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电源技术 AMS1117资料
Part Number Iout(A) Vin (Recommended) Vout(V) Dropout(V) Package Operating Temp(°C) AMS1117 1 ≦15 1.2 1.5 1.8 2.5 3.3 5 Adj 2.85 ≦1.3 SOT-223 /TO-252 -20~125
医药行业 While resting-state fMRI is drawing more and more attention, there has not been a software for its d
While resting-state fMRI is drawing more and more attention, there has not been a software for its data analysis. Based on MATLAB, we developed a package named REST. Currently REST has three main functions: function connectivity, ReHo and ALFF.
技术资料 EL357N(C)(光耦 资料
EL357N(C)光耦 资料The EL357N-G series contains an infrared emitting diode, optically coupled to a phototransistor detector. The devices in a 4-pin small outline SMD package
GPS编程 Welcome to MS4W, the no fuss installer for setting up MapServer on Microsoft Windows platforms. The
Welcome to MS4W, the no fuss installer for setting up MapServer on Microsoft Windows platforms. The purpose of this package is to allow all levels of MapServer users to quickly install a working environment for MapServer development on Windows. It is also an environment for packaging and distributin ...
其他书籍 Oracle PL/SQL Best Practices is a concise, easy-to-use summary of best practices in the program dev
Oracle PL/SQL Best Practices is a concise, easy-to-use summary of best
practices in the program development process. It covers coding style,
writing SQL in PL/SQL, data structures, control structures, exception
handling, program and package construction, and built-in packages.
多媒体处理 语音识别方面的开发包
·详细说明：语音识别方面的开发包，有助于设计HMM，NN和VQ。它是开放源码的。- The speech recognition aspect development package, is helpful to designs HMM, NN and VQ. It opens the source code.
数学计算 基于核的学习方法SVM(Support Vector Machine)有很好的分类识别性能
基于核的学习方法SVM(Support Vector Machine)有很好的分类识别性能，这是在SVM的基础上改进的一个更好的SKM(Support Kernel Machine)Package.
技术资料 语音识别方面的开发包
·详细说明：语音识别方面的开发包，有助于设计HMM，NN和VQ。它是开放源码的。- The speech recognition aspect development package, is helpful to designs HMM, NN and VQ. It opens the source code.
技术资料 LQFP,TQFP,QFP,CQFP封装尺寸表
Low Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint). LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-produc ...
多媒体处理 GSM的编解码C源码(使用Intel的IPP包)堪称效率最高
·详细说明：GSM的编解码C源码(使用Intel的IPP包)堪称效率最高。-GSM arranges decodes the c source code (to use intel the ipp package) to may be called the efficiency to be highest文件列表: GSMAMR ......\api ...