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Linux/Unix编程 ecos time patch file (/home/jacmet/ecos.orig/packages/isoinfra/current/include/sys/time.h)
ecos time patch file (/home/jacmet/ecos.orig/packages/isoinfra/current/include/sys/time.h)
其他嵌入式/单片机内容 AT91SAM7SE512 Boundary-Scan Description files (BSD)for LQFP 128 and LFBGA 144 packages.
AT91SAM7SE512 Boundary-Scan Description files (BSD)for LQFP 128 and LFBGA 144 packages.
微处理器开发 三星ARM9 CPU S3C2410 底层开发驱动包-Samsung ARM9 CPU bottom S3C2410 development drive packages
三星ARM9 CPU S3C2410 底层开发驱动包-Samsung ARM9 CPU bottom S3C2410 development drive packages
Linux/Unix编程 目录 第1章 介绍 第2章 安装 FreeBSD 第3章 UNIX 基础 第4章 安装应用程序: Packages 和 Ports 第5章 X Window 系统
目录
第1章 介绍
第2章 安装 FreeBSD
第3章 UNIX 基础
第4章 安装应用程序: Packages 和 Ports
第5章 X Window 系统
SQL Server SQL Server developers and administrators are no strangers to Data Transformation Services (DTS) pack
SQL Server developers and administrators are no strangers to Data Transformation Services (DTS) packages. They likely develop DTS packages to perform everything from simple database operations to data aggregation. As such, when they upgrade some or all of their servers to SQL Server 2005, they must ...
技术资料 Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma
教程资料 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
可编程逻辑 《器件封装用户向导》赛灵思产品封装资料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes a ...
行业应用文档 l298电机芯片驱动原理 (DUAL FULL-BRIDGE DRIVER)
The L298 is an integratedmonolithic circuit in a 15- lead Multiwatt and PowerSO20 packages. It is a
技术资料 l298电机芯片驱动原理 (DUAL FULL-BRIDGE DRIVER)
The L298 is an integratedmonolithic circuit in a 15- lead Multiwatt and PowerSO20 packages. It is a