IC封裝製程簡介(IC封装制程简介)
半導體的產品很多,應用的場合非常廣泛,圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別,圖一中不同類別的英文縮寫名稱原文為 PDID:Plastic Dual Inline Package SOP:Small Outline Package SOJ:Sma...
半導體的產品很多,應用的場合非常廣泛,圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別,圖一中不同類別的英文縮寫名稱原文為 PDID:Plastic Dual Inline Package SOP:Small Outline Package SOJ:Sma...
DC/DC升压IC ,LDO稳压IC,锂电池充电IC,恒流IC,LED驱动IC ,电压检测IC,降压IC,AC-DC,MOS管等电源管理芯片。...
Boost LED drivers are often used to drive LEDs in series. If an LED fails while open,overvoltage protection (OVP) is necessary to avoid the damage to ...
The LTP5901 and LTP5902 require little external circuitry, as the devices references,decoupling and power supply filtering are integrated. The LTP59...
NU501是一款线性定电流IC,品种为15-60mA,每5mA分为一档,具有应用简单,用途宽广,精度高等特点。...