《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor...
This application note shows how a Xilinx CoolRunnerTM-II CPLD can be used as a simplelogi...
XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接 The I/Os in Xilinx® 7 series FPGAs ar...
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between...
解压密码:www.elecfans.com 随着微电子技术的迅速发展以及集成电路规模不断提高,对电路性能的设计 要求越来越严格,这势必对用于大规模集成电路设计的EDA 工具提出越来越高的 要求...
This document provides practical, common guidelines for incorporating PCI Express interconnect layou...
Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when ...
A collection of interface applications between various microprocessors/ controllers and the LTC109...
利用EZ-USB接口芯片AN2131Q实现了基于TMS320C5409的水声信号采集及混沌特性研究系统中的高速数据通信,提出了一种采用FIFO缓存芯片实现AN2131Q与TMS320C5409的连接方...
Tug of War(A tug of war is to be arranged at the local office picnic. For the tug of war, the picnic...