圆曲线坐标计算程序_软件工具【基本介绍】 可计算圆曲线带有缓和曲线中、边桩坐标及切线方位角。 1、本软件可计算圆曲线带有缓和曲线中、边桩坐标及切线方位角，若只需计算圆曲线则缓和曲线输入0即可。 2、附有正算、反算功能，正算：通过里程和偏距计算坐标，反算：通过坐标反推里程和偏距。 3、数据输入：曲线转角α和计算方位角F按d.ms格式输入，如：-14°18ˊ10″则为：-14.1810，选择“连续计算”时偏距和偏角同单点计算一致。 4、具有数据导入、导出功能，可把已知数据输入在文本文档中进行导入，导出则是把已经输入好的数据导出到指定位置。 5、数据处理完毕后点击“保存数据”可进行保存曲线五大桩、曲线参数表，连续计算模式“保存数据”可导出计算成果。
上传时间： 2013-10-21
上传用户：几何公差
pcb抄板过程中反推原理图的方法.docpcb抄板过程中反推原理图的方法.doc
上传时间： 2013-11-05
上传用户：lbbyxmoran
在对一块完好的PCB电路板进行原理图的逆向设计时，合理划分功能区域能够帮工程师减少一些不必要的麻烦，提高绘制的效率。一般而言，一块PCB板上功能相同的元器件会集中布置，以功能划分区域可以在反推原理图时有方便准确的依据。
上传时间： 2014-01-02
上传用户：whymatalab
针对嵌入式机器视觉系统向独立化、智能化发展的要求，介绍了一种嵌入式视觉系统--智能相机。基于对智能相机体系结构、组成模块和图像采集、传输和处理技术的分析，对国内外的几款智能相机进行比较。综合技术发展现状，提出基于FPGA+DSP模式的硬件平台，并提出智能相机的发展方向。分析结果表明，该系统设计可以实现脱离PC运行，完成图像获取与分析，并作出相应输出。 Abstract: This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP models and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
上传时间： 2013-11-14
上传用户：无聊来刷下
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
上传用户：aa7821634
Micro_SD_卡(TF卡)_spi_模式实现方法
上传时间： 2014-03-19
上传用户：bvdragon
一个反汇编程序源码
上传时间： 2013-12-09
上传用户：cursor
一个j2ee的mvc模式的实现文档及代码
上传时间： 2014-01-11
上传用户：虫虫虫虫虫虫
反病毒引擎设计
上传时间： 2013-12-25
上传用户：水中浮云
23种java设计模式
上传时间： 2014-01-30
上传用户：chfanjiang
