In higher power applications to utilize the full line power and reduce line currentharmonics
标签： Pre-Regulator Interleaved Design Review
上传时间： 2013-06-04
上传用户：lepoke
CR6221 combines a dedicated current mode PWM controller with a high voltage power MOSFET. It is opti
上传时间： 2013-04-24
上传用户：brucewan
CR6228 combines a dedicated current mode PWM controller with a high voltage power MOSFET. It is opti
上传时间： 2013-05-17
上传用户：natopsi
The TW9910 is a multi-standard video decoder and encoder chip that is designed for multimedia applications. It uses the mixed-signal 1.8V CMOS technology to provide a low- power integrated solution.
上传时间： 2013-04-24
上传用户：金宜
■ High Performance, Low Power AVR® 8-Bit Microcontroller ■ Advanced RISC Architecture –120 Powerful Instructions – Most Single Clock Cycle Execution –32 x 8 General Purpose Working Registers –Fully Static Operation
标签： Atmel
上传时间： 2013-06-01
上传用户：tccc
C+Interfaces+and+Implementations\r\r\n这是C语言接口与实现一书的源码.-C+ Interfaces+ And+ Implementations This is t
标签： Implementations Interfaces and
上传时间： 2013-04-24
上传用户：博雅abcd
General Description The LM621 is a bipolar IC designed for commutation of brushless DC motors. The part is compatible with both three- and four-phase motors. It can directly drive the power switching devices used to drive the motor. The LM621 provides an adjustable dead-time circuit to eliminate ``shootthrough'' current spiking in the power switching circuitry. Operation is from a 5V supply, but output swings of up to 40V are accommodated. The part is packaged in an 18-pin, dual-in-line package.
上传时间： 2013-07-24
上传用户：sdq_123
PROTEL99SE软件识别POWER PCB的*.PCB软件。只要运行padsimporter.exe这个补丁即可自己完成安装。
上传时间： 2013-06-01
上传用户：yuanhong95
Design with Operational Amplifiers and Analog Integrated Circuits –3rd Edition Design wit
标签： Operational Amplifiers Integrated Circuits
上传时间： 2013-06-12
上传用户：tianjinfan
BGA布线指南 BGA CHIP PLACEMENT AND ROUTING RULE BGA是PCB上常用的组件，通常CPU、NORTH BRIDGE、SOUTH BRIDGE、AGP CHIP、CARD BUS CHIP…等，大多是以bga的型式包装，简言之，80﹪的高频信号及特殊信号将会由这类型的package内拉出。因此，如何处理BGA package的走线，对重要信号会有很大的影响。 通常环绕在BGA附近的小零件，依重要性为优先级可分为几类： 1. by pass。 2. clock终端RC电路。 3. damping（以串接电阻、排组型式出现；例如memory BUS信号） 4. EMI RC电路（以dampin、C、pull height型式出现；例如USB信号）。 5. 其它特殊电路（依不同的CHIP所加的特殊电路；例如CPU的感温电路）。 6. 40mil以下小电源电路组（以C、L、R等型式出现；此种电路常出现在AGP CHIP or含AGP功能之CHIP附近，透过R、L分隔出不同的电源组）。 7. pull low R、C。 8. 一般小电路组（以R、C、Q、U等型式出现；无走线要求）。 9. pull height R、RP。 中文DOC，共5页，图文并茂
上传时间： 2013-04-24
上传用户：cxy9698
