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vicor公司电源设计资料->VI BRICK THERMAL MANAGEMENT.pdf
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THERMAL DESIGN OF POWER MOSFETS OPERATING IN PARALLEL The objective of this paper is the
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Thermal resistance values for Cyclone III devices are provided for a boardmeeting JEDEC s
电子书籍
Thermal Characterization of Packaged Semiconductor Devices:With the continuing industry trends towar
电子书籍
Thermal Considerations:Thermal management is an important part of the system design process. The sup
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Thermal transient characterization methodology for single-die and stacked structures:High-power semi
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Abstract: This application note will give a brief introduction to thermal theory and general layout
电子书籍
Thermal characteristics of integrated circuitpackages have been and increasingly will bea ma
电子书籍
Simplified Approach for Predicting Dynamic Thermal Behavior of Switching Electronic Devices:Abstract