70种电子元器件、芯片封装类型.pdf
上传时间： 2022-04-21
上传用户：jason_vip1
这个封装库比较杂，包含除电阻电容电感以外的，我们常用的一些电子元器件。电池：CR1220和CR2032;贴片磁珠；整流桥:种类很齐全；保险管：贴片和直插均有；晶振：直插HC49、2*6、3*8等圆柱形，贴片0705等40种规格晶振；继电器：包括欧姆龙和松下一些常用的型号的继电器共36种，这个很难得的；变压器：EI35RJ11和RJ45网口；sd卡座；USB座：A,B,C型都有；拨码开关和按键：共90多种封装形式；
上传时间： 2022-04-25
上传用户：canderile
STM32 F1系列 MCU ATIUM AD集成库 原理图库 PCB 3D封装库文件,STM32F1XXXXX全系列原理图+PCB封装库文件，共209个器件型号，CSV text has been written to file : STM32 F1.csvLibrary Component Count : 209Name Description----------------------------------------------------------------------------------------------------STM32F100C4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C4T7B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100C6T7B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100CBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100CBT7B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100R4H6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R4T6BTR STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100R6H6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R6T6 STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100R8H6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RBH6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100RBH6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100RBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RBT6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RCT6B STM32 ARM-based 32-bit MCU Value Line with 256 kB Flash, 24 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6 STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6B STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6 STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6B STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-
上传时间： 2022-04-30
上传用户：jiabin
STM8L全系列MCU AD ALTIUM 集成库 原理图库 PCB封装库文件-79个芯片器件型号列表：Library Component Count : 79Name Description----------------------------------------------------------------------------------------------------STM8L101F2P3 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F2P6 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F2P6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, Tape and ReelSTM8L101F2U6A STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tube, COMP_REF availableSTM8L101F2U6ATR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and Reel, COMP_REF availableSTM8L101F2U6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and ReelSTM8L101F3P3 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +125癈 Temperature, 20-pin TSSOP, TubeSTM8L101F3P6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F3U6ATR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and Reel, COMP_REF availableSTM8L101F3U6TR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and ReelSTM8L101G2U6 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, TraySTM8L101G2U6A STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tray, COMP_REF availableSTM8L101G2U6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tape and ReelSTM8L101G3U6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, TraySTM8L101G3U6A STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tray, COMP_REF availableSTM8L101K3T3 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +125癈 Temperature, 32-pin LQFP, TraySTM8L101K3T6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin LQFP, TraySTM8L101K3U6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin UFQFPN, TraySTM8L101K3U6TR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin UFQFPN, Tape and ReelSTM8L151C4T3 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6BGT STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6TR STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, Tape and ReelSTM8L151C4U6 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM8L151C6T3 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C6T6 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C6U6 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM8L151C8 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, 48-pin LQFPSTM8L151C8T3 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C8T3TR STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, Tape and ReelSTM8L151C8T6 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C8T7 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +105癈 Temperature, 48-pin LQFP, TraySTM8L151C8U6 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +85癈
上传时间： 2022-05-02
上传用户：bluedrops
表贴插装晶振、晶体Altium封装 AD封装库 2D+3D PCB封装库-6MB,Altium Designer设计的PCB封装库文件，集成2D和3D封装，可直接应用的到你的产品设计中。PCB库封装列表：CB Library : 晶振、晶体.PcbLibDate : 2020/6/8Time : 7:42:40Component Count : 38Component Name-----------------------------------------------OSC 455E-LIOSC 455E-WIOSC 1612-4POSC 2025-4POSC 3215-2POSC 3225-4POSC 4025-4POSC 5032-2POSC 5032-4POSC 6035-2POSC 6035-4POSC 7050-2POSC 7050-4POSC 8045-2POSC 8045-4POSC 8045-4P-COSC HC-49SOSC HC-49SMDOSC HC-49UOSC MC-146OSC MC-156OSC MC-306OSC MC-405OSC MC-406OSC UM-1OSC UM-5OSC-2x6-LIOSC-2x6-WI-AOSC-2x6-WI-BOSC-2x6-WSOSC-3x8-LIOSC-3x8-WI-AOSC-3x8-WI-BOSC-3x8-WSOSC-3x10-LIOSC-3x10-WI-AOSC-3x10-WI-BOSC-3x10-WS
标签： altium designer
上传时间： 2022-05-04
上传用户：canderile
j1939 附录a附录b
标签： j1939
上传时间： 2022-06-09
上传用户：
描述了NTC使用B值计算出实际温度与输出的电压之间的关系。
标签： ntc计算
上传时间： 2022-06-15
上传用户：
BC20-TE-B NB-Iot 评估板评估板原厂原理图V1.2。完整对应实物装置。
上传时间： 2022-06-17
上传用户：
本文以质量管理理论为基础，针对手机芯片封装行业过于繁琐的海量质量数据，建立以数据挖掘技术为基础的质量管理系统，通过对手机芯片封装质量数据的采集、分析和处理，对手机芯片的质量缺陷和不合格产品进行分析和统计，诊断造成产品不合格的原因。本文首先回顾了国内外关于质量管理的发展历程及最新趋势，并对手机芯片封装质量管理进行了综述。在对数据挖掘、合格率管理等方面进行深入分析探讨的基础上，提出了手机芯片封装质量管理系统的设计目标、设计思路和功能模块。本文的研究工作主要有以下几个方面：1、对手机芯片封装的制造过程、系统模式进行了分析，着重研究了合格率管理和数据挖掘在手机芯片封装中的应用；2、运用数据挖掘的方法，针对影响芯片封装质量的多个相关因素，进行各因素的权重判定，确定哪些因素是影响质量的关键因素，针对影响质量的关键因素，通过对低合格率数据的提取与分析，定位封装过程中可能造成不合格产品的关键点，为质量改善提供依据：3、搜集W公司2006年5月到8月的手机芯片封装测试数据，进行实证研究，验证了所提出的研究方法的准确性。
上传时间： 2022-06-21
上传用户：
本文大致可划分为四大部分。首先简单探讨LED，其次重点论述LED封装技术，然后简单介绍LED相关术语、LED相关工具，最后总结。经过对大量文献的阅读分析论证，LED封装技术主要涉及到封装设计、封装材料、封装设备、封装过程、封装工艺五大方面。封装设计是先导，封装材料是基础，封装设备是关键，封装过程是支柱，封装工艺是核心。封装过程大致可分为固品、焊线、灌胶、测试、分光五个阶段。封装工艺，主要体现为生产过程中的各个阶段各个环节各个步骤的技术要领和注意事项，在LED封装生产中至关重要，否则即使芯片质量好、辅材匹配好、设备精度高、封装设计优，若工艺不正确或品控不严格，最终也会影响LED封装产品的合格率、可靠性、热学特性及光学特性等。总之，合格的工艺能保证LED器件的质量，改进的工艺能降低LED器件的成本，先进的工艺能提高LED器件的性能。因此，本文重点在于对LED封装工艺进行分析和综合，简单介绍了封装设计，封装材料、封装设备、封装过程，详细地说明了封装工艺，总结了LED封装工艺的技术要领、注意事项，明确了LED封装有哪些工序、流程、制程、过程、环节，每个工序用什么材料，材料怎么检查怎么仓储怎么使用，用什么工具，工具怎么使用，操作步骤顺序和方法是怎样的，操作中要注意哪些事项，执行要达到什么标准，还分析了死灯的原因，介绍了LED封装生产过程中的静电防护措施。
标签： led
上传时间： 2022-06-26
上传用户：zhaiyawei
