第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
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电路板布局………………………………………42.1 电源和地…………………………………………………………………….42.1.1 感抗……………………………………………………………………42.1.2 两层板和四层板………………………………………………………42.1.3 单层板和二层板设计中的微处理器地……………………………….42.1.4 信号返回地……………………………………………………………52.1.5 模拟数字和高压…………………………………………………….52.1.6 模拟电源引脚和模拟参考电压……………………………………….52.1.7 四层板中电源平面因该怎么做和不应该怎么做…………………….52.2 两层板中的电源分配……………………………………………………….62.2.1 单点和多点分配……………………………………………………….62.2.2 星型分配………………………………………………………………62.2.3 格栅化地……………………………………………………………….72.2.4 旁路和铁氧体磁珠……………………………………………………92.2.5 使噪声靠近磁珠……………………………………………………..102.3 电路板分区………………………………112.4 信号线……………………………………………………………………...122.4.1 容性和感性串扰……………………………………………………...122.4.2 天线因素和长度规则………………………………………………...122.4.3 串联终端传输线…………………………………………………..132.4.4 输入阻抗匹配………………………………………………………...132.5 电缆和接插件……………………………………………………………...132.5.1 差模和共模噪声……………………………………………………...142.5.2 串扰模型……………………………………………………………..142.5.3 返回线路数目……………………………………..142.5.4 对板外信号I/O的建议………………………………………………142.5.5 隔离噪声和静电放电ESD ……………………………………….142.6 其他布局问题……………………………………………………………...142.6.1 汽车和用户应用带键盘和显示器的前端面板印刷电路板………...152.6.2 易感性布局…………………………………………………………...15
上传时间： 2013-10-19
上传用户：HGH77P99
减小电磁干扰的印刷电路板设计原则 内 容 摘要……1 1 背景…1 1.1 射频源.1 1.2 表面贴装芯片和通孔元器件.1 1.3 静态引脚活动引脚和输入.1 1.4 基本回路……..2 1.4.1 回路和偶极子的对称性3 1.5 差模和共模…..3 2 电路板布局…4 2.1 电源和地…….4 2.1.1 感抗……4 2.1.2 两层板和四层板4 2.1.3 单层板和二层板设计中的微处理器地.4 2.1.4 信号返回地……5 2.1.5 模拟数字和高压…….5 2.1.6 模拟电源引脚和模拟参考电压.5 2.1.7 四层板中电源平面因该怎么做和不应该怎么做…….5 2.2 两层板中的电源分配.6 2.2.1 单点和多点分配.6 2.2.2 星型分配6 2.2.3 格栅化地.7 2.2.4 旁路和铁氧体磁珠……9 2.2.5 使噪声靠近磁珠……..10 2.3 电路板分区…11 2.4 信号线……...12 2.4.1 容性和感性串扰……...12 2.4.2 天线因素和长度规则...12 2.4.3 串联终端传输线…..13 2.4.4 输入阻抗匹配...13 2.5 电缆和接插件……...13 2.5.1 差模和共模噪声……...14 2.5.2 串扰模型……..14 2.5.3 返回线路数目..14 2.5.4 对板外信号I/O的建议14 2.5.5 隔离噪声和静电放电ESD .14 2.6 其他布局问题……...14 2.6.1 汽车和用户应用带键盘和显示器的前端面板印刷电路板...15 2.6.2 易感性布局…...15 3 屏蔽..16 3.1 工作原理…...16 3.2 屏蔽接地…...16 3.3 电缆和屏蔽旁路………………..16 4 总结…………………………………………17 5 参考文献………………………17
上传时间： 2013-10-22
上传用户：a6697238
西门子建筑电器-电气安装技术部发行的各类产品样本：小型断路器、剩余电流保护断路器和模数化产品(中/ 英文)Miniature Circuit-Breakers, Residual Current Operated Circuit-Breakers and Modular Devices (Chinese/English)低压熔断器系统(中/ 英文)Fuse System (Chinese/English)雷击，过电压－不再是问题(中文)Thunderstorms - no problem (Chinese)西门子建筑电器目录(中文)Electrical Installation Technology Catalog (Chinese)终端配电保护产品(中文)5 IN 1 (Chinese)SIKUS 和 STAB UNIVERSAL 目录(中文)SIKUS and STAB UNIVERSAL Catalogue (Chinese)SIKUS HC 目录(中文)SIKUS HC Catalogue (Chinese)SentronTM 母线槽 (中文)SentronTM Busway System (Chinese)SentronTM 母线槽系统快速选型 (准备中) (中文)SentronTM Busway System quick selection (in preparing) (Chinese)建筑低压配电一体化解决方案－住宅小区应用(中文)Building LV PD Solution (Chinese)西门子 DELTA vista“远景”系列开关和插座价目表(中文)Delta vista Switch and Socket Pricelist (Chinese)instabus EIB 面向未来的楼宇智能控制系统(中文)instabus EIB (Chinese)instabus EIB 面向未来的楼宇智能控制系统技术手册 (准备中) (中文)instabus EIB technical handbook (in preparing) (Chinese)西门子电气安装技术业绩卓越(中/ 英文)ET Reference Manual (Chinese/English)
上传时间： 2013-11-23
上传用户：瓦力瓦力hong
这是一个字母或数制之间的转化程序，5为主模块，调用模块1和模块7模块1又调用模块2、3、4和6四个模块，其中： 模块2实现小写字母向大写字母的转换 模块3实现大写字母向小写字母的转换 模块4实现二进制数向十六进制数的转换 模块6实现十六进制数向二进制数的转换 模块7实现十六进制数向十进制数的转换按“q”键退出。使用时，需将7个文件分别汇编，连接的方法为：5＋1＋2＋3＋4＋6＋7生成可执行文件“5” 即可运行。
上传时间： 2015-02-27
上传用户：hn891122
I. Introduction This code exploits a previously undisclosed vulnerability in the bit string decoding code in the Microsoft ASN.1 library. This vulnerability is not related to the bit string vulnerability described in eEye advisory AD20040210-2. Both vulnerabilities were fixed in the MS04-007 patch. II. Screenshots $ ./kill-bill.pl . kill-bill : Microsoft ASN.1 remote exploit for CAN-2003-0818 (MS04-007) by Solar Eclipse <solareclipse@phreedom.org> Usage: kill-bill -p <port> -s <service> host Services: iis IIS HTTP server (port 80) iis-ssl IIS HTTP server with SSL (port 443) exchange Microsoft Exchange SMTP server (port 25) smb-nbt SMB over NetBIOS (port 139) smb SMB (port 445) If a service is running on its default port you don t have to specify both the service and the port. Examples: kill-bill -s iis 192.168.0.1 kill-bill -p 80 192.168.0.1 kill-bill -p 1234 -s smb 192.168.0.1
标签： I. vulnerability Introduction undisclosed
上传时间： 2015-05-15
上传用户：xhz1993
数字运算，判断一个数是否接近素数 A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no
上传时间： 2015-05-21
上传用户：daguda
源代码\用动态规划算法计算序列关系个数 用关系"<"和"="将3个数a，b，c依次序排列时，有13种不同的序列关系： a=b=c,a=b<c,a<b=v,a<b<c,a<c<b a=c<b,b<a=c,b<a<c,b<c<a,b=c<a c<a=b,c<a<b,c<b<a 若要将n个数依序列，设计一个动态规划算法，计算出有多少种不同的序列关系， 要求算法只占用O(n),只耗时O(n*n).
上传时间： 2013-12-26
上传用户：siguazgb
这是一个字母或数制之间的转化程序，5为主模块，调用模块1和模块7 模块1又调用模块2、3、4和6四个模块，其中： 模块2实现小写字母向大写字母的转换 模块3实现大写字母向小写字母的转换 模块4实现二进制数向十六进制数的转换 模块6实现十六进制数向二进制数的转换 模块7实现十六进制数向十进制数的转换 按“q”键退出。 使用时，需将7个文件分别汇编，连接的方法为： 5＋1＋2＋3＋4＋6＋7 生成可执行文件“5” 即可运行。
上传时间： 2015-06-14
上传用户：许小华
空时正交编码源程序，参考文献： V.Tarokh,H. Jafarkhani,and A. R. Calderbank "Space-Time Codes from ％Orthogonal Designs",IEEE Trans. Inform. Theory VOL. 45,NO. 5,JULY 1
上传时间： 2013-12-26
上传用户：fandeshun
