁滞系数降为优铁
上传时间： 2014-12-24
上传用户：7891
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their specifications isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.
上传时间： 2013-11-17
上传用户：asdfasdfd
Digitemp Junior – An RS-232 Port-Powered Digital Thermometer Digitemp Jr. is a device that is designed to measure and report ambient temperature. When connected to an RS-232 port on any PC, it will periodically measure and report in ASCII form the ambient temperature in degrees Celsius. These temperature readings can be monitored with any terminal program. If the terminal program supports capture to disk, the temperature readings can be saved to disk for further analysis with a spreadsheet program or other data analysis tool. The simple ASCII output format of Digitemp Jr. makes it rel- atively easy to write custom software for receiving, recording, and analyzing ambient temperature data. Best of all, Digitemp Jr. requires no external power sup- plies or batteries. It is powered directly by the RS-232 port.
上传时间： 2013-10-21
上传用户：baitouyu
为了使音频信号分析仪小巧可靠，成本低廉，设计了以2片MSP430F1611单片机为核心的系统。该系统将音频信号送入八阶巴特沃兹低通滤波器，对信号进行限幅放大、衰减、电平位移、缓冲，并利用一单片机负责对前级处理后的模拟信号进行采样，将采集得到的音频信号进行4 096点基2的FFT计算，并对信号加窗函数提高分辨率，另一单片机负责对信号的分析及控制显示设备。此设计精确的测量了音频信号的功率谱、周期性、失真度指标，达到较高的频率分辨率，并能将测量结果通过红外遥控器显示在液晶屏上。 Abstract: o make the audio signal analyzer cheaper， smaller and more reliable， this system sends the audio signal to the eight-order butterworth filter， and then amplifies， attenuates， buffers it in a limiting range， transfers the voltage level of the signal before utilizing two MSP430F1611 MCU to realize the audio analysis. One is charged for sampling and dealing with the processed audio signal collected by the 4096 point radix-2 FFT calculation and imposes the window function to improve the frequency resolution. The other one controls the display and realizes the spectrum， periodicity， power distortion analysis in high resolution which is displayed in the LCD screen through the infrared remote control.
上传时间： 2013-12-11
上传用户：jasonheung
设计了一种基于PIC16C71单片机的数字水温配制阀。该配制阀采用NTC热敏电阻作温度传感器，与固定电阻组成简单分压电路作为水温测量电路，利用PIC16C71单片机内置的8位A/D转换器把热敏电阻上的模拟电压转换为数字量，PIC16C71单片机控制直流电机驱动混水阀调节冷热水的混合比例实现水温调节。给出了控制电路图，对水温测量电路的参数选择和测温精度作了详细讨论。实验和分析表明，选用阻值较大的NTC热敏电阻和分压电阻可较好地解决热敏电阻因功耗较大造成的热击穿问题。 Abstract: A digital valve for controlling water temperature based on PIC16C71 was presented in this paper.A bleeder circuit which consisted of a NTC thermistor as temperature sensor and a fixed resistance was designed as water temperature measuring circuit.The analog voltage on the thermistor was converted into digital signal by a 8-bit A/D converter embedded in PIC16C71. Based on the digital signal， the MCU PIC16C71 drived the valve by a DC motor to adjust the water temperature through adjusting the proportion of hot water and cold water.The circuit diagram of controller was given，the principle，the component parameters and the accuracy of measuring temperatures were also dissertated in detail. It was found by experiment and analysis that thermal breakdown of thermistor caused by high power could be solved by selecting thermistor and fixed resistance with high impedance value.
上传时间： 2013-11-08
上传用户：Yue Zhong
在航电系统维护过程中，为解决定位故障的效率和降低维修成本等问题，提出了基于ICD（Interface Control Document，接口控制文件）的1553B总线的信息监控系统模型。该系统运用数据采集卡对总线中传输的信号有无失真、偏差等电气特性进行检测，并使用1553B通讯卡通过测控软件LabWindows/CVI编程与ICD数据库的动态链接，实现总线信息的解析和故障的判断。与传统的维护过程相比，这种模型能够从信号的电气特性以及信息的解析等全方位的去检测判断故障的来源，并且能够广泛在其他1553B总线系统内扩展应用。验证表明该监控系统可以对总线信息进行快速有效地监测分析，能满足应用需求。 Abstract: In the process of avionics system maintenance， to solve the problems such as improving the efficiency of fast orientation to troubles and reducing maintenance cost， system of 1553B bus information monitor model based on ICD was proposed. The system observed whether the data which transmitted on the bus appear distortion and deviation by using data acquisition card. And using 1553B communication card programming of the measure software LabWindows/CVI and the dynamic linking of ICD database， message analysis and fault estimation could be realized. Compared with traditional maintenance， this model can all-dimensionally detect and analyze the source of faults from both electrical characteristics of the signal and message analysis， and it can be widely applied in the other 1553B system. Experiment shown that this monitor system can effectively detect and analyze the bus message and can meet the application requirements.
上传时间： 2013-11-23
上传用户：18752787361
Digitemp Jr. is a device that is designed to measure and report ambient temperature. When connected to an RS-232 port on any PC, it will periodically measure and report in ASCII form the ambient temperature in degrees Celsius. These temperature readings can be monitored with any terminal program. If the terminal program supports capture to disk, the temperature readings can be saved to disk for further analysis with a spreadsheet program or other data analysis tool. The simple ASCII output format of Digitemp Jr. makes it relatively easy to write custom software for receiving, recording, and analyzing ambient temperature data. Best of all, Digitemp Jr. requires no external power supplies or batteries. It is powered directly by the RS-232 port.
上传时间： 2013-10-20
上传用户：Maple
以太网和CAN总线应用广泛，但由于其通信协议不同，两种总线器件间无法进行数据通信，因此，设计了基于CP2200与C8051F040的以太网总线与CAN总线接口转换电路，并给出部分相关硬件电路与软件设计分析。在保证数据完整和协议可靠的前提下，通过握手协议和简化的以太网协议，不仅实现了以太网数据与CAN数据的转发，同时还顺利的解决了以太网的高速性与CAN的低速率冲突，以及两者数据包之间的大小不同的矛盾。 Abstract: In the development of actual application， Ethernet and CAN bus are used very extensively. Owing to its various communication protocols， the communicating between two kinds of bus device can’t be carried out. Therefore， in order to solve this problem， the Ethernet-CAN bus interface circuit based on CP2200 and C8051F040 was designed in this paper， and part of the related hardware circuit and software design analysis were given. On the condition of data’s integrity and protocols’reliability， through the handshaking protocols and the simplified the Ethernet protocol， not only the data switching between CAN and Ethernet was realized， but also the differ in velocity and packet size was solved.
上传时间： 2013-10-15
上传用户：Ants
