surface
共 90 篇文章
surface 相关的电子技术资料，包括技术文档、应用笔记、电路设计、代码示例等，共 90 篇文章，持续更新中。
基于FPGA的高度集成DCDC稳压器
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In a recent discussion with a system designer, the requirementfor his power supply was to regulate 1.5Vand deliver up to 40A of current to a load that consistedof four FPGAs. Th
多层印制板设计基本要领
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。<BR>【关键词】印制电路板；表面贴装器件；高密度互连；通孔<BR>【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via<BR>一．概述<BR>印制板（PCB－P
VGA 8:1 multiplexer reference
This reference design (RD) features a fully<BR>assembled and tested surface-mount printed circuit<BR>board (PCB). The RD board utilizes the MAX4885<BR>1:2 or 2:1 multiplexer and other ICs to implement
LTM4601 DC/DC微型模块性能
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The LTM4601 DC/DC μModule regulator is a completehigh power density stepdown regulator for up to 12Acontinuous (14A peak) loads. The device is housed ina small 15mm ¥ 15m
计算FR4上的差分阻抗(PDF)
<P>Calculation of the Differential Impedance of Tracks on FR4 substrates</P>
<P>There is a discrepancy between calculated and measured values of impedance for differential transmission lines<BR>on FR4
贴片胶与滴胶工艺
表面贴片胶(SMA,surface mount adhesives)用于波峰焊接和回流焊接，以保持组件在印刷电路<BR>板(PCB)上的位置，确保在装配线上传送过程中组件不会丢失。<BR>PCB装配中使用的大多数表面贴片胶(SMA)都是环氧树脂(epoxies)，虽然还有聚丙烯(acrylics)用于特殊的用途。在高速滴胶系统引入和电子工业掌握如何处理货架寿命相对较短的产品之后，环氧树脂已成为世界
LTM4600 DCDC微型模块热性能
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The LTM4600 DC/DC μModule regulator is a complete highpower density stepdown regulator for 10A continuous (14Apeak) loads. The device has two voltage options: 20VINmaximum fo
使用新电源模块改进表面贴装可制造性
The latest generation of Texas Instruments (TI) boardmounted<BR>power modules utilizes a pin interconnect technology<BR>that improves surface-mount manufacturability.<BR>These modules are produced as
SMT生产线贴片机负荷均衡优化
摘要：采用表面组装技术（surface mountt echnology,SMT）进行印制板级电子电路组装是当代组装技术发展的主流。典型的SMT生产线是由高速机和多功能机串联而成，印制电路板（printed circuit board,PCB）上的元器件在贴片机之间的负荷均衡优化问题是SMT生产调度的关键问题。以使贴片时间与更换吸嘴时间之和最大的工作台生产时间最小化为目标构建了负荷均衡模型，开发了
多层印制板设计基本要领
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。<BR>【关键词】印制电路板；表面贴装器件；高密度互连；通孔<BR>【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via<BR>一．概述<BR>印制板（PCB－P