A major societal challenge for the decades to come will be the delivery of effective medical services while at the same time curbing the growing cost of healthcare. It is expected that new concepts-particularly electronically assisted healthcare will provide an answer. This will include new devices, new medical services as well as networking. On the device side, impressive innovation has been made possible by micro- and nanoelectronics or CMOS Integrated Circuits. Even higher accuracy and smaller form factor combined with reduced cost and increased convenience of use are enabled by incorporation of CMOS IC design in the realization of biomedical systems. The compact hearing aid devices and current pacemakers are good examples of how CMOS ICs bring about these new functionalities and services in the medical field. Apart from these existing applications, many researchers are trying to develop new bio-medical solutions such as Artificial Retina, Deep Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining the recent advances of bio-medical technology with low power CMOS IC technology.
上传时间： 2017-02-06
上传用户：linyj
The AP2406 is a 1.5Mhz constant frequency, slope compensated current mode PWM step-down converter. The device integrates a main switch and a synchronous rectifier for high efficiency without an external Schottky diode. It is ideal for powering portable equipment that runs from a single cell lithium-Ion (Li+) battery. The AP2406 can supply 600mA of load current from a 2.5V to 5.5V input voltage. The output voltage can be regulated as low as 0.6V. The AP2406 can also run at 100% duty cycle for low dropout operation, extending battery life in portable system. Idle mode operation at light loads provides very low output ripple voltage for noise sensitive applications. The AP2406 is offered in a low profile (1mm) 5-pin, thin SOT package, and is available in an adjustable version and fixed output voltage of 1.2V, 1.5V and 1.8V
上传时间： 2017-02-23
上传用户：w124141
是否要先打开ALLEGRO? 不需要(当然你的机器须有CADENCE系统)。生成完封装后在你的输出目录下就会有几千个器件（全部生成的话）,默认输出目录为c:\MySym\. Level里面的Minimum, Nominal, Maximum 是什么意思？ 对应ipc7351A的ABC封装吗？ 是的 能否将MOST, NOMINAL, LEAST三种有差别的封装在命名上也体现出差别？ NOMINAL 的名称最后没有后缀，MOST的后缀自动添加“Ｍ”，LEAST的后缀自动添加“L”，你看看生成的库名称就知道了。（直插件以及特别的器件，如BGA等是没有MOST和LEAST级别的，对这类器件只有NOMINAL） IC焊盘用长方形好像比用椭圆形的好，能不能生成长方形的？ 嗯。。。。基本上应该是非直角的焊盘比矩形的焊盘好，我记不得是AMD还是NS还是AD公司专门有篇文档讨论了这个问题，如果没有记错的话至少有以下好处：信号质量好、更省空间（特别是紧密设计中）、更省锡量。我过去有一篇帖子有一个倒角焊盘的SKILL，用于晶振电路和高速器件（如DDR的滤波电容)，原因是对宽度比较大的矩形用椭圆焊盘也不合适，这种情况下用自定义的矩形倒角焊盘就比较好了－－－你可以从网上另外一个DDR设计的例子中看到。 当然，我已经在程序中添加了一选择项，对一些矩形焊盘可以选择倒角方式. 刚才试了一下，感觉器件的命名的规范性不是太好，另好像不能生成器件的DEVICE文件，我没RUN完。。。 这个程序的命名方法基本参照IPC-7351，每个人都有自己的命名嗜好，仍是不好统一的；我是比较懒的啦，所以就尽量靠近IPC-7351了。 至于DEVICE，的选项已经添加 (这就是批量程序的好处，代码中加一行，重新生产的上千上万个封装就都有新东西了)。 你的库都是"-"的,请问用过ALLEGRO的兄弟,你们的FOOTPRINT认"-"吗?反正我的ALLEGRO只认"_"(下划线) 用“－”应该没有问题的，焊盘的命名我用的是"_"（这个一直没改动过）。 部分丝印画在焊盘上了。 丝印的问题我早已知道，只是尽量避免开（我有个可配置的SilkGap变量）,不过工作量比较大，有些已经改过，有些还没有；另外我没有特别费功夫在丝印上的另一个原因是，我通常最后用AUTO-SILK的来合并相关的层，这样既方便快捷也统一各个器件的丝印间距，用AUTO-SILK的话丝印线会自动避开SOLDER-MASK的。 点击allegro后命令行出现E- Can't change to directory: Files\FPM，什么原因？ 我想你一定是将FPM安装在一个含空格的目录里面了，比如C:\Program Files\等等之类，在自定义安装目录的时候该目录名不能含有空格，且存放生成的封装的目录名也不能含有空格。你如果用默认安装的话应该是不会有问题的, 默认FPM安装在C:\FPM，默认存放封装的目录为C:\MYSYM 0.04版用spb15.51生成时.allegro会死机.以前版本的Allegro封装生成器用spb15.51生成时没有死机现象 我在生成MELF类封装的时候有过一次死机现象，估计是文件操作错误导致ALLEGRO死机，原因是我没有找到在ｓｋｉｌｌ里面直接生成SHAPE焊盘的方法（FLASH和常规焊盘没问题）, 查了下资料也没有找到解决方法，所以只得在外部调用SCRIPT来将就一下了。（下次我再查查看），用SCRIPT的话文件访问比较频繁（幸好目前MELF类的器件不多）. 解决办法： １、对MELF类器件单独选择生成，其它的应该可以一次生成。 ２、试试最新的版本(当前0.05) 请说明运行在哪类器件的时候ALLEGRO出错，如果不是在MELF附近的话，请告知，谢谢。 用FPM0.04生成的封装好像文件都比较大，比如CAPC、RES等器件，都是300多K，而自己建的或采用PCB Libraries Eval生成的封装一般才几十K到100K左右，不知封装是不是包含了更多的信息？ 我的每个封装文件包含了几个文字层（REF,VAL,TOL,DEV,PARTNUMBER等),SILK和ASSEM也是分开的，BOND层和高度信息，还有些定位线(在DISP层）,可能这些越来越丰富的信息加大了生成文件的尺寸.你如果想看有什么内容的话，打开所有层就看见了（或REPORT） 非常感谢 LiWenHui 发现的BUG, 已经找到原因，是下面这行： axlDBChangeDesignExtents( '((-1000 -1000) (1000 1000))) 有尺寸空间开得太大，后又没有压缩的原因，现在生成的封装也只有几十K了，0.05版已经修复这个BUG了。 Allegro封装生成器0.04生成do-27封装不正确,生成封装的焊盘的位号为a,c.应该是A,B或者1,2才对. 呵呵，DIODE通常管脚名为AC(A = anode, C = cathode) 也有用AK 或 12的， 极少见AB。 除了DIODE和极个别插件以及BGA外，焊盘名字以数字为主, 下次我给DIODE一个选择项，可以选择AC 或 12 或 AK, 至于TRANSISTER我就不去区分BCE/CBE/ECB/EBC/GDS/GSD/DSG/DGS/SGD/SDG等了，这样会没完没了的，我将对TRANSISTER强制统一以数字编号了，如果用家非要改变，只得在生成库后手工修改。
标签： Footprint Maker 0.08 FPM skill
上传时间： 2018-01-10
上传用户：digitzing
DESCRIPTION The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 μs. The MSP430G2x13 and MSP430G2x53 series are ultra-low-power mixed signal microcontrollers with built-in 16- bit timers, up to 24 I/O capacitive-touch enabled pins, a versatile analog comparator, and built-in communication capability using the universal serial communication interface. In addition the MSP430G2x53 family members have a 10-bit analog-to-digital (A/D) converter. For configuration details see Table 1. Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system.
上传时间： 2018-12-25
上传用户：ygyh
The SP2526A device is a dual +3.0V to +5.5V USB Supervisory Power Control Switch ideal for self-powered and bus-powered Universal Serial Bus (USB) applications. Each switch has low on-resistance (110mΩ typical) and can supply 500mA minimum. The fault currents are limited to 1.0A typical and the flag output pin for each switch is available to indicate fault conditions to the USB controller. The thermal shutdown feature will prevent damage to the device when subjected to excessive current loads. The undervoltage lockout feature will ensure that the device will remain off unless there is a valid input voltage present.
标签： High-Side Switch Power Dual USB
上传时间： 2019-03-06
上传用户：bhitr
AEC-Q100 qualified • 12 V and 24 V battery systems compliance • 3.3 V and 5 V logic compatible I/O • 8-channel configurable MOSFET pre-driver – High-side (N-channel and P-channel MOS) – Low-side (N-channel MOS) – H-bridge (up to 2 H-bridge) – Peak & Hold (2 loads) • Operating battery supply voltage 3.8 V to 36 V • Operating VDD supply voltage 4.5 V to 5.5 V • All device pins, except the ground pins, withstand at least 40 V • Programmable gate charge/discharge currents for improving EMI behavior
标签： configurable Automotive pre-driver suitable channel systems MOSFET fully High side
上传时间： 2019-03-27
上传用户：guaixiaolong
Duringthe past years, there has been a quickly rising interest in radio access technologies for providing mobile as well as nomadic and fixed services for voice, video, and data. This proves that the difference in design, implementation, and use between telecom and datacom technologies is also becoming more blurred. What used to be a mobile phone used for voice communication is today increasingly becoming the main data communication device for end-users, providing web browsing, social networking, and many other services.
标签： LTELTE-Advanced 4G
上传时间： 2020-05-26
上传用户：shancjb
The continued reduction of integrated circuit feature sizes and commensurate improvements in device performance are fueling the progress to higher functionality and new application areas. For example, over the last 15 years, the performance of microprocessors has increased 1000 times. Analog circuit performance has also improved, albeit at a slower pace. For example, over the same period the speed/resolution figure-of-merit of analog-to-digital converters improved by only a factor 10.
标签： Digitally Assisted Pipeline ADCs
上传时间： 2020-05-27
上传用户：shancjb
Currently, the information and communications technology (ICT) industry sector accounts for about 2–6% of the energy consumption worldwide, and a significant por- tion of this is contributed by the wireless and mobile communications industry. With the proliferation of wireless data applications, wireless technology continues to increase worldwide at an unprecedented growth rate. This has resulted in an increased number of installed base stations and higher demand on power grids and device power usage, causing an increased carbon footprint worldwide.
标签： Communication Networks Green Radio
上传时间： 2020-05-27
上传用户：shancjb
With the rapid growth in the number of wireless applications, services and devices, using a single wireless technology such as a second generation (2G) and third gener- ation (3G) wireless system would not be efficient to deliver high speed data rate and quality-of-service (QoS) support to mobile users in a seamless way. The next genera- tion wireless systems (also sometimes referred to as Fourth generation (4G) systems) are being devised with the vision of heterogeneity in which a mobile user/device will be able to connect to multiple wireless networks (e.g., WLAN, cellular, WMAN) simultaneously.
标签： Heterogeneous Wireless Networks Access
上传时间： 2020-05-27
上传用户：shancjb
