PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
when技术资料
📦 资源总数：409
📄 技术文档：1
💻 源代码：60246
🔌 电路图：2
📚 when全部资料 (409个)
远程配置Nios II处理器应用笔记
通过以太网远程配置Nios II 处理器 应用笔记 Firmware in embedded hardware systems is frequent...
XAPP444 - CPLD配件,技巧和窍门
Most designers wish to utilize as much of a device as possible in order to enhance the overallprod...
XAPP708 -133MHz PCI-X到128MB DDR小型DIMM存储器桥
The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplif...
Creating Safe State Machines(Mentor)
Finite state machines are widely used in digital circuit designs. Generally, when designi...
计算FR4上的差分阻抗(PDF)
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between...
高精度温度测量铂电阻温度探测器(PRTDs)和ADC
Abstract: Many modern industrial, medical, and commercial applications require temperature measure...
智能照明控制器测量环境光线
Abstract: This application note explains how to design an intelligent lighting controller that sen...
能量收集系统的设计挑战
Modern electronic systems solve so many difficult problems that they often seem like magic. Noneth...
谈集成电路的通用接口
Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when ...